DE60035667D1 - Kontaktor mit Kontaktelement auf der LSI-Schaltungsseite, Kontaktelement auf der Testplattinenseite zum Testen von Halbleitergeräten und Hestellungsverfahren dafür - Google Patents

Kontaktor mit Kontaktelement auf der LSI-Schaltungsseite, Kontaktelement auf der Testplattinenseite zum Testen von Halbleitergeräten und Hestellungsverfahren dafür

Info

Publication number
DE60035667D1
DE60035667D1 DE60035667T DE60035667T DE60035667D1 DE 60035667 D1 DE60035667 D1 DE 60035667D1 DE 60035667 T DE60035667 T DE 60035667T DE 60035667 T DE60035667 T DE 60035667T DE 60035667 D1 DE60035667 D1 DE 60035667D1
Authority
DE
Germany
Prior art keywords
contact element
hestellungsverfahren
kontaktor
semiconductor devices
test board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60035667T
Other languages
English (en)
Other versions
DE60035667T2 (de
Inventor
Shigeyuki Maruyama
Hirohisa Matsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Semiconductor Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE60035667D1 publication Critical patent/DE60035667D1/de
Application granted granted Critical
Publication of DE60035667T2 publication Critical patent/DE60035667T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49217—Contact or terminal manufacturing by assembling plural parts by elastic joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
DE60035667T 2000-03-22 2000-12-20 Kontaktor mit Kontaktelement auf der LSI-Schaltungsseite, Kontaktelement auf der Testplattinenseite zum Testen von Halbleitergeräten und Herstellungsverfahren dafür Expired - Lifetime DE60035667T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000080974 2000-03-22
JP2000080974A JP4323055B2 (ja) 2000-03-22 2000-03-22 半導体装置試験用コンタクタ及びその製造方法

Publications (2)

Publication Number Publication Date
DE60035667D1 true DE60035667D1 (de) 2007-09-06
DE60035667T2 DE60035667T2 (de) 2008-05-21

Family

ID=18597976

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60035667T Expired - Lifetime DE60035667T2 (de) 2000-03-22 2000-12-20 Kontaktor mit Kontaktelement auf der LSI-Schaltungsseite, Kontaktelement auf der Testplattinenseite zum Testen von Halbleitergeräten und Herstellungsverfahren dafür

Country Status (7)

Country Link
US (2) US6939142B2 (de)
EP (1) EP1136827B1 (de)
JP (1) JP4323055B2 (de)
KR (1) KR100691680B1 (de)
CN (1) CN1204612C (de)
DE (1) DE60035667T2 (de)
TW (1) TW478082B (de)

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US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
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US20050227510A1 (en) * 2004-04-09 2005-10-13 Brown Dirk D Small array contact with precision working range
JP4383843B2 (ja) * 2003-12-18 2009-12-16 アルプス電気株式会社 電気的接触構造体及びその製造方法
US7383632B2 (en) 2004-03-19 2008-06-10 Neoconix, Inc. Method for fabricating a connector
US7347698B2 (en) * 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
US6972470B2 (en) * 2004-03-30 2005-12-06 Texas Instruments Incorporated Dual metal Schottky diode
WO2005119849A1 (en) * 2004-05-28 2005-12-15 Molex Incorporated Flexible scrub ring contact
WO2005119850A1 (en) 2004-05-28 2005-12-15 Molex Incorporated Electro-formed ring interconnection system
US7220132B2 (en) * 2004-06-28 2007-05-22 Intel Corporation Tilted land grid array package and socket, systems, and methods
US7335979B2 (en) * 2004-06-28 2008-02-26 Intel Corporation Device and method for tilted land grid array interconnects on a coreless substrate package
JPWO2006008799A1 (ja) * 2004-07-16 2008-05-01 株式会社シーアンドエヌ 磁気センサ組立体、地磁気検出装置、素子組立体および携帯端末装置
JP2006088451A (ja) * 2004-09-22 2006-04-06 Rikogaku Shinkokai 耐経年劣化特性に優れたＰｔ基導電性被覆材料
JP2006242774A (ja) * 2005-03-03 2006-09-14 Tokyo Electron Ltd プローブ及びプローブカード
US7408367B2 (en) * 2005-06-22 2008-08-05 Paricon Technologies Corporation Micro Kelvin probes and micro Kelvin probe methodology with concentric pad structures
US7462035B2 (en) * 2005-07-27 2008-12-09 Physical Optics Corporation Electrical connector configured as a fastening element
JP4962929B2 (ja) * 2005-09-19 2012-06-27 軍生 木本 プローバ装置及びこれに用いるプローブ組立体
US20070090849A1 (en) * 2005-10-24 2007-04-26 Romi Mayder Method and apparatus for a DUT contactor
JP4605031B2 (ja) * 2006-01-25 2011-01-05 パナソニック電工株式会社 基板間接続コネクタとそれに用いる絶縁基板
JP2007328996A (ja) * 2006-06-07 2007-12-20 Fujikura Ltd ソケットとその製造方法及び半導体装置
WO2007138952A1 (ja) 2006-05-30 2007-12-06 Fujikura Ltd. ソケット用コンタクト端子及び半導体装置
JP4988363B2 (ja) * 2007-01-24 2012-08-01 日立オートモティブシステムズ株式会社 トルクセンサ
JP5392693B2 (ja) * 2007-05-15 2014-01-22 上野精機株式会社 テストコンタクト
JP4658998B2 (ja) * 2007-06-04 2011-03-23 東京エレクトロン株式会社 シェル
JP5038816B2 (ja) * 2007-08-15 2012-10-03 日本碍子株式会社 ソケット
CN101437360B (zh) * 2007-11-12 2011-12-21 富葵精密组件(深圳)有限公司 柔性电路基板、柔性电路基板的制作方法及固定方法
TW200922009A (en) * 2007-12-07 2009-05-16 Jye Chuang Electronic Co Ltd Contact terminal
KR101008881B1 (ko) * 2008-04-25 2011-01-17 심영모 원터치로 설치되는 등기구
US8308489B2 (en) * 2008-10-27 2012-11-13 Physical Optics Corporation Electrical garment and electrical garment and article assemblies
US8063307B2 (en) * 2008-11-17 2011-11-22 Physical Optics Corporation Self-healing electrical communication paths
LU91561B1 (en) * 2009-04-30 2010-11-02 Univ Luxembourg Electrical and opto-electrical characterisation oflarge-area semiconductor devices.
JP5325085B2 (ja) 2009-12-24 2013-10-23 日本碍子株式会社 接続装置
CN102263350B (zh) * 2010-05-26 2013-11-27 欣兴电子股份有限公司 连接器及其制作方法
US8884640B2 (en) 2011-04-28 2014-11-11 Mpi Corporation Integrated high-speed probe system
JP5794850B2 (ja) * 2011-07-26 2015-10-14 新光電気工業株式会社 接続端子構造の製造方法
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
WO2014113508A2 (en) 2013-01-15 2014-07-24 Microfabrica Inc. Methods of forming parts using laser machining
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
CN106885687B (zh) * 2015-12-16 2019-11-12 上海机动车检测认证技术研究中心有限公司 一种车用灯具光通量测试装置
CN105866654A (zh) * 2016-05-25 2016-08-17 上海华岭集成电路技术股份有限公司 晶圆测试的控制方法
PH12017000234A1 (en) * 2016-09-02 2018-07-23 Knight Auto Prec Engineering Pte Ltd Handling assembly of semiconductor test equipment
CN110797820B (zh) * 2019-10-23 2021-06-11 山东达驰阿尔发电气有限公司 一种离相封闭母线导体抱瓦的制作方法

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Also Published As

Publication number Publication date
TW478082B (en) 2002-03-01
JP2001266983A (ja) 2001-09-28
CN1314703A (zh) 2001-09-26
US20010024890A1 (en) 2001-09-27
US20050225342A1 (en) 2005-10-13
KR20010092660A (ko) 2001-10-26
US6939142B2 (en) 2005-09-06
US7240432B2 (en) 2007-07-10
EP1136827A2 (de) 2001-09-26
KR100691680B1 (ko) 2007-03-09
EP1136827A3 (de) 2003-07-16
CN1204612C (zh) 2005-06-01
EP1136827B1 (de) 2007-07-25
DE60035667T2 (de) 2008-05-21
JP4323055B2 (ja) 2009-09-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FUJITSU MICROELECTRONICS LTD., TOKYO, JP

8327 Change in the person/name/address of the patent owner

Owner name: FUJITSU SEMICONDUCTOR LTD., YOKOHAMA, KANAGAWA, JP

8328 Change in the person/name/address of the agent

Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE