DE60012005D1 - Verfahren und vorrichtung zur trocknung eines substrats - Google Patents
Verfahren und vorrichtung zur trocknung eines substratsInfo
- Publication number
- DE60012005D1 DE60012005D1 DE60012005T DE60012005T DE60012005D1 DE 60012005 D1 DE60012005 D1 DE 60012005D1 DE 60012005 T DE60012005 T DE 60012005T DE 60012005 T DE60012005 T DE 60012005T DE 60012005 D1 DE60012005 D1 DE 60012005D1
- Authority
- DE
- Germany
- Prior art keywords
- drying
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2000/000175 WO2001053766A1 (fr) | 2000-01-17 | 2000-01-17 | Procede et dispositif pour secher un substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60012005D1 true DE60012005D1 (de) | 2004-08-12 |
DE60012005T2 DE60012005T2 (de) | 2005-07-14 |
Family
ID=11735580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60012005T Expired - Fee Related DE60012005T2 (de) | 2000-01-17 | 2000-01-17 | Verfahren und vorrichtung zur trocknung eines substrats |
Country Status (5)
Country | Link |
---|---|
US (1) | US7377053B1 (de) |
EP (1) | EP1170564B1 (de) |
KR (1) | KR100592997B1 (de) |
DE (1) | DE60012005T2 (de) |
WO (1) | WO2001053766A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100481309B1 (ko) | 2002-06-27 | 2005-04-07 | 삼성전자주식회사 | 반도체 기판의 건조장비 |
KR100636035B1 (ko) * | 2003-11-08 | 2006-10-18 | 삼성전자주식회사 | 웨이퍼를 건조하기 위한 방법 및 장치, 그리고 웨이퍼 건조 장치를 포함하는 웨이퍼 처리 장치 |
JP4758846B2 (ja) * | 2005-11-18 | 2011-08-31 | 東京エレクトロン株式会社 | 乾燥装置、乾燥方法、及び乾燥プログラム、並びに、これらを有する基板処理装置、基板処理方法、及び基板処理プログラム |
JP4527670B2 (ja) * | 2006-01-25 | 2010-08-18 | 東京エレクトロン株式会社 | 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体 |
JP6568838B2 (ja) * | 2016-10-18 | 2019-08-28 | 上村工業株式会社 | 乾燥装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59156995A (ja) * | 1983-02-23 | 1984-09-06 | Fujitsu Ltd | 液相エピタキシヤル装置 |
US4816081A (en) * | 1987-02-17 | 1989-03-28 | Fsi Corporation | Apparatus and process for static drying of substrates |
JPH06103686B2 (ja) | 1989-11-24 | 1994-12-14 | シー エフ エム テクノロジーズ,インコーポレイテッド | 表面乾燥処理方法および装置 |
US5488964A (en) * | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
US6123900A (en) * | 1993-10-28 | 2000-09-26 | Vellutato; Arthur L. | Method of sterilization |
US5772784A (en) * | 1994-11-14 | 1998-06-30 | Yieldup International | Ultra-low particle semiconductor cleaner |
US5968285A (en) * | 1995-06-07 | 1999-10-19 | Gary W. Ferrell | Methods for drying and cleaning of objects using aerosols and inert gases |
US5964958A (en) | 1995-06-07 | 1999-10-12 | Gary W. Ferrell | Methods for drying and cleaning objects using aerosols |
US5653045A (en) * | 1995-06-07 | 1997-08-05 | Ferrell; Gary W. | Method and apparatus for drying parts and microelectronic components using sonic created mist |
US5685086A (en) * | 1995-06-07 | 1997-11-11 | Ferrell; Gary W. | Method and apparatus for drying objects using aerosols |
US5954911A (en) * | 1995-10-12 | 1999-09-21 | Semitool, Inc. | Semiconductor processing using vapor mixtures |
JPH09213672A (ja) * | 1996-01-30 | 1997-08-15 | Nec Yamaguchi Ltd | 半導体ウェハ処理装置および処理方法 |
IL126189A (en) * | 1996-03-14 | 2001-08-08 | All In One Microservice Inc | Method and device for drying and cleaning objects using aerosol |
US6004399A (en) * | 1996-07-01 | 1999-12-21 | Cypress Semiconductor Corporation | Ultra-low particle semiconductor cleaner for removal of particle contamination and residues from surface oxide formation on semiconductor wafers |
JPH10189517A (ja) | 1996-12-20 | 1998-07-21 | Oki Electric Ind Co Ltd | 基板洗浄方法及びその装置 |
JP3171807B2 (ja) * | 1997-01-24 | 2001-06-04 | 東京エレクトロン株式会社 | 洗浄装置及び洗浄方法 |
TW402737B (en) * | 1997-05-27 | 2000-08-21 | Tokyo Electron Ltd | Cleaning/drying device and method |
JPH10335299A (ja) * | 1997-06-05 | 1998-12-18 | Sony Corp | ウェーハ乾燥装置 |
JPH1126423A (ja) * | 1997-07-09 | 1999-01-29 | Sugai:Kk | 半導体ウエハ等の処理方法並びにその処理装置 |
JPH11176798A (ja) * | 1997-12-08 | 1999-07-02 | Toshiba Corp | 基板洗浄・乾燥装置及び方法 |
JPH11176796A (ja) * | 1997-12-16 | 1999-07-02 | Sony Corp | ウェーハ処理方法及び装置 |
JPH11345798A (ja) * | 1998-06-01 | 1999-12-14 | Daikin Ind Ltd | 被洗浄体処理方法およびその装置 |
JP2000012505A (ja) * | 1998-06-17 | 2000-01-14 | Dainippon Screen Mfg Co Ltd | 基板処理方法及びその装置 |
US6216709B1 (en) * | 1998-09-04 | 2001-04-17 | Komag, Inc. | Method for drying a substrate |
TW442836B (en) * | 1998-11-24 | 2001-06-23 | Toho Kasei Co Ltd | Wafer drying device and method |
JP3448613B2 (ja) * | 1999-06-29 | 2003-09-22 | オメガセミコン電子株式会社 | 乾燥装置 |
-
2000
- 2000-01-17 DE DE60012005T patent/DE60012005T2/de not_active Expired - Fee Related
- 2000-01-17 US US09/936,618 patent/US7377053B1/en not_active Expired - Fee Related
- 2000-01-17 KR KR1020017011820A patent/KR100592997B1/ko not_active IP Right Cessation
- 2000-01-17 WO PCT/JP2000/000175 patent/WO2001053766A1/ja active IP Right Grant
- 2000-01-17 EP EP00900411A patent/EP1170564B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1170564A4 (de) | 2002-06-05 |
US7377053B1 (en) | 2008-05-27 |
KR100592997B1 (ko) | 2006-06-23 |
EP1170564A1 (de) | 2002-01-09 |
KR20010112344A (ko) | 2001-12-20 |
EP1170564B1 (de) | 2004-07-07 |
WO2001053766A1 (fr) | 2001-07-26 |
DE60012005T2 (de) | 2005-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |