DE58909880D1 - Vakuumanlage - Google Patents
VakuumanlageInfo
- Publication number
- DE58909880D1 DE58909880D1 DE58909880T DE58909880T DE58909880D1 DE 58909880 D1 DE58909880 D1 DE 58909880D1 DE 58909880 T DE58909880 T DE 58909880T DE 58909880 T DE58909880 T DE 58909880T DE 58909880 D1 DE58909880 D1 DE 58909880D1
- Authority
- DE
- Germany
- Prior art keywords
- chamber
- workpieces
- chambers
- transfer mechanism
- distributor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH195188 | 1988-05-24 | ||
CH272288 | 1988-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE58909880D1 true DE58909880D1 (de) | 2001-12-20 |
Family
ID=25689081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE58909880T Expired - Lifetime DE58909880D1 (de) | 1988-05-24 | 1989-05-19 | Vakuumanlage |
Country Status (6)
Country | Link |
---|---|
US (2) | US4990047A (de) |
EP (1) | EP0343530B1 (de) |
JP (4) | JP3121602B2 (de) |
AT (1) | ATE208961T1 (de) |
DE (1) | DE58909880D1 (de) |
ES (1) | ES2163388T3 (de) |
Families Citing this family (101)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5484011A (en) * | 1986-12-19 | 1996-01-16 | Applied Materials, Inc. | Method of heating and cooling a wafer during semiconductor processing |
US5228501A (en) * | 1986-12-19 | 1993-07-20 | Applied Materials, Inc. | Physical vapor deposition clamping mechanism and heater/cooler |
ATE95949T1 (de) * | 1988-07-15 | 1993-10-15 | Balzers Hochvakuum | Haltevorrichtung fuer eine scheibe sowie anwendung derselben. |
US5098245A (en) * | 1989-02-24 | 1992-03-24 | U.S. Philips Corporation | High speed wafer handler |
DE3915038A1 (de) * | 1989-05-08 | 1990-11-22 | Balzers Hochvakuum | Halte- und transportvorrichtung fuer eine scheibe |
US5186594A (en) | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
US5094885A (en) * | 1990-10-12 | 1992-03-10 | Genus, Inc. | Differential pressure cvd chuck |
JPH0419081A (ja) * | 1990-05-15 | 1992-01-23 | Seiko Instr Inc | 真空内搬送ロボット |
EP0468409B1 (de) * | 1990-07-23 | 1995-10-04 | Dainippon Screen Mfg. Co., Ltd. | Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten |
JPH081923B2 (ja) * | 1991-06-24 | 1996-01-10 | ティーディーケイ株式会社 | クリーン搬送方法及び装置 |
JP3030667B2 (ja) * | 1991-07-29 | 2000-04-10 | 東京エレクトロン株式会社 | 搬送装置 |
JP3238432B2 (ja) * | 1991-08-27 | 2001-12-17 | 東芝機械株式会社 | マルチチャンバ型枚葉処理装置 |
US5658115A (en) * | 1991-09-05 | 1997-08-19 | Hitachi, Ltd. | Transfer apparatus |
JP2598353B2 (ja) * | 1991-12-04 | 1997-04-09 | アネルバ株式会社 | 基板処理装置、基板搬送装置及び基板交換方法 |
JPH0552808U (ja) * | 1991-12-24 | 1993-07-13 | 富士写真光機株式会社 | プロジェクタの投影レンズ |
JPH05218176A (ja) * | 1992-02-07 | 1993-08-27 | Tokyo Electron Tohoku Kk | 熱処理方法及び被処理体の移載方法 |
US5404894A (en) * | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
JPH0616206A (ja) * | 1992-07-03 | 1994-01-25 | Shinko Electric Co Ltd | クリーンルーム内搬送システム |
US5697749A (en) * | 1992-07-17 | 1997-12-16 | Tokyo Electron Kabushiki Kaisha | Wafer processing apparatus |
DE4235674C2 (de) * | 1992-10-22 | 2000-12-28 | Balzers Ag Liechtenstein | Kammer für den Transport von Werkstücken in Vakuumatmosphäre, Kammerkombination und Verfahren zum Transportieren eines Werkstückes |
KR100303075B1 (ko) | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 집적회로 웨이퍼 이송 방법 및 장치 |
KR100302012B1 (ko) * | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크 |
US6136168A (en) * | 1993-01-21 | 2000-10-24 | Tdk Corporation | Clean transfer method and apparatus therefor |
US5352294A (en) * | 1993-01-28 | 1994-10-04 | White John M | Alignment of a shadow frame and large flat substrates on a support |
JP3218488B2 (ja) * | 1993-03-16 | 2001-10-15 | 東京エレクトロン株式会社 | 処理装置 |
KR960009975B1 (ko) * | 1993-04-26 | 1996-07-25 | 한국베리안 주식회사 | 제2공간을 이용한 박막의 열처리 장치 |
US5538390A (en) * | 1993-10-29 | 1996-07-23 | Applied Materials, Inc. | Enclosure for load lock interface |
US5447431A (en) * | 1993-10-29 | 1995-09-05 | Brooks Automation, Inc. | Low-gas temperature stabilization system |
US5588827A (en) * | 1993-12-17 | 1996-12-31 | Brooks Automation Inc. | Passive gas substrate thermal conditioning apparatus and method |
JPH09506744A (ja) * | 1993-12-17 | 1997-06-30 | ブルックス オートメーション インコーポレイテッド | ウェハの加熱冷却装置 |
US5791895A (en) * | 1994-02-17 | 1998-08-11 | Novellus Systems, Inc. | Apparatus for thermal treatment of thin film wafer |
DE9407482U1 (de) * | 1994-05-05 | 1994-10-06 | Leybold Ag | Funktionseinrichtung für eine Vakuumanlage für die Behandlung von scheibenförmigen Werkstücken |
US5476549A (en) * | 1995-01-24 | 1995-12-19 | Cvd, Inc. | Process for an improved laminate of ZnSe and ZnS |
US5680502A (en) * | 1995-04-03 | 1997-10-21 | Varian Associates, Inc. | Thin film heat treatment apparatus with conductively heated table and surrounding radiation shield |
US6193506B1 (en) | 1995-05-24 | 2001-02-27 | Brooks Automation, Inc. | Apparatus and method for batch thermal conditioning of substrates |
KR100238998B1 (ko) * | 1995-07-26 | 2000-01-15 | 우치가사키 기이치로 | 가열로 |
US6053982A (en) | 1995-09-01 | 2000-04-25 | Asm America, Inc. | Wafer support system |
US6113702A (en) | 1995-09-01 | 2000-09-05 | Asm America, Inc. | Wafer support system |
US5881208A (en) * | 1995-12-20 | 1999-03-09 | Sematech, Inc. | Heater and temperature sensor array for rapid thermal processing thermal core |
US20020104206A1 (en) * | 1996-03-08 | 2002-08-08 | Mitsuhiro Hirano | Substrate processing apparatus |
US5863170A (en) * | 1996-04-16 | 1999-01-26 | Gasonics International | Modular process system |
US5855465A (en) * | 1996-04-16 | 1999-01-05 | Gasonics International | Semiconductor wafer processing carousel |
US6183565B1 (en) * | 1997-07-08 | 2001-02-06 | Asm International N.V | Method and apparatus for supporting a semiconductor wafer during processing |
US5789878A (en) * | 1996-07-15 | 1998-08-04 | Applied Materials, Inc. | Dual plane robot |
US6714832B1 (en) * | 1996-09-11 | 2004-03-30 | Hitachi, Ltd. | Operating method of vacuum processing system and vacuum processing system |
US5848670A (en) * | 1996-12-04 | 1998-12-15 | Applied Materials, Inc. | Lift pin guidance apparatus |
US6432203B1 (en) * | 1997-03-17 | 2002-08-13 | Applied Komatsu Technology, Inc. | Heated and cooled vacuum chamber shield |
US5879461A (en) * | 1997-04-21 | 1999-03-09 | Brooks Automation, Inc. | Metered gas control in a substrate processing apparatus |
US6034000A (en) * | 1997-07-28 | 2000-03-07 | Applied Materials, Inc. | Multiple loadlock system |
US6183186B1 (en) * | 1997-08-29 | 2001-02-06 | Daitron, Inc. | Wafer handling system and method |
JP3406488B2 (ja) * | 1997-09-05 | 2003-05-12 | 東京エレクトロン株式会社 | 真空処理装置 |
US6207006B1 (en) | 1997-09-18 | 2001-03-27 | Tokyo Electron Limited | Vacuum processing apparatus |
US6132165A (en) * | 1998-02-23 | 2000-10-17 | Applied Materials, Inc. | Single drive, dual plane robot |
US6000905A (en) * | 1998-03-13 | 1999-12-14 | Toro-Lira; Guillermo L. | High speed in-vacuum flat panel display handler |
US6045299A (en) * | 1998-04-13 | 2000-04-04 | International Business Machines Corp. | Unidirectional gate between interconnecting fluid transport regions |
US6149368A (en) * | 1998-06-12 | 2000-11-21 | Advanced Micro Devices, Inc. | Wafer disk pad having one or more wafer loading points to facilitate vacuum wand wafer loading and unloading |
US6183564B1 (en) * | 1998-11-12 | 2001-02-06 | Tokyo Electron Limited | Buffer chamber for integrating physical and chemical vapor deposition chambers together in a processing system |
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JP2000299367A (ja) * | 1999-04-15 | 2000-10-24 | Tokyo Electron Ltd | 処理装置及び被処理体の搬送方法 |
US6949143B1 (en) * | 1999-12-15 | 2005-09-27 | Applied Materials, Inc. | Dual substrate loadlock process equipment |
NL1013989C2 (nl) | 1999-12-29 | 2001-07-02 | Asm Int | Werkwijze en inrichting voor het behandelen van een wafer. |
US20010035403A1 (en) | 2000-05-18 | 2001-11-01 | Albert Wang | Method and structure for producing flat wafer chucks |
KR20070037517A (ko) * | 2000-09-15 | 2007-04-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 처리 장비용 더블 이중 슬롯 로드록 |
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JP2019537253A (ja) * | 2016-10-18 | 2019-12-19 | マットソン テクノロジー インコーポレイテッドMattson Technology, Inc. | 被加工物を処理するためのシステムおよび方法 |
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CN108007488B (zh) * | 2017-11-29 | 2020-04-28 | 赫立科技(成都)有限公司 | 一种用于真空腔室内的位置调节装置 |
RU2700872C1 (ru) * | 2018-08-23 | 2019-09-23 | Акционерное общество "Объединенная двигателестроительная корпорация" (АО "ОДК") | Вакуумная установка пиролиза |
US11492701B2 (en) | 2019-03-19 | 2022-11-08 | Asm Ip Holding B.V. | Reactor manifolds |
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JP2540524B2 (ja) * | 1985-10-24 | 1996-10-02 | テキサス インスツルメンツ インコ−ポレイテツド | ウエ−ハ支持体 |
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-
1989
- 1989-05-19 ES ES89109054T patent/ES2163388T3/es not_active Expired - Lifetime
- 1989-05-19 AT AT89109054T patent/ATE208961T1/de not_active IP Right Cessation
- 1989-05-19 DE DE58909880T patent/DE58909880D1/de not_active Expired - Lifetime
- 1989-05-19 EP EP89109054A patent/EP0343530B1/de not_active Expired - Lifetime
- 1989-05-24 JP JP12901389A patent/JP3121602B2/ja not_active Expired - Lifetime
- 1989-05-24 US US07/356,872 patent/US4990047A/en not_active Expired - Lifetime
-
1990
- 1990-09-04 US US07/577,462 patent/US5090900A/en not_active Expired - Lifetime
-
1998
- 1998-09-16 JP JP10261550A patent/JPH11145252A/ja not_active Withdrawn
-
1999
- 1999-04-16 JP JP10972699A patent/JP3455468B2/ja not_active Expired - Lifetime
-
2005
- 2005-01-12 JP JP2005005068A patent/JP4012941B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4990047A (en) | 1991-02-05 |
US5090900A (en) | 1992-02-25 |
JP2005167270A (ja) | 2005-06-23 |
JP4012941B2 (ja) | 2007-11-28 |
EP0343530A3 (de) | 1990-12-27 |
EP0343530A2 (de) | 1989-11-29 |
JPH11145252A (ja) | 1999-05-28 |
JP3121602B2 (ja) | 2001-01-09 |
JPH0297035A (ja) | 1990-04-09 |
EP0343530B1 (de) | 2001-11-14 |
JPH11345860A (ja) | 1999-12-14 |
JP3455468B2 (ja) | 2003-10-14 |
ATE208961T1 (de) | 2001-11-15 |
ES2163388T3 (es) | 2002-02-01 |
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Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN |
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Owner name: OC OERLIKON BALZERS AG, BALZERS, LI |
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