DE60012824D1 - Leiterplattenanordnung mit integriertem Verbundkern mit organischer Matrix - Google Patents

Leiterplattenanordnung mit integriertem Verbundkern mit organischer Matrix

Info

Publication number
DE60012824D1
DE60012824D1 DE60012824T DE60012824T DE60012824D1 DE 60012824 D1 DE60012824 D1 DE 60012824D1 DE 60012824 T DE60012824 T DE 60012824T DE 60012824 T DE60012824 T DE 60012824T DE 60012824 D1 DE60012824 D1 DE 60012824D1
Authority
DE
Germany
Prior art keywords
composite core
organic matrix
integrated composite
pcb arrangement
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60012824T
Other languages
English (en)
Other versions
DE60012824T2 (de
Inventor
Carl R Smith
Jeffrey R Madura
Jesse J Kramer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Corp
Original Assignee
Northrop Grumman Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northrop Grumman Corp filed Critical Northrop Grumman Corp
Publication of DE60012824D1 publication Critical patent/DE60012824D1/de
Application granted granted Critical
Publication of DE60012824T2 publication Critical patent/DE60012824T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0281Conductive fibers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0323Carbon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/0919Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10727Leadless chip carrier [LCC], e.g. chip-modules for cards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24058Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
    • Y10T428/24124Fibers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24132Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in different layers or components parallel
DE60012824T 1999-06-02 2000-05-31 Leiterplattenanordnung mit integriertem Verbundkern mit organischer Matrix Expired - Lifetime DE60012824T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US324255 1999-06-02
US09/324,255 US6207904B1 (en) 1999-06-02 1999-06-02 Printed wiring board structure having continuous graphite fibers

Publications (2)

Publication Number Publication Date
DE60012824D1 true DE60012824D1 (de) 2004-09-16
DE60012824T2 DE60012824T2 (de) 2005-08-18

Family

ID=23262784

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60012824T Expired - Lifetime DE60012824T2 (de) 1999-06-02 2000-05-31 Leiterplattenanordnung mit integriertem Verbundkern mit organischer Matrix

Country Status (3)

Country Link
US (1) US6207904B1 (de)
EP (1) EP1058490B1 (de)
DE (1) DE60012824T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002047899A1 (en) * 2000-12-12 2002-06-20 Shri Diksha Corporation Lightweight circuit board with conductive constraining cores
US20040227688A1 (en) * 2001-02-15 2004-11-18 Integral Technologies, Inc. Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles
US20020121707A1 (en) * 2001-02-27 2002-09-05 Chippac, Inc. Super-thin high speed flip chip package
USRE44438E1 (en) 2001-02-27 2013-08-13 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US8143108B2 (en) 2004-10-07 2012-03-27 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US7038142B2 (en) * 2002-01-24 2006-05-02 Fujitsu Limited Circuit board and method for fabricating the same, and electronic device
US20050078457A1 (en) * 2003-10-09 2005-04-14 Jackson Hsieh Small memory card
JP2007538389A (ja) * 2004-05-15 2007-12-27 シー−コア テクノロジーズ インコーポレイティド レジン充填チャネル付き導電性抑制コアを有するプリント回路板
US20060104035A1 (en) * 2004-08-24 2006-05-18 Vasoya Kalu K Edge plated printed wiring boards
US7301105B2 (en) * 2004-08-27 2007-11-27 Stablcor, Inc. Printed wiring boards possessing regions with different coefficients of thermal expansion
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
WO2006099554A2 (en) * 2005-03-15 2006-09-21 C-Core Technologies, Inc. Manufacturing process: how to construct constraining core material into printed wiring board
JP4689375B2 (ja) * 2005-07-07 2011-05-25 富士通株式会社 積層基板および該積層基板を有する電子機器
US7730613B2 (en) * 2005-08-29 2010-06-08 Stablcor, Inc. Processes for manufacturing printed wiring boards
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
WO2008008552A2 (en) * 2006-07-14 2008-01-17 Stablcor, Inc. Build-up printed wiring board substrate having a core layer that is part of a circuit
JP2015211204A (ja) * 2014-04-30 2015-11-24 イビデン株式会社 回路基板及びその製造方法
JP2016004810A (ja) * 2014-06-13 2016-01-12 イビデン株式会社 電子回路装置及び電子回路装置の製造方法
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
KR101841836B1 (ko) * 2016-07-05 2018-03-26 김구용 다면 방열구조를 갖는 pcb 모듈, 및 이 모듈에 사용되는 방열 플레이트, 다층 pcb 어셈블리, 및 모듈 케이스
US10790241B2 (en) 2019-02-28 2020-09-29 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2206700B2 (de) 1972-02-12 1976-07-01 Sigri Elektrographit Gmbh, 8901 Meitingen Verfahren zur herstellung von faserverstaerkten verbundkoerpern
US4318954A (en) * 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
US4609586A (en) 1984-08-02 1986-09-02 The Boeing Company Thermally conductive printed wiring board laminate
US4963425A (en) * 1985-03-05 1990-10-16 Unisys Corporation Printed wiring board substrate for surface mounted components
US4654248A (en) 1985-12-16 1987-03-31 Gte Communication Systems Corporation Printed wiring board with zones of controlled thermal coefficient of expansion
US4867235A (en) 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
US4849858A (en) * 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
US4791248A (en) 1987-01-22 1988-12-13 The Boeing Company Printed wire circuit board and its method of manufacture
US5002823A (en) 1987-06-12 1991-03-26 E. I. Du Pont De Nemours And Company Reinforced composites having improved flex fatigue life
US4963697A (en) 1988-02-12 1990-10-16 Texas Instruments Incorporated Advanced polymers on metal printed wiring board
US4882454A (en) 1988-02-12 1989-11-21 Texas Instruments Incorporated Thermal interface for a printed wiring board
US5195021A (en) * 1989-08-21 1993-03-16 Texas Instruments Incorporated Constraining core for surface mount technology
US4970553A (en) * 1989-12-04 1990-11-13 Xerox Corporation Electrical component with conductive path
US5716663A (en) 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
US5103293A (en) * 1990-12-07 1992-04-07 International Business Machines Corporation Electronic circuit packages with tear resistant organic cores
TW210422B (de) 1991-06-04 1993-08-01 Akzo Nv
US5296310A (en) 1992-02-14 1994-03-22 Materials Science Corporation High conductivity hydrid material for thermal management
FR2694139B1 (fr) * 1992-07-21 1994-10-14 Aerospatiale Substrat d'interconnexion pour composants électroniques et son procédé de fabrication.
US5544017A (en) 1992-08-05 1996-08-06 Fujitsu Limited Multichip module substrate
US5309629A (en) 1992-09-01 1994-05-10 Rogers Corporation Method of manufacturing a multilayer circuit board
GB9225260D0 (en) 1992-12-03 1993-01-27 Int Computers Ltd Cooling electronic circuit assemblies
US5840402A (en) 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes
US5571608A (en) 1994-07-15 1996-11-05 Dell Usa, L.P. Apparatus and method of making laminate an embedded conductive layer
US5837356A (en) * 1995-09-22 1998-11-17 Kyocera Corporation Wiring board and method for manufacturing the same
US5699613A (en) 1995-09-25 1997-12-23 International Business Machines Corporation Fine dimension stacked vias for a multiple layer circuit board structure
JPH11145334A (ja) * 1997-09-02 1999-05-28 Eastern Co Ltd 配線基板

Also Published As

Publication number Publication date
EP1058490A3 (de) 2002-03-13
DE60012824T2 (de) 2005-08-18
EP1058490A2 (de) 2000-12-06
EP1058490B1 (de) 2004-08-11
US6207904B1 (en) 2001-03-27

Similar Documents

Publication Publication Date Title
DE60012824D1 (de) Leiterplattenanordnung mit integriertem Verbundkern mit organischer Matrix
DE60037299D1 (de) Elektrolumineszensanzeige mit aktiver Matrix
DE60042878D1 (de) Elektrolumineszensanzeige mit aktiver matrix
DE60044288D1 (de) Fahrzeugstruktur mit kraftübertragenden Elementen
DE69622392D1 (de) Herstellung organischer elektrolumineszenter vorrichtungen
DE60140914D1 (de) Elektrolumineszenzanzeige mit aktiver Matrix
DE69918189D1 (de) Transmurale mehrschichtige einwachsmatrix mit genau definierter porösität
DE69941686D1 (de) Spracheingabegerät mit aufmerksamkeitsspanne
DE60005844D1 (de) Laminat-hülsen-typ-batterie
DE60118037D1 (de) Organische photochrome zusammensetzung mit verbesserten kinetischen eigenschaften
DE50014472D1 (de) Triazolverbindungen mit dopamin-d3-rezeptoraffinität
DE60006768D1 (de) Organische elektrolumineszente Vorrichtungen mit Phenylanthracenpolymeren
DE60028115D1 (de) Mehrschichtige Brennstoffleitung
PT1341791E (pt) Imidazoquinolinas substituidas com tioeter
DE60025418D1 (de) Magnetische Mehrschichtenstruktur
DE69909714D1 (de) Verbundwerkstoffe mit keramischer Matrix
DE60023597D1 (de) Leiterplattenanordnung mit integriertem Verbundkern mit metallischer Matrix
DE69914522D1 (de) Pflaster mit einer Haftmatrix
DE60005901D1 (de) Elektrolumineszierende Anordungen mit Diketopyrrolopyrrolen
NO20002572D0 (no) Flerlags-struktur
DE60109338D1 (de) Elektrolumineszenzanzeige mit aktiver Matrix
DK1173134T3 (da) Termoplastisk flerlagsstruktur
DE60041909D1 (de) Organische elektrolumineszente vorrichtungen
DE60033071D1 (de) Triazospiroverbindungen mit nociceptin-rezeptoraffinität
DE60026140D1 (de) Elektrolumineszensanzeige mit aktiver matrix

Legal Events

Date Code Title Description
8364 No opposition during term of opposition