DE60023395D1 - Verfahren zur Bearbeitung von Halbleitern - Google Patents

Verfahren zur Bearbeitung von Halbleitern

Info

Publication number
DE60023395D1
DE60023395D1 DE60023395T DE60023395T DE60023395D1 DE 60023395 D1 DE60023395 D1 DE 60023395D1 DE 60023395 T DE60023395 T DE 60023395T DE 60023395 T DE60023395 T DE 60023395T DE 60023395 D1 DE60023395 D1 DE 60023395D1
Authority
DE
Germany
Prior art keywords
processing semiconductors
semiconductors
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60023395T
Other languages
English (en)
Other versions
DE60023395T2 (de
Inventor
Jaim Nulman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE60023395D1 publication Critical patent/DE60023395D1/de
Publication of DE60023395T2 publication Critical patent/DE60023395T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/10—Efficient use of energy, e.g. using compressed air or pressurized fluid as energy carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning
DE60023395T 1999-06-01 2000-05-25 Verfahren zur Bearbeitung von Halbleitern Expired - Fee Related DE60023395T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/323,601 US6303395B1 (en) 1999-06-01 1999-06-01 Semiconductor processing techniques
US323601 1999-06-01

Publications (2)

Publication Number Publication Date
DE60023395D1 true DE60023395D1 (de) 2005-12-01
DE60023395T2 DE60023395T2 (de) 2006-04-27

Family

ID=23259913

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60023395T Expired - Fee Related DE60023395T2 (de) 1999-06-01 2000-05-25 Verfahren zur Bearbeitung von Halbleitern

Country Status (6)

Country Link
US (2) US6303395B1 (de)
EP (1) EP1058175B1 (de)
JP (1) JP2001110695A (de)
KR (1) KR100640700B1 (de)
DE (1) DE60023395T2 (de)
TW (1) TW508623B (de)

Families Citing this family (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6408220B1 (en) 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
US6424876B1 (en) * 1999-07-22 2002-07-23 Advanced Micro Devices, Inc. Statistical process control system with normalized control charting
JP4428489B2 (ja) * 1999-08-23 2010-03-10 パナソニック株式会社 集積回路装置及びそのテスト方法
US6424880B1 (en) 1999-09-10 2002-07-23 Applied Materials, Inc. Multi-computer chamber control system, method and medium
US6574522B1 (en) * 1999-09-24 2003-06-03 General Electric Company System and method of collecting statistically analyzing and graphically displaying quality control data for a manufacturing process
JP4387573B2 (ja) * 1999-10-26 2009-12-16 東京エレクトロン株式会社 プロセス排気ガスモニタ装置及び方法、半導体製造装置、及び半導体製造装置管理システム及び方法
US6640151B1 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
US6684122B1 (en) * 2000-01-03 2004-01-27 Advanced Micro Devices, Inc. Control mechanism for matching process parameters in a multi-chamber process tool
US6465263B1 (en) * 2000-01-04 2002-10-15 Advanced Micro Devices, Inc. Method and apparatus for implementing corrected species by monitoring specific state parameters
US6405144B1 (en) * 2000-01-18 2002-06-11 Advanced Micro Devices, Inc. Method and apparatus for programmed latency for improving wafer-to-wafer uniformity
US6952656B1 (en) 2000-04-28 2005-10-04 Applied Materials, Inc. Wafer fabrication data acquisition and management systems
JP2001326151A (ja) * 2000-05-16 2001-11-22 Nec Corp 半導体集積回路製作システム
US6647309B1 (en) * 2000-05-22 2003-11-11 Advanced Micro Devices, Inc. Method and apparatus for automated generation of test semiconductor wafers
US6747734B1 (en) * 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US6428673B1 (en) 2000-07-08 2002-08-06 Semitool, Inc. Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
US6577988B1 (en) * 2000-08-08 2003-06-10 International Business Machines Corporation Method and system for remote gas monitoring
US6654655B1 (en) * 2000-08-10 2003-11-25 Taiwan Semiconductor Manufacturing Co., Ltd Target generation system based on unlimited capacity allocation
US6708074B1 (en) * 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US6711731B2 (en) * 2000-08-23 2004-03-23 Pri Automation, Inc. Web based tool control in a semiconductor fabrication facility
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
TW576959B (en) * 2001-01-22 2004-02-21 Tokyo Electron Ltd Productivity enhancing system and method thereof of machine
US7103439B1 (en) * 2001-04-02 2006-09-05 Advanced Micro Devices, Inc. Method and apparatus for initializing tool controllers based on tool event data
US7315887B1 (en) * 2001-04-11 2008-01-01 Alcatel Lucent Facilitating integration of communications network equipment inventory management
US6657716B1 (en) * 2001-05-23 2003-12-02 Advanced Micro Devices Inc. Method and apparatus for detecting necking over field/active transitions
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US6727106B1 (en) * 2001-07-12 2004-04-27 Advanced Micro Devices, Inc. System and software for statistical process control in semiconductor manufacturing and method thereof
US6772034B1 (en) 2001-07-12 2004-08-03 Advanced Micro Devices, Inc. System and software for data distribution in semiconductor manufacturing and method thereof
US6970758B1 (en) 2001-07-12 2005-11-29 Advanced Micro Devices, Inc. System and software for data collection and process control in semiconductor manufacturing and method thereof
JP4377223B2 (ja) 2001-07-12 2009-12-02 東京エレクトロン株式会社 基板の処理装置及び搬送装置調整システム
US6839713B1 (en) 2001-07-12 2005-01-04 Advanced Micro Devices, Inc. System and software for database structure in semiconductor manufacturing and method thereof
US6950716B2 (en) 2001-08-13 2005-09-27 Applied Materials, Inc. Dynamic control of wafer processing paths in semiconductor manufacturing processes
US6984198B2 (en) * 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US6616759B2 (en) 2001-09-06 2003-09-09 Hitachi, Ltd. Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor
JP2003142358A (ja) * 2001-11-07 2003-05-16 Canon Inc 製造システム及びその制御装置及び制御方法及び制御プログラム及び記憶媒体
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US6976033B2 (en) * 2002-04-10 2005-12-13 Charming Systems Corpration Production cell information system based on activity costs and an architecture therefor
US20030204528A1 (en) * 2002-04-30 2003-10-30 Yeaun-Jyh Su Semiconductor wafer manufacturing execution system with special engineer requirement database
JP4342770B2 (ja) * 2002-05-08 2009-10-14 Ｎｅｃエレクトロニクス株式会社 半導体製造システムおよび半導体製造のプロセス制御方法
US6991945B1 (en) * 2002-08-30 2006-01-31 Advanced Micro Devices, Inc. Fault detection spanning multiple processes
US6740534B1 (en) * 2002-09-18 2004-05-25 Advanced Micro Devices, Inc. Determination of a process flow based upon fault detection analysis
US6954678B1 (en) * 2002-09-30 2005-10-11 Advanced Micro Devices, Inc. Artificial intelligence system for track defect problem solving
US6720194B1 (en) * 2002-10-02 2004-04-13 Siverion, Inc. Semiconductor characterization and production information system
US6784003B2 (en) * 2002-10-08 2004-08-31 Taiwan Semiconductor Manufacturing Co., Ltd Quick turn around time system and method of use
US6650958B1 (en) * 2002-10-30 2003-11-18 Lsi Logic Corporation Integrated process tool monitoring system for semiconductor fabrication
AU2003290932A1 (en) 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US6878560B1 (en) * 2002-11-22 2005-04-12 Advanced Micro Devices, Inc. Fab correlation system
US6890774B2 (en) * 2002-12-04 2005-05-10 Lam Research Corporation System and method for creating a substrate signature
US6946303B2 (en) * 2002-12-04 2005-09-20 Lam Research Corporation Electronically diagnosing a component in a process line using a substrate signature
US6893882B2 (en) * 2002-12-06 2005-05-17 Taiwan Semiconductor Manufacturing Co., Ltd. Multivariate RBR tool aging detector
US7613534B1 (en) * 2002-12-11 2009-11-03 Advanced Micro Devices, Inc. Web based semiconductor ordering architecture
US6846684B1 (en) * 2002-12-11 2005-01-25 Advanced Micro Devices, Inc. Integrated enterprise resource planning and manufacturing system
US6917841B2 (en) * 2002-12-18 2005-07-12 International Business Machines Corporation Part number inhibit control
US7340318B1 (en) * 2002-12-20 2008-03-04 Advanced Micro Devices, Inc. Method and apparatus for assessing controller performance
US20040193301A1 (en) * 2003-03-31 2004-09-30 Chen-Lin Chao Inventory control via a utility bill of materials (BOM) to minimize resource consumption
US6967110B2 (en) * 2003-05-15 2005-11-22 Texas Instruments Incorporated Sensitive test structure for assessing pattern anomalies
US7315851B2 (en) * 2003-07-25 2008-01-01 Macronix International Co., Ltd. Methods for creating control charts using a computer system
US6947805B1 (en) * 2003-08-04 2005-09-20 Advanced Micro Devices, Inc. Dynamic metrology sampling techniques for identified lots, and system for performing same
US6947801B2 (en) * 2003-08-13 2005-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for synchronizing control limit and equipment performance
US7115211B2 (en) * 2003-08-13 2006-10-03 Tokyo Electron Limited Endpoint detection using laser interferometry
US7167767B2 (en) * 2003-08-22 2007-01-23 Ged Integrated Solutions, Inc. Glass production sequencing
US6898471B1 (en) * 2003-12-31 2005-05-24 Taiwan Semiconductor Manufacturing Company Multivariate RBR tool aging adjuster
US7203563B2 (en) * 2004-04-08 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic N2 purge system for 300 mm full automation fab
US7386353B2 (en) * 2004-04-26 2008-06-10 Taiwan Semiconductor Manufacturing Co., Ltd. Parallel control method for sequential process control flow
US7069098B2 (en) * 2004-08-02 2006-06-27 Advanced Micro Devices, Inc. Method and system for prioritizing material to clear exception conditions
US7120511B1 (en) * 2004-08-11 2006-10-10 Advanced Micro Devices, Inc. Method and system for scheduling maintenance procedures based upon workload distribution
US7076321B2 (en) * 2004-10-05 2006-07-11 Advanced Micro Devices, Inc. Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
US7296103B1 (en) 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
DE102005011150A1 (de) * 2005-03-10 2006-09-21 Austriamicrosystems Ag Verfahren zum Entwurf einer integrierten Schaltung
US20060271223A1 (en) * 2005-05-27 2006-11-30 International Business Machines Corporation Method and system for integrating equipment integration software, equipment events, mes and rules databases
US7065425B1 (en) * 2005-06-22 2006-06-20 Internaitonal Business Machines Corporation Metrology tool error log analysis methodology and system
US7631286B2 (en) * 2005-12-30 2009-12-08 Wafertech Llc Automated metrology recipe generation
KR101388389B1 (ko) * 2006-02-10 2014-04-22 인터몰레큘러 인코퍼레이티드 재료, 단위 프로세스 및 프로세스 시퀀스를 조합적으로 변경하는 방법 및 장치
JP5032048B2 (ja) * 2006-03-31 2012-09-26 東京エレクトロン株式会社 基板処理装置の制御装置，制御方法および制御プログラムを記憶した記録媒体
US20080319568A1 (en) * 2007-06-22 2008-12-25 International Business Machines Corporation Method and system for creating array defect paretos using electrical overlay of bitfail maps, photo limited yield, yield, and auto pattern recognition code data
CN101796481B (zh) * 2007-08-31 2012-07-04 应用材料公司 光电生产线
US20100047954A1 (en) * 2007-08-31 2010-02-25 Su Tzay-Fa Jeff Photovoltaic production line
JP4975605B2 (ja) * 2007-12-26 2012-07-11 東京エレクトロン株式会社 処理システム、処理システムの制御方法およびソフトウェアのバージョンアップ方法
US20090188603A1 (en) * 2008-01-25 2009-07-30 Applied Materials, Inc. Method and apparatus for controlling laminator temperature on a solar cell
US20090222128A1 (en) * 2008-02-05 2009-09-03 Applied Materials, Inc. Methods and apparatus for operating an electronic device manufacturing system
US9387428B2 (en) * 2008-02-05 2016-07-12 Applied Materials, Inc. Systems and methods for treating flammable effluent gases from manufacturing processes
JP2010056367A (ja) * 2008-08-29 2010-03-11 Panasonic Corp 半導体製造装置
EP2192457B1 (de) * 2008-11-28 2013-08-14 Siemens Aktiengesellschaft Automatisierungskomponente für eine industrielle Automatisierungsanordnung und Verfahren zur Aktivierung eines Betriebszustandes
DE102009046751A1 (de) * 2008-12-31 2010-09-09 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Synchronisieren der Prozesskammerabschaltzeiten durch Steuern der Transportreihenfolge in eine Prozessanlage
US8170743B2 (en) * 2009-01-29 2012-05-01 GM Global Technology Operations LLC Integrated diagnosis and prognosis system as part of the corporate value chain
JP5353566B2 (ja) * 2009-08-31 2013-11-27 オムロン株式会社 画像処理装置および画像処理プログラム
JP4775516B1 (ja) * 2011-03-14 2011-09-21 オムロン株式会社 制御装置、制御方法、プログラム、記録媒体
US8713511B1 (en) * 2011-09-16 2014-04-29 Suvolta, Inc. Tools and methods for yield-aware semiconductor manufacturing process target generation
JP5888019B2 (ja) 2011-12-12 2016-03-16 オムロン株式会社 制御装置、制御方法、プログラムおよび記録媒体
KR102058763B1 (ko) * 2012-03-09 2019-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 장치의 소비 에너지 감시 시스템 및 기판 처리 장치의 소비 에너지 감시 방법
WO2013143583A1 (de) * 2012-03-28 2013-10-03 Siemens Aktiengesellschaft Verfahren und vorrichtung zur erfassung von betriebszuständen zur verwendung für die energieeffiziente steuerung einer anlage
EP2682905A1 (de) * 2012-07-05 2014-01-08 Siemens Aktiengesellschaft Verfahren und System zur Handhabung konditionaler Abhängigkeiten zwischen alternativen Produktsegmenten innerhalb eines ANSI/ISA/95 kompatiblen Herstellungsausführungssystems
US20150253762A1 (en) * 2012-09-26 2015-09-10 Hitachi Kokusai Electric Inc. Integrated management system, management device, method of displaying information for substrate processing apparatus, and recording medium
US10146215B2 (en) 2013-11-27 2018-12-04 Taiwan Semiconductor Manufacturing Company Limited Monitor system and method for semiconductor processes
US10241502B2 (en) 2015-10-01 2019-03-26 Globalfoundries Inc. Methods of error detection in fabrication processes
US10289109B2 (en) 2015-10-01 2019-05-14 Globalfoundries Inc. Methods of error detection in fabrication processes
JP6716160B2 (ja) * 2016-05-31 2020-07-01 株式会社ディスコ 加工装置及び加工方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5260868A (en) 1986-08-11 1993-11-09 Texas Instruments Incorporate Method for calendaring future events in real-time
JPH01283934A (ja) 1988-05-11 1989-11-15 Tokyo Electron Ltd エッチング装置およびその制御方法
US5058028A (en) * 1989-12-06 1991-10-15 Meyerle George M Activating method and system for controlling multiple electrically-energized factory tools
US5108570A (en) 1990-03-30 1992-04-28 Applied Materials, Inc. Multistep sputtering process for forming aluminum layer over stepped semiconductor wafer
US5236868A (en) 1990-04-20 1993-08-17 Applied Materials, Inc. Formation of titanium nitride on semiconductor wafer by reaction of titanium with nitrogen-bearing gas in an integrated processing system
JPH04111756A (ja) * 1990-08-30 1992-04-13 Toshiba Corp スケジューリング装置
EP0553285B1 (de) 1990-10-16 2000-03-01 Consilium, Inc. Objektorientierte architektur für fabrikverwaltung
US5295242A (en) 1990-11-02 1994-03-15 Consilium, Inc. Apparatus and method for viewing relationships in a factory management system
US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
JP3154425B2 (ja) 1992-01-07 2001-04-09 フクダ電子株式会社 心電図情報記録方法及び装置
US5367624A (en) 1993-06-11 1994-11-22 Consilium, Inc. Interface for controlling transactions in a manufacturing execution system
US5408405A (en) 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing
KR950034499A (ko) 1994-01-28 1995-12-28 제임스 조셉 드롱 물리적인 증기증착 과정동안 필름들의 증착속도를 모니터하기 위한 방법 및 장치
US5629216A (en) 1994-06-30 1997-05-13 Seh America, Inc. Method for producing semiconductor wafers with low light scattering anomalies
EP0706209A3 (de) 1994-10-06 1996-12-27 Applied Materials Inc Flächenwiderstandsmessung
JPH08149583A (ja) 1994-11-21 1996-06-07 Mitsubishi Electric Corp プロセスコントローラ及びデータ監視方法
KR100213603B1 (ko) * 1994-12-28 1999-08-02 가나이 쯔또무 전자회로기판의 배선수정방법 및 그 장치와 전자회로기판
JP3491002B2 (ja) * 1995-06-08 2004-01-26 東京エレクトロン株式会社 複数の電力使用系の動作制御方法及びその装置
US5740429A (en) 1995-07-07 1998-04-14 Advanced Micro Devices, Inc. E10 reporting tool
JPH0934535A (ja) 1995-07-13 1997-02-07 Mitsubishi Electric Corp メンテナンス通告方式
JPH09326337A (ja) * 1996-06-07 1997-12-16 Hitachi Ltd 半導体ウェハの製造方法および工程管理システム
US5808303A (en) 1997-01-29 1998-09-15 Art Aerospace Research Technologies Inc. Infrared screening and inspection system
JP3393035B2 (ja) 1997-05-06 2003-04-07 東京エレクトロン株式会社 制御装置及び半導体製造装置
US5910011A (en) 1997-05-12 1999-06-08 Applied Materials, Inc. Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system
JPH1167853A (ja) 1997-08-26 1999-03-09 Mitsubishi Electric Corp ウェーハマップ解析補助システムおよびウェーハマップ解析方法
US6054379A (en) 1998-02-11 2000-04-25 Applied Materials, Inc. Method of depositing a low k dielectric with organo silane

Also Published As

Publication number Publication date
US20020023329A1 (en) 2002-02-28
TW508623B (en) 2002-11-01
JP2001110695A (ja) 2001-04-20
US6583509B2 (en) 2003-06-24
EP1058175A2 (de) 2000-12-06
DE60023395T2 (de) 2006-04-27
EP1058175B1 (de) 2005-10-26
KR100640700B1 (ko) 2006-10-31
US6303395B1 (en) 2001-10-16
EP1058175A3 (de) 2004-06-30
KR20010029775A (ko) 2001-04-16

Similar Documents

Publication Publication Date Title
DE60023395D1 (de) Verfahren zur Bearbeitung von Halbleitern
DE69812869T2 (de) Verfahren zur Substratbearbeitung
DE50010474D1 (de) Verfahren zur verkapselung von bauelementen
DE60206052D1 (de) System und verfahren zur bearbeitung von flugplandaten
DE69907349D1 (de) Verfahren zur Verminderung von Stress in GaN Bauelementen
DE50003227D1 (de) Verfahren zur verarbeitung von datenstrukturen
DE60028912D1 (de) Verfahren zur Herstellung von Hableitervorrichtungen
ATE296915T1 (de) Verfahren zur textilbehandlung
DE60122532D1 (de) Verfahren zur behandlung von mehreren bohrlochintervallen
DE60045416D1 (de) Verfahren zur behandlung von mikroelektroniksubstraten
DE69705552T2 (de) Verfahren zur Plasmaverarbeitung
ATE248637T1 (de) Verfahren zur wiedergewinnung von verbrauchten alkanolaminlösungen
DE60038975D1 (de) Verfahren zur reinigung von bishydroxyalkylterephthalaten
DE59900006D1 (de) Verfahren zur Isolierung von gekrümmten Flächen
DE60014506D1 (de) Verfahren zur Entfernung von Organohalogenverbindungen
ATE257482T1 (de) Verfahren zur stabilisierung von siloxan- verbindungen
DE69940761D1 (de) Verfahren zur Transistorsherstellung
ATE321832T1 (de) Verfahren zur aufbereitung von oliven
DE59808096D1 (de) Verfahren zur überwachung von bearbeitungsanlagen
DE69838226D1 (de) Verfahren zur plasmabehandlung
DE60013246D1 (de) Verfahren zur trennung von hämoglobin
DE60030519D1 (de) Verfahren zur Unterdrückung von Phantombildern
DE69830946D1 (de) Verfahren zur Abbildung Halbleiteranordnungen
DE50001116D1 (de) Verfahren zur justage von parabolantennen
ATE206392T1 (de) Verfahren zur alkylierug von gehinderten sulfonamiden

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PUSCHMANN & BORCHERT, 82041 OBERHACHING

8339 Ceased/non-payment of the annual fee