DE60007212D1 - Mikrostrukturanordnung, Verfahren und Form zur Erzeugung der Mikrostrukturanordnung, Mikrolinsenanordnung - Google Patents

Mikrostrukturanordnung, Verfahren und Form zur Erzeugung der Mikrostrukturanordnung, Mikrolinsenanordnung

Info

Publication number
DE60007212D1
DE60007212D1 DE60007212T DE60007212T DE60007212D1 DE 60007212 D1 DE60007212 D1 DE 60007212D1 DE 60007212 T DE60007212 T DE 60007212T DE 60007212 T DE60007212 T DE 60007212T DE 60007212 D1 DE60007212 D1 DE 60007212D1
Authority
DE
Germany
Prior art keywords
arrangement
microstructure
producing
microlens
microstructure arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60007212T
Other languages
English (en)
Other versions
DE60007212T2 (de
Inventor
Takayuki Teshima
Takayuki Yagi
Yasuhiro Shimada
Takashi Ushijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE60007212D1 publication Critical patent/DE60007212D1/de
Application granted granted Critical
Publication of DE60007212T2 publication Critical patent/DE60007212T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
DE60007212T 1999-04-01 2000-04-03 Mikrostrukturanordnung, Verfahren und Form zur Erzeugung der Mikrostrukturanordnung, Mikrolinsenanordnung Expired - Lifetime DE60007212T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9443499 1999-04-01
JP09443499A JP3524424B2 (ja) 1999-04-01 1999-04-01 マイクロ構造体アレイ用金型又は金型マスター、及びその作製方法

Publications (2)

Publication Number Publication Date
DE60007212D1 true DE60007212D1 (de) 2004-01-29
DE60007212T2 DE60007212T2 (de) 2004-11-11

Family

ID=14110155

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60007212T Expired - Lifetime DE60007212T2 (de) 1999-04-01 2000-04-03 Mikrostrukturanordnung, Verfahren und Form zur Erzeugung der Mikrostrukturanordnung, Mikrolinsenanordnung

Country Status (5)

Country Link
US (3) US6632342B1 (de)
EP (1) EP1041407B1 (de)
JP (1) JP3524424B2 (de)
KR (1) KR100431676B1 (de)
DE (1) DE60007212T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7697052B1 (en) 1999-02-17 2010-04-13 Semiconductor Energy Laboratory Co., Ltd. Electronic view finder utilizing an organic electroluminescence display
US20020045028A1 (en) * 2000-10-10 2002-04-18 Takayuki Teshima Microstructure array, mold for forming a microstructure array, and method of fabricating the same
DE10159860C2 (de) * 2001-12-06 2003-12-04 Sdk Technik Gmbh Wärmeübertragungsfläche mit einer aufgalvanisierten Mikrostruktur von Vorsprüngen
JP3714262B2 (ja) * 2002-02-20 2005-11-09 住友電気工業株式会社 微細電鋳用金型とその製造方法
US6894840B2 (en) * 2002-05-13 2005-05-17 Sony Corporation Production method of microlens array, liquid crystal display device and production method thereof, and projector
AU2003231779B2 (en) * 2002-05-14 2009-02-05 Viance, Llc Water repellent compositions for wood preservatives
US6638786B2 (en) * 2002-10-25 2003-10-28 Hua Wei Semiconductor (Shanghai ) Co., Ltd. Image sensor having large micro-lenses at the peripheral regions
US8734421B2 (en) 2003-06-30 2014-05-27 Johnson & Johnson Consumer Companies, Inc. Methods of treating pores on the skin with electricity
US7227692B2 (en) * 2003-10-09 2007-06-05 Micron Technology, Inc Method and apparatus for balancing color response of imagers
US7435074B2 (en) * 2004-03-13 2008-10-14 International Business Machines Corporation Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning
US7658937B2 (en) * 2004-05-11 2010-02-09 Board Of Trustees Of Michigan State University Anthraquinones and process for the preparation and method of use thereof
WO2005115933A1 (ja) * 2004-05-27 2005-12-08 Konica Minolta Opto, Inc. 光学素子形成用成形型並びにその製造方法及び再生方法
JP4839618B2 (ja) * 2004-10-14 2011-12-21 日立電線株式会社 光トランシーバ
KR20060077709A (ko) * 2004-12-30 2006-07-05 동부일렉트로닉스 주식회사 시모스 이미지 센서
KR100693927B1 (ko) * 2005-02-03 2007-03-12 삼성전자주식회사 마이크로 렌즈 제조방법, 마이크로 렌즈 어레이 제조방법및 이미지 센서 제조방법
KR101176545B1 (ko) * 2006-07-26 2012-08-28 삼성전자주식회사 마이크로 렌즈의 형성방법과 마이크로 렌즈를 포함한이미지 센서 및 그의 제조방법
US7393477B2 (en) * 2006-08-15 2008-07-01 United Microelectronics Corp. Method of fabricating microlens structure
TWI480594B (zh) * 2006-11-28 2015-04-11 Jsr Corp The manufacturing method of microlenses
US7879249B2 (en) * 2007-08-03 2011-02-01 Aptina Imaging Corporation Methods of forming a lens master plate for wafer level lens replication
US7919230B2 (en) * 2008-06-25 2011-04-05 Aptina Imaging Corporation Thermal embossing of resist reflowed lenses to make aspheric lens master wafer
JP5297168B2 (ja) * 2008-11-28 2013-09-25 株式会社サカイヤ マイクロレンズ付き合成樹脂成形品の製造方法
US20120089232A1 (en) 2009-03-27 2012-04-12 Jennifer Hagyoung Kang Choi Medical devices with galvanic particulates
JP4829360B2 (ja) * 2010-04-27 2011-12-07 株式会社東芝 スタンパーの製造方法
CN103959402A (zh) 2011-10-19 2014-07-30 尤尼皮克塞尔显示器有限公司 利用半透明圆柱形母版在柔性基材上形成微观传导线的光致图案化
JP2016191815A (ja) * 2015-03-31 2016-11-10 地方独立行政法人大阪府立産業技術総合研究所 マイクロ構造体およびその製造方法
JP6635998B2 (ja) * 2017-10-06 2020-01-29 キヤノン株式会社 光学機器
KR20200081857A (ko) 2018-12-28 2020-07-08 엘지디스플레이 주식회사 마스크 및 이의 제조 방법
CN115185022A (zh) * 2022-06-22 2022-10-14 北京理工大学 一种基于微球自组装的微透镜阵列模具制造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3772370D1 (de) * 1986-08-06 1991-09-26 Macdermid Inc Verfahren zur herstellung von gedruckten schaltungsbrettern.
US4832799A (en) * 1987-02-24 1989-05-23 Polyonics Corporation Process for coating at least one surface of a polyimide sheet with copper
JPS6410169A (en) * 1987-07-03 1989-01-13 Kurita Water Ind Ltd Filter device for chromatography
JPS6410169U (de) 1987-07-07 1989-01-19
JPH01261601A (ja) 1988-04-13 1989-10-18 Omron Tateisi Electron Co マイクロ非球面レンズおよびその作製方法，ならびにマイクロ非球面レンズを利用した光ファイバ結合装置，集光光学系，光学素子，半導体レーザ光源およびイメージ・ディバイス
EP0450780A3 (en) * 1990-04-05 1992-04-15 Matsushita Electric Industrial Co., Ltd. Optical microelement array and its production method
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
JP2566087B2 (ja) * 1992-01-27 1996-12-25 株式会社東芝 有色マイクロレンズアレイ及びその製造方法
JPH05303009A (ja) 1992-04-28 1993-11-16 Dainippon Printing Co Ltd マイクロレンズアレー原版およびマイクロレンズアレー作製方法
JPH0627302A (ja) 1992-07-09 1994-02-04 Nitto Denko Corp 光学素子の母型およびその製造方法
US5536455A (en) * 1994-01-03 1996-07-16 Omron Corporation Method of manufacturing lens array
US6157084A (en) * 1995-03-17 2000-12-05 Nitto Denko Corporation Film carrier and semiconductor device using same
JPH08258051A (ja) 1995-03-27 1996-10-08 Victor Co Of Japan Ltd レンズ金型の製造方法
JP3015712B2 (ja) * 1995-06-30 2000-03-06 日東電工株式会社 フィルムキャリアおよびそれを用いてなる半導体装置
US6080668A (en) * 1996-05-30 2000-06-27 International Business Machines Corporation Sequential build-up organic chip carrier and method of manufacture
GB9623185D0 (en) * 1996-11-09 1997-01-08 Epigem Limited Improved micro relief element and preparation thereof
DE19650881C2 (de) * 1996-12-07 1999-04-08 Schwerionenforsch Gmbh Verfahren zur Herstellung von in z-Richtung elektrisch leitfähiger und in x/y-Richtung isolierender Folien aus Kunststoff
CA2331599C (en) * 1998-05-12 2005-11-29 Genecure Llc Replication defective hiv vaccine
JP3513398B2 (ja) * 1998-07-29 2004-03-31 キヤノン株式会社 マイクロ構造体、マイクロレンズ及びその作製方法
US6436265B1 (en) * 1999-03-29 2002-08-20 Canon Kabushiki Kaisha Microstructure array, and apparatus and method for forming the microstructure array, and a mold for fabricating a microstructure array
JP3524425B2 (ja) 1999-04-01 2004-05-10 キヤノン株式会社 マイクロ構造体アレイ用金型又は金型マスターの作製方法、該金型又は金型マスターを用いて作製されるマイクロ構造体アレイの作製方法
US6506623B2 (en) * 2000-09-28 2003-01-14 Canon Kabushiki Kaisha Microstructure array, mold for forming a microstructure array, and method of fabricating the same
JP3910363B2 (ja) * 2000-12-28 2007-04-25 富士通株式会社 外部接続端子

Also Published As

Publication number Publication date
US7294389B2 (en) 2007-11-13
EP1041407A1 (de) 2000-10-04
US6835443B2 (en) 2004-12-28
US20030196903A1 (en) 2003-10-23
JP2000280254A (ja) 2000-10-10
KR20000071524A (ko) 2000-11-25
KR100431676B1 (ko) 2004-05-17
US6632342B1 (en) 2003-10-14
JP3524424B2 (ja) 2004-05-10
US20050029111A1 (en) 2005-02-10
DE60007212T2 (de) 2004-11-11
EP1041407B1 (de) 2003-12-17

Similar Documents

Publication Publication Date Title
DE60007212D1 (de) Mikrostrukturanordnung, Verfahren und Form zur Erzeugung der Mikrostrukturanordnung, Mikrolinsenanordnung
DE60132554D1 (de) STATORBLECHKöRPER UND VERFAHREN ZUR HERSTELLUNG DESSELBEN
DE50006694D1 (de) Hochtemperaturbeständiges bauteil und verfahren zur herstellung des hochtemperaturbeständigen bauteils
DE60129589D1 (de) Wabenfilter und verfahren zur herstellung desselben
DE60027721D1 (de) Bodenbelag, giessform und verfahren zur herstellung derselben
DE50006193D1 (de) Verfahren zur herstellung von otoplastiken und otoplastik
DE60137872D1 (de) Kolbenring und verfahren zur herstellung desselben
DE50103010D1 (de) Induktives bauelement und verfahren zu seiner herstellung
DE69924387D1 (de) Nicht-peptidische gnrh agentia, verfahren und zwischenverbindungen zur ihren herstellung
DE60223032D1 (de) Vorrichtung zur herstellung von verbundkonstruktionen und verfahren zur herstellung derselben
DE60141983D1 (de) Verbundstützmittel, filtrationsmittel, kiespackungsmittel und sportplatzmittel sowie verfahren zur herstellung und verwendung derselben
DE60002505D1 (de) Lithium kobaltoxide und verfahren zur herstellung
ATE363476T1 (de) Verfahren zur herstellung von furfural
ATE361058T1 (de) Tablette und verfahren zur herstellung derselben
DE602004027079D1 (de) Gleiskette, gleiskettenvorrichtung und verfahren zur herstellung der gleiskette
DE60202175D1 (de) Formwerkzeug und Verfahren zu dessen Herstellung
DE60007815D1 (de) Coregarn, und Verfahren und Vorrichtung zur dessen Herstellung
DE69901178D1 (de) Nichtgesinterte elektrode und verfahren zur herstellung
DE60134540D1 (de) Töchiometrie aufweisender isolierschicht und verfahren zur herstellung
DE60122533D1 (de) Kolben und verfahren zur herstellung
DE69941954D1 (de) Oxetanderivate, oxetancopolymer, und verfahren zur herstellung von oxetanderivaten
DE60032943D1 (de) Imid-benzoxazolpolykondensat sowie verfahren zur herstellung
DE50209101D1 (de) Hitzebeständige filterlage, filterkörper und verfahren zu seiner herstellung
DE60015219D1 (de) Mikrostrukturanordnung und Verfahren, Gerät und Form zur Erzeugung der Mikrostrukturanordnung
DE60213444D1 (de) Fluorpolymerlaminate und verfahren zur herstellung derselben

Legal Events

Date Code Title Description
8364 No opposition during term of opposition