DE60020760D1 - Poliereinrichtung enthaltend eine Einstellkontrolle für eine Abziehvorrichtung - Google Patents
Poliereinrichtung enthaltend eine Einstellkontrolle für eine AbziehvorrichtungInfo
- Publication number
- DE60020760D1 DE60020760D1 DE60020760T DE60020760T DE60020760D1 DE 60020760 D1 DE60020760 D1 DE 60020760D1 DE 60020760 T DE60020760 T DE 60020760T DE 60020760 T DE60020760 T DE 60020760T DE 60020760 D1 DE60020760 D1 DE 60020760D1
- Authority
- DE
- Germany
- Prior art keywords
- puller
- device containing
- adjustment control
- polishing device
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6571099A JP3772946B2 (ja) | 1999-03-11 | 1999-03-11 | ドレッシング装置及び該ドレッシング装置を備えたポリッシング装置 |
JP6571099 | 1999-03-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60020760D1 true DE60020760D1 (de) | 2005-07-21 |
DE60020760T2 DE60020760T2 (de) | 2006-05-18 |
Family
ID=13294859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60020760T Expired - Fee Related DE60020760T2 (de) | 1999-03-11 | 2000-03-13 | Poliereinrichtung enthaltend eine Einstellkontrolle für eine Abziehvorrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6322434B1 (de) |
EP (1) | EP1034886B1 (de) |
JP (1) | JP3772946B2 (de) |
KR (1) | KR100679329B1 (de) |
DE (1) | DE60020760T2 (de) |
TW (1) | TW434090B (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001274122A (ja) * | 2000-03-23 | 2001-10-05 | Tokyo Seimitsu Co Ltd | ウェハ研磨装置 |
US20030220049A1 (en) * | 2002-05-21 | 2003-11-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Conditioning disk actuating system |
US20030220051A1 (en) * | 2002-05-21 | 2003-11-27 | Taiwan Semiconductor Manufacturing Co., Ltd | Conditioning disk actuating system |
US20040144160A1 (en) * | 2003-01-29 | 2004-07-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Pad conditioning head offline testing kit |
KR100562498B1 (ko) * | 2003-02-12 | 2006-03-21 | 삼성전자주식회사 | 씨엠피 설비의 패드 컨디셔너 |
US7210981B2 (en) * | 2005-05-26 | 2007-05-01 | Applied Materials, Inc. | Smart conditioner rinse station |
JP4839720B2 (ja) * | 2005-08-04 | 2011-12-21 | トヨタ自動車株式会社 | 精密加工装置 |
JP2008178957A (ja) * | 2007-01-25 | 2008-08-07 | Fujitsu Ltd | 研磨加工装置および研磨加工方法 |
JP2008305875A (ja) * | 2007-06-06 | 2008-12-18 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
CN103962943A (zh) | 2009-03-24 | 2014-08-06 | 圣戈班磨料磨具有限公司 | 用作化学机械平坦化垫修整器的研磨工具 |
TW201350267A (zh) * | 2012-05-04 | 2013-12-16 | Saint Gobain Abrasives Inc | 用於同雙側化學機械平坦化墊修整器一起使用之工具 |
JP5919157B2 (ja) * | 2012-10-01 | 2016-05-18 | 株式会社荏原製作所 | ドレッサー |
JP6121795B2 (ja) | 2013-05-15 | 2017-04-26 | 株式会社荏原製作所 | ドレッシング装置、該ドレッシング装置を備えた研磨装置、および研磨方法 |
JP5954293B2 (ja) * | 2013-10-17 | 2016-07-20 | 信越半導体株式会社 | 研磨用の発泡ウレタンパッドのドレッシング装置 |
JP6216686B2 (ja) | 2014-05-30 | 2017-10-18 | 株式会社荏原製作所 | 研磨装置 |
CN104400622A (zh) * | 2014-10-17 | 2015-03-11 | 成都泰美克晶体技术有限公司 | 一种双工位研磨机 |
KR20200127328A (ko) * | 2019-05-02 | 2020-11-11 | 삼성전자주식회사 | 컨디셔너, 이를 포함하는 화학 기계적 연마 장치 및 이 장치를 이용한 반도체 장치의 제조 방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69325756T2 (de) | 1992-09-24 | 2000-03-02 | Ebara Corp | Poliergerät |
DE69413589T2 (de) * | 1993-04-22 | 1999-04-08 | Nippon Telegraph & Telephone | Polierscheibe für die Endfläche einer optischen Faserverbindung und Poliervorrichtung |
US5486131A (en) * | 1994-01-04 | 1996-01-23 | Speedfam Corporation | Device for conditioning polishing pads |
JP2914166B2 (ja) | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
JPH08168953A (ja) * | 1994-12-16 | 1996-07-02 | Ebara Corp | ドレッシング装置 |
JPH1058308A (ja) | 1996-05-29 | 1998-03-03 | Ebara Corp | ポリッシング装置 |
US5951368A (en) | 1996-05-29 | 1999-09-14 | Ebara Corporation | Polishing apparatus |
US5885147A (en) * | 1997-05-12 | 1999-03-23 | Integrated Process Equipment Corp. | Apparatus for conditioning polishing pads |
US5904615A (en) * | 1997-07-18 | 1999-05-18 | Hankook Machine Tools Co., Ltd. | Pad conditioner for chemical mechanical polishing apparatus |
JP3615931B2 (ja) | 1998-03-26 | 2005-02-02 | 株式会社荏原製作所 | ポリッシング装置および該ポリッシング装置におけるコンディショニング方法 |
-
1999
- 1999-03-11 JP JP6571099A patent/JP3772946B2/ja not_active Expired - Fee Related
-
2000
- 2000-03-10 KR KR1020000012140A patent/KR100679329B1/ko not_active IP Right Cessation
- 2000-03-10 TW TW089104397A patent/TW434090B/zh not_active IP Right Cessation
- 2000-03-10 US US09/522,704 patent/US6322434B1/en not_active Expired - Lifetime
- 2000-03-13 DE DE60020760T patent/DE60020760T2/de not_active Expired - Fee Related
- 2000-03-13 EP EP00104556A patent/EP1034886B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1034886A3 (de) | 2001-03-21 |
JP3772946B2 (ja) | 2006-05-10 |
KR100679329B1 (ko) | 2007-02-05 |
EP1034886A2 (de) | 2000-09-13 |
EP1034886B1 (de) | 2005-06-15 |
US6322434B1 (en) | 2001-11-27 |
DE60020760T2 (de) | 2006-05-18 |
JP2000263416A (ja) | 2000-09-26 |
TW434090B (en) | 2001-05-16 |
KR20010006781A (ko) | 2001-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |