DE60032411D1 - Optisches Verfahren zum Messen von Schichtdicken und anderen Oberflächeneigenschaften von Gegenständen wie Halbleiterscheiben - Google Patents

Optisches Verfahren zum Messen von Schichtdicken und anderen Oberflächeneigenschaften von Gegenständen wie Halbleiterscheiben

Info

Publication number
DE60032411D1
DE60032411D1 DE60032411T DE60032411T DE60032411D1 DE 60032411 D1 DE60032411 D1 DE 60032411D1 DE 60032411 T DE60032411 T DE 60032411T DE 60032411 T DE60032411 T DE 60032411T DE 60032411 D1 DE60032411 D1 DE 60032411D1
Authority
DE
Germany
Prior art keywords
objects
semiconductor wafers
surface properties
layer thicknesses
optical method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60032411T
Other languages
English (en)
Other versions
DE60032411T2 (de
Inventor
Charles W Schietinger
Anh N Hoang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luxtron Corp
Original Assignee
Luxtron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luxtron Corp filed Critical Luxtron Corp
Application granted granted Critical
Publication of DE60032411D1 publication Critical patent/DE60032411D1/de
Publication of DE60032411T2 publication Critical patent/DE60032411T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
DE60032411T 1999-05-24 2000-05-16 Optisches Verfahren zum Messen von Schichtdicken und anderen Oberflächeneigenschaften von Gegenständen wie Halbleiterscheiben Expired - Lifetime DE60032411T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US317697 1999-05-24
US09/317,697 US6570662B1 (en) 1999-05-24 1999-05-24 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers

Publications (2)

Publication Number Publication Date
DE60032411D1 true DE60032411D1 (de) 2007-02-01
DE60032411T2 DE60032411T2 (de) 2007-09-27

Family

ID=23234867

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60032411T Expired - Lifetime DE60032411T2 (de) 1999-05-24 2000-05-16 Optisches Verfahren zum Messen von Schichtdicken und anderen Oberflächeneigenschaften von Gegenständen wie Halbleiterscheiben

Country Status (4)

Country Link
US (2) US6570662B1 (de)
EP (1) EP1055903B1 (de)
DE (1) DE60032411T2 (de)
TW (1) TW577974B (de)

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WO2015165503A1 (en) * 2014-04-29 2015-11-05 Hewlett-Packard Indigo B.V. Transparent layer thickness measurement
DE102016116012A1 (de) * 2016-08-29 2018-03-01 Lapmaster Wolters Gmbh Verfahren zum Messen der Dicke von flachen Werkstücken
KR102421732B1 (ko) * 2018-04-20 2022-07-18 삼성전자주식회사 반도체 기판 측정 장치 및 이를 이용한 플라즈마 처리 장치
TWI694181B (zh) * 2018-08-29 2020-05-21 陳嘉朗 變頻極化拋光裝置及方法
CN111469047B (zh) * 2020-04-14 2021-06-25 大连理工大学 一种在线检测抛光垫接触特征的试验装置及其使用方法

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Also Published As

Publication number Publication date
DE60032411T2 (de) 2007-09-27
US6570662B1 (en) 2003-05-27
EP1055903B1 (de) 2006-12-20
TW577974B (en) 2004-03-01
US6654132B1 (en) 2003-11-25
EP1055903A1 (de) 2000-11-29

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