DE50214670D1 - Plattenträger - Google Patents

Plattenträger

Info

Publication number
DE50214670D1
DE50214670D1 DE50214670T DE50214670T DE50214670D1 DE 50214670 D1 DE50214670 D1 DE 50214670D1 DE 50214670 T DE50214670 T DE 50214670T DE 50214670 T DE50214670 T DE 50214670T DE 50214670 D1 DE50214670 D1 DE 50214670D1
Authority
DE
Germany
Prior art keywords
plate carrier
support
seating surface
disk
independent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50214670T
Other languages
English (en)
Inventor
Stephan Voser
Martin Dubs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oerlikon Surface Solutions AG Pfaeffikon
Original Assignee
Oerlikon Trading AG Truebbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading AG Truebbach filed Critical Oerlikon Trading AG Truebbach
Application granted granted Critical
Publication of DE50214670D1 publication Critical patent/DE50214670D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
DE50214670T 2001-10-23 2002-10-07 Plattenträger Expired - Lifetime DE50214670D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH19452001 2001-10-23

Publications (1)

Publication Number Publication Date
DE50214670D1 true DE50214670D1 (de) 2010-11-04

Family

ID=4566866

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50214670T Expired - Lifetime DE50214670D1 (de) 2001-10-23 2002-10-07 Plattenträger

Country Status (6)

Country Link
US (1) US6802942B2 (de)
EP (1) EP1306463B1 (de)
JP (1) JP4349786B2 (de)
AT (1) ATE482300T1 (de)
DE (1) DE50214670D1 (de)
TW (1) TWI282997B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2871614B1 (fr) * 2004-06-10 2007-01-12 Commissariat Energie Atomique Procede de realisation d'un support d'enregistrement optique a plusieurs etages et support obtenu
US20060274474A1 (en) * 2005-06-01 2006-12-07 Lee Chung J Substrate Holder
DE602006009953D1 (de) * 2006-11-15 2009-12-03 Ods Technology Gmbh EcoDisc
DE102011078679B4 (de) 2011-07-05 2015-10-01 Von Ardenne Gmbh Substrathalter für eine Substratbehandlungsvorrichtung
TWI541928B (zh) * 2011-10-14 2016-07-11 晶元光電股份有限公司 晶圓載具
CN104409402B (zh) * 2014-12-30 2018-06-19 厦门市三安光电科技有限公司 用于led外延晶圆制程的石墨承载盘

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4615755A (en) 1985-08-07 1986-10-07 The Perkin-Elmer Corporation Wafer cooling and temperature control for a plasma etching system
KR970003885B1 (ko) * 1987-12-25 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 에칭 방법 및 그 장치
DE4307382A1 (de) * 1993-03-09 1994-09-15 Leybold Ag Maske zum Abdecken des radial äußeren Bereichs einer scheibenförmigen Substratoberfläche
JPH11350133A (ja) * 1998-06-12 1999-12-21 Matsushita Electric Ind Co Ltd ディスク盤の製造方法および基板ホルダ

Also Published As

Publication number Publication date
JP4349786B2 (ja) 2009-10-21
US6802942B2 (en) 2004-10-12
ATE482300T1 (de) 2010-10-15
US20030075434A1 (en) 2003-04-24
TWI282997B (en) 2007-06-21
JP2003213413A (ja) 2003-07-30
EP1306463A1 (de) 2003-05-02
EP1306463B1 (de) 2010-09-22

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