DE60036157D1 - Herstellungsverfahren einer elektrooptischen Vorrichtung - Google Patents

Herstellungsverfahren einer elektrooptischen Vorrichtung

Info

Publication number
DE60036157D1
DE60036157D1 DE60036157T DE60036157T DE60036157D1 DE 60036157 D1 DE60036157 D1 DE 60036157D1 DE 60036157 T DE60036157 T DE 60036157T DE 60036157 T DE60036157 T DE 60036157T DE 60036157 D1 DE60036157 D1 DE 60036157D1
Authority
DE
Germany
Prior art keywords
electro
manufacturing
optical device
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60036157T
Other languages
English (en)
Other versions
DE60036157T2 (de
Inventor
Shunpei Yamazaki
Mayumi Mizukami
Toshimitsu Konuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16121095&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60036157(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Application granted granted Critical
Publication of DE60036157D1 publication Critical patent/DE60036157D1/de
Publication of DE60036157T2 publication Critical patent/DE60036157T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/826Multilayers, e.g. opaque multilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/18Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02488Insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686Pulsed laser beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1251Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3026Top emission
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/124Insulating layers formed between TFT elements and OLED elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
DE60036157T 1999-06-28 2000-06-27 Herstellungsverfahren einer elektrooptischen Vorrichtung Expired - Lifetime DE60036157T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18259899 1999-06-28
JP18259899 1999-06-28

Publications (2)

Publication Number Publication Date
DE60036157D1 true DE60036157D1 (de) 2007-10-11
DE60036157T2 DE60036157T2 (de) 2008-01-03

Family

ID=16121095

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60036157T Expired - Lifetime DE60036157T2 (de) 1999-06-28 2000-06-27 Herstellungsverfahren einer elektrooptischen Vorrichtung

Country Status (6)

Country Link
US (3) US6420200B1 (de)
EP (3) EP1065725B1 (de)
KR (2) KR20010066877A (de)
CN (2) CN102610565B (de)
DE (1) DE60036157T2 (de)
TW (1) TW556357B (de)

Families Citing this family (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030074672A1 (en) * 1998-09-22 2003-04-17 John Daniels Multiuser internet gateway system
US6274887B1 (en) 1998-11-02 2001-08-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method therefor
US7141821B1 (en) * 1998-11-10 2006-11-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an impurity gradient in the impurity regions and method of manufacture
US6277679B1 (en) 1998-11-25 2001-08-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing thin film transistor
EP1006589B1 (de) 1998-12-03 2012-04-11 Semiconductor Energy Laboratory Co., Ltd. MOS-Dünnfilmtransistor und Herstellungsverfahren
TW556357B (en) * 1999-06-28 2003-10-01 Semiconductor Energy Lab Method of manufacturing an electro-optical device
JP2001092413A (ja) * 1999-09-24 2001-04-06 Semiconductor Energy Lab Co Ltd El表示装置および電子装置
US6646287B1 (en) 1999-11-19 2003-11-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with tapered gate and insulating film
US6767774B2 (en) * 1999-12-28 2004-07-27 Intel Corporation Producing multi-color stable light emitting organic displays
US20010053559A1 (en) * 2000-01-25 2001-12-20 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating display device
DE20006642U1 (de) 2000-04-11 2000-08-17 Agilent Technologies Inc Optische Vorrichtung
DE10018168A1 (de) * 2000-04-12 2001-10-25 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von organischen, Licht emittierenden Dioden
US7525165B2 (en) * 2000-04-17 2009-04-28 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and manufacturing method thereof
TW577813B (en) * 2000-07-10 2004-03-01 Semiconductor Energy Lab Film forming apparatus and method of manufacturing light emitting device
US7875975B2 (en) 2000-08-18 2011-01-25 Polyic Gmbh & Co. Kg Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
DE10043204A1 (de) 2000-09-01 2002-04-04 Siemens Ag Organischer Feld-Effekt-Transistor, Verfahren zur Strukturierung eines OFETs und integrierte Schaltung
US6562671B2 (en) 2000-09-22 2003-05-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and manufacturing method thereof
JP4925528B2 (ja) * 2000-09-29 2012-04-25 三洋電機株式会社 表示装置
US6770562B2 (en) * 2000-10-26 2004-08-03 Semiconductor Energy Laboratory Co., Ltd. Film formation apparatus and film formation method
JP2002215065A (ja) 2000-11-02 2002-07-31 Seiko Epson Corp 有機エレクトロルミネッセンス装置及びその製造方法、並びに電子機器
US6717181B2 (en) * 2001-02-22 2004-04-06 Semiconductor Energy Laboratory Co., Ltd. Luminescent device having thin film transistor
US20020130612A1 (en) 2001-03-13 2002-09-19 Morrissy Joseph Hourigan Display device formed of a multi-color light emitting material and method of making same
JP3608614B2 (ja) 2001-03-28 2005-01-12 株式会社日立製作所 表示装置
DE10126859A1 (de) * 2001-06-01 2002-12-12 Siemens Ag Verfahren zur Erzeugung von leitfähigen Strukturen mittels Drucktechnik sowie daraus hergestellte aktive Bauelemente für integrierte Schaltungen
JP2003017248A (ja) * 2001-06-27 2003-01-17 Sony Corp 電界発光素子
JP2003022892A (ja) * 2001-07-06 2003-01-24 Semiconductor Energy Lab Co Ltd 発光装置の製造方法
JP4290905B2 (ja) * 2001-07-10 2009-07-08 Nec液晶テクノロジー株式会社 有機膜の平坦化方法
DE10152920A1 (de) * 2001-10-26 2003-05-28 Osram Opto Semiconductors Gmbh Verfahren zum großflächigen Aufbringen von mechanisch empfindlichen Schichten auf ein Substrat
US6852997B2 (en) 2001-10-30 2005-02-08 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP4149168B2 (ja) 2001-11-09 2008-09-10 株式会社半導体エネルギー研究所 発光装置
US20030089252A1 (en) * 2001-11-09 2003-05-15 Sarnecki Greg J. Production of Electroluminescent Devices
KR100841611B1 (ko) * 2001-11-27 2008-06-27 엘지디스플레이 주식회사 플라스틱 액정표시소자 제조장치
WO2003067678A1 (de) * 2002-02-08 2003-08-14 Siemens Aktiengesellschaft Erzeugung dünner homogener schichten in der produktion von polymerelektronik
US7378124B2 (en) * 2002-03-01 2008-05-27 John James Daniels Organic and inorganic light active devices and methods for making the same
US6876143B2 (en) * 2002-11-19 2005-04-05 John James Daniels Organic light active devices and methods for fabricating the same
TWI272556B (en) * 2002-05-13 2007-02-01 Semiconductor Energy Lab Display device
US7256421B2 (en) 2002-05-17 2007-08-14 Semiconductor Energy Laboratory, Co., Ltd. Display device having a structure for preventing the deterioration of a light emitting device
DE10226370B4 (de) 2002-06-13 2008-12-11 Polyic Gmbh & Co. Kg Substrat für ein elektronisches Bauteil, Verwendung des Substrates, Verfahren zur Erhöhung der Ladungsträgermobilität und Organischer Feld-Effekt Transistor (OFET)
WO2004017439A2 (de) 2002-07-29 2004-02-26 Siemens Aktiengesellschaft Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu
US7161590B2 (en) * 2002-09-04 2007-01-09 John James Daniels Thin, lightweight, flexible, bright, wireless display
US20040043139A1 (en) * 2002-09-04 2004-03-04 Daniels John James Printer and method for manufacturing electronic circuits and displays
JP4434563B2 (ja) * 2002-09-12 2010-03-17 パイオニア株式会社 有機el表示装置の製造方法
GB0223510D0 (en) * 2002-10-10 2002-11-13 Cambridge Display Tech Ltd Optical device
US7256427B2 (en) * 2002-11-19 2007-08-14 Articulated Technologies, Llc Organic light active devices with particulated light active material in a carrier matrix
JP3867659B2 (ja) * 2002-11-26 2007-01-10 ソニー株式会社 有機電界発光素子の製造方法
JP2004178930A (ja) * 2002-11-26 2004-06-24 Sony Corp 発光素子およびこれを用いた表示装置
EP1584114A1 (de) * 2003-01-17 2005-10-12 Diode Solutions, Inc. Display mit einem organischen material
JP4820536B2 (ja) * 2003-06-25 2011-11-24 彬雄 谷口 有機エレクトロルミネッセンス素子の製造方法
JP4329445B2 (ja) * 2003-08-04 2009-09-09 セイコーエプソン株式会社 電気光学装置並びに電子機器
DE10340643B4 (de) 2003-09-03 2009-04-16 Polyic Gmbh & Co. Kg Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht
US7893438B2 (en) 2003-10-16 2011-02-22 Samsung Mobile Display Co., Ltd. Organic light-emitting display device including a planarization pattern and method for manufacturing the same
US7217956B2 (en) * 2004-03-29 2007-05-15 Articulated Technologies, Llc. Light active sheet material
US7858994B2 (en) * 2006-06-16 2010-12-28 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
US7259030B2 (en) * 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
US7427782B2 (en) * 2004-03-29 2008-09-23 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US20050282307A1 (en) * 2004-06-21 2005-12-22 Daniels John J Particulate for organic and inorganic light active devices and methods for fabricating the same
DE102004040831A1 (de) 2004-08-23 2006-03-09 Polyic Gmbh & Co. Kg Funketikettfähige Umverpackung
US10225906B2 (en) 2004-10-22 2019-03-05 Massachusetts Institute Of Technology Light emitting device including semiconductor nanocrystals
KR101122228B1 (ko) * 2004-10-26 2012-03-19 삼성전자주식회사 박막 트랜지스터 표시판 및 그 제조 방법
DE102004059464A1 (de) 2004-12-10 2006-06-29 Polyic Gmbh & Co. Kg Elektronikbauteil mit Modulator
DE102004059465A1 (de) 2004-12-10 2006-06-14 Polyic Gmbh & Co. Kg Erkennungssystem
DE102004063435A1 (de) 2004-12-23 2006-07-27 Polyic Gmbh & Co. Kg Organischer Gleichrichter
CN101088181A (zh) * 2004-12-28 2007-12-12 出光兴产株式会社 有机电致发光元件
US7498229B1 (en) * 2005-02-09 2009-03-03 Translucent, Inc. Transistor and in-situ fabrication process
DE102005009819A1 (de) 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe
JP2006252787A (ja) * 2005-03-08 2006-09-21 Toppan Printing Co Ltd 有機el素子製造方法および有機el素子
US7485023B2 (en) * 2005-03-31 2009-02-03 Toppan Printing Co., Ltd. Organic electroluminescent device having partition wall and a manufacturing method of the same by relief printing method
DE102005017655B4 (de) 2005-04-15 2008-12-11 Polyic Gmbh & Co. Kg Mehrschichtiger Verbundkörper mit elektronischer Funktion
JP4682691B2 (ja) * 2005-05-13 2011-05-11 凸版印刷株式会社 有機エレクトロルミネッセンス素子の製造方法
JP2006344545A (ja) * 2005-06-10 2006-12-21 Toppan Printing Co Ltd 有機el素子の製造方法および有機el素子
JP2007012504A (ja) * 2005-07-01 2007-01-18 Toppan Printing Co Ltd 有機el素子の製造方法及び有機el素子
DE102005031448A1 (de) 2005-07-04 2007-01-11 Polyic Gmbh & Co. Kg Aktivierbare optische Schicht
DE102005033714A1 (de) * 2005-07-12 2007-01-18 Schefenacker Vision Systems Germany Gmbh Verfahren und Vorrichtung zur Herstellung eines elektrolumineszierenden Leuchtelements
US7772485B2 (en) 2005-07-14 2010-08-10 Konarka Technologies, Inc. Polymers with low band gaps and high charge mobility
US7781673B2 (en) 2005-07-14 2010-08-24 Konarka Technologies, Inc. Polymers with low band gaps and high charge mobility
US20070181179A1 (en) 2005-12-21 2007-08-09 Konarka Technologies, Inc. Tandem photovoltaic cells
US8158881B2 (en) 2005-07-14 2012-04-17 Konarka Technologies, Inc. Tandem photovoltaic cells
DE102005035589A1 (de) 2005-07-29 2007-02-01 Polyic Gmbh & Co. Kg Verfahren zur Herstellung eines elektronischen Bauelements
DE102005044306A1 (de) * 2005-09-16 2007-03-22 Polyic Gmbh & Co. Kg Elektronische Schaltung und Verfahren zur Herstellung einer solchen
JP4872288B2 (ja) * 2005-09-22 2012-02-08 凸版印刷株式会社 有機el素子及びその製造方法
US20090322210A1 (en) * 2005-09-27 2009-12-31 Masahiro Yokoo Organic electroluminescent element substrate, and organic electroluminescent element and the manufacturing method
US20070071884A1 (en) * 2005-09-27 2007-03-29 Koji Takeshita Electroluminescent element and a method of manufacturing the same
JP2007115464A (ja) * 2005-10-19 2007-05-10 Toppan Printing Co Ltd 表示素子の製造方法
DE602006016861D1 (de) * 2005-12-21 2010-10-21 Konarka Technologies Inc Photovoltaische tandemzellen
WO2007077715A1 (ja) 2006-01-05 2007-07-12 Konica Minolta Holdings, Inc. ボトムエミッション型有機エレクトロルミネッセンスパネル
US7696683B2 (en) * 2006-01-19 2010-04-13 Toppan Printing Co., Ltd. Organic electroluminescent element and the manufacturing method
US7546803B2 (en) * 2006-01-30 2009-06-16 Toppan Printing Co., Ltd. Letterpress printing machine
JP4706845B2 (ja) * 2006-02-15 2011-06-22 凸版印刷株式会社 有機el素子の製造方法
JP2007242816A (ja) * 2006-03-07 2007-09-20 Toppan Printing Co Ltd 有機エレクトロルミネッセンスデバイス及びその製造方法
US7880382B2 (en) * 2006-03-08 2011-02-01 Toppan Printing Co., Ltd. Organic electroluminescence panel and manufacturing method of the same
US20070210705A1 (en) * 2006-03-09 2007-09-13 Hajime Yokoi Organic electroluminescent element and manufacturing method of an organic electroluminescent element and a display
JP2007250718A (ja) * 2006-03-15 2007-09-27 Toppan Printing Co Ltd エレクトロルミネッセント素子およびその製造方法
US7687390B2 (en) * 2006-03-28 2010-03-30 Toppan Printing Co., Ltd. Manufacturing method of a transparent conductive film, a manufacturing method of a transparent electrode of an organic electroluminescence device, an organic electroluminescence device and the manufacturing method
JP2007273094A (ja) * 2006-03-30 2007-10-18 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子およびその製造方法
EP2749533B1 (de) * 2006-04-04 2016-02-24 Silicor Materials Inc. Verfahren zur reinigung von silicium
WO2007117668A2 (en) 2006-04-07 2007-10-18 Qd Vision, Inc. Methods and articles including nanomaterial
JP4742977B2 (ja) * 2006-05-12 2011-08-10 凸版印刷株式会社 有機elディスプレイパネルの製造方法
MY149956A (en) 2006-05-22 2013-11-15 Audio Pixels Holdings Ltd Apparatus and methods for generating pressure waves
US8457338B2 (en) 2006-05-22 2013-06-04 Audio Pixels Ltd. Apparatus and methods for generating pressure waves
KR101359059B1 (ko) 2006-05-22 2014-02-05 오디오 픽셀즈 리미티드 다이렉트 디지털 스피커의 음량 및 음색 제어 장치 및 그 제어 방법
JP4775118B2 (ja) * 2006-06-01 2011-09-21 凸版印刷株式会社 有機エレクトロルミネッセンス素子の製造方法
WO2008111947A1 (en) 2006-06-24 2008-09-18 Qd Vision, Inc. Methods and articles including nanomaterial
US20080032039A1 (en) * 2006-08-07 2008-02-07 Toppan Printing Co., Ltd. Method of manufacturing organic electroluminescence device
US20080299295A1 (en) * 2006-09-21 2008-12-04 Toppan Printing Co., Ltd. Relief printing plate and print
US8008421B2 (en) 2006-10-11 2011-08-30 Konarka Technologies, Inc. Photovoltaic cell with silole-containing polymer
US8008424B2 (en) 2006-10-11 2011-08-30 Konarka Technologies, Inc. Photovoltaic cell with thiazole-containing polymer
US9741901B2 (en) 2006-11-07 2017-08-22 Cbrite Inc. Two-terminal electronic devices and their methods of fabrication
US7898042B2 (en) 2006-11-07 2011-03-01 Cbrite Inc. Two-terminal switching devices and their methods of fabrication
CN101622712B (zh) * 2006-11-07 2011-06-15 希百特股份有限公司 双端开关装置及其制造方法
JP2008135259A (ja) * 2006-11-28 2008-06-12 Toppan Printing Co Ltd 有機elディスプレイパネルおよびその製造方法
JP2008159812A (ja) * 2006-12-22 2008-07-10 Sharp Corp 半導体層形成装置および半導体層形成方法
JP5773646B2 (ja) 2007-06-25 2015-09-02 キユーデイー・ビジヨン・インコーポレーテツド ナノ材料を被着させることを含む組成物および方法
US20090084279A1 (en) * 2007-09-28 2009-04-02 Toppan Printing Co., Ltd. Relief printing plate and printed matter
WO2009066290A2 (en) 2007-11-21 2009-05-28 Audio Pixels Ltd. Digital speaker apparatus
US8455606B2 (en) 2008-08-07 2013-06-04 Merck Patent Gmbh Photoactive polymers
US8013340B2 (en) * 2008-09-30 2011-09-06 Infineon Technologies Ag Semiconductor device with semiconductor body and method for the production of a semiconductor device
KR102149626B1 (ko) 2008-11-07 2020-08-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
WO2010092931A1 (ja) * 2009-02-16 2010-08-19 凸版印刷株式会社 有機エレクトロルミネッセンスディスプレイ及びその製造方法
ES2495994T3 (es) 2010-03-11 2014-09-18 Audio Pixels Ltd. Accionadores de placas paralelas electrostáticas cuyos elementos móviles se accionan solamente mediante fuerza electrostática y procedimientos útiles en conjunción con los mismos
GB2480875B (en) * 2010-06-04 2014-09-03 Plastic Logic Ltd Production of electronic switching devices
DK2643982T3 (da) 2010-11-26 2022-07-04 Audio Pixels Ltd Anordning til generering af en fysisk måleffekt og fremgangsmåde til fremstilling af anordningen
CN103503054A (zh) * 2012-01-26 2014-01-08 松下电器产业株式会社 薄膜晶体管阵列装置以及使用其的el显示装置
US9880533B2 (en) 2012-05-25 2018-01-30 Audio Pixels Ltd. System, a method and a computer program product for controlling a group of actuator arrays for producing a physical effect
US10007244B2 (en) 2012-05-25 2018-06-26 Audio Pixels Ltd. System, a method and a computer program product for controlling a set of actuator elements
JP6142151B2 (ja) * 2012-07-31 2017-06-07 株式会社Joled 表示装置および電子機器
KR102132882B1 (ko) * 2012-12-20 2020-07-13 삼성디스플레이 주식회사 박막트랜지스터 기판, 이를 구비하는 유기 발광 장치, 박막트랜지스터 기판 제조방법 및 유기 발광 장치 제조방법
KR102079253B1 (ko) * 2013-06-26 2020-02-20 삼성디스플레이 주식회사 박막트랜지스터 기판, 이를 구비하는 유기 발광 장치, 박막트랜지스터 기판 제조방법 및 유기 발광 장치 제조방법
KR102059167B1 (ko) 2013-07-30 2020-02-07 엘지디스플레이 주식회사 플렉서블 유기전계 발광소자 및 그 제조 방법
KR102132697B1 (ko) 2013-12-05 2020-07-10 엘지디스플레이 주식회사 휘어진 디스플레이 장치
KR20170137810A (ko) 2015-04-15 2017-12-13 오디오 픽셀즈 리미티드 공간에서 객체의 적어도 위치를 검출하는 방법 및 시스템
CN106784395B (zh) * 2016-11-28 2018-06-22 昆山工研院新型平板显示技术中心有限公司 一种显示屏制造方法及显示屏
KR102316866B1 (ko) * 2018-01-17 2021-10-27 한국전자통신연구원 신축성 디스플레이

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592615B2 (ja) 1980-06-06 1984-01-19 株式会社 東京機械製作所 輪転印刷機のアニロックスロ−ルにおけるインキ掻取装置
FI62448C (fi) * 1981-04-22 1982-12-10 Lohja Ab Oy Elektroluminensstruktur
US4614668A (en) 1984-07-02 1986-09-30 Cordis Corporation Method of making an electroluminescent display device with islands of light emitting elements
JPS6290260A (ja) 1985-10-16 1987-04-24 Tdk Corp サ−マルヘツド用耐摩耗性保護膜
JPH0750632B2 (ja) 1988-06-10 1995-05-31 シャープ株式会社 薄膜el素子
US5137560A (en) * 1990-03-09 1992-08-11 Asahi Glass Company, Inc. Process for manufacturing glass with functional coating
JPH03269995A (ja) * 1990-03-16 1991-12-02 Ricoh Co Ltd 電界発光素子の作製方法
JPH07102694B2 (ja) * 1991-07-31 1995-11-08 日本写真印刷株式会社 薄膜形成装置
EP0598126B1 (de) 1991-07-31 1997-12-29 Nissha Printing Co., Ltd. Vorrichtung zum bilden eines dünnen films
JP3105311B2 (ja) * 1991-10-08 2000-10-30 株式会社半導体エネルギー研究所 液晶電気光学装置およびその作製方法
US5432015A (en) 1992-05-08 1995-07-11 Westaim Technologies, Inc. Electroluminescent laminate with thick film dielectric
GB9215929D0 (en) * 1992-07-27 1992-09-09 Cambridge Display Tech Ltd Electroluminescent devices
JP2770299B2 (ja) 1993-10-26 1998-06-25 富士ゼロックス株式会社 薄膜el素子及びその製造方法、並びにそのために使用するスパッタ用ターゲット
US5923962A (en) * 1993-10-29 1999-07-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
TW264575B (de) * 1993-10-29 1995-12-01 Handotai Energy Kenkyusho Kk
JP3431033B2 (ja) 1993-10-29 2003-07-28 株式会社半導体エネルギー研究所 半導体作製方法
US5644415A (en) * 1993-12-20 1997-07-01 Casio Computer Co., Ltd. Liquid crystal display device having wide field angle
US5821003A (en) * 1994-03-16 1998-10-13 Sumitomo Electric Industries, Ltd. Organic electroluminescent device
JPH07302912A (ja) * 1994-04-29 1995-11-14 Semiconductor Energy Lab Co Ltd 半導体装置
US5962962A (en) 1994-09-08 1999-10-05 Idemitsu Kosan Co., Ltd. Method of encapsulating organic electroluminescence device and organic electroluminescence device
JP3254335B2 (ja) 1994-09-08 2002-02-04 出光興産株式会社 有機el素子の封止方法および有機el素子
US5789762A (en) * 1994-09-14 1998-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor active matrix circuit
US5657139A (en) * 1994-09-30 1997-08-12 Kabushiki Kaisha Toshiba Array substrate for a flat-display device including surge protection circuits and short circuit line or lines
US5684365A (en) 1994-12-14 1997-11-04 Eastman Kodak Company TFT-el display panel using organic electroluminescent media
US5757456A (en) * 1995-03-10 1998-05-26 Semiconductor Energy Laboratory Co., Ltd. Display device and method of fabricating involving peeling circuits from one substrate and mounting on other
JP3539821B2 (ja) 1995-03-27 2004-07-07 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6118426A (en) * 1995-07-20 2000-09-12 E Ink Corporation Transducers and indicators having printed displays
JPH0945930A (ja) * 1995-07-28 1997-02-14 Sony Corp 薄膜トランジスタ及びその製造方法
JPH09148066A (ja) 1995-11-24 1997-06-06 Pioneer Electron Corp 有機el素子
JP3188167B2 (ja) * 1995-12-15 2001-07-16 三洋電機株式会社 薄膜トランジスタ
JP3036436B2 (ja) 1996-06-19 2000-04-24 セイコーエプソン株式会社 アクティブマトリックス型有機el表示体の製造方法
JPH1077467A (ja) * 1996-09-04 1998-03-24 Sumitomo Chem Co Ltd 有機エレクトロルミネッセンス素子の製造方法
JP3899566B2 (ja) 1996-11-25 2007-03-28 セイコーエプソン株式会社 有機el表示装置の製造方法
JPH10172762A (ja) * 1996-12-11 1998-06-26 Sanyo Electric Co Ltd エレクトロルミネッセンス素子を用いた表示装置の製造方法及び表示装置
KR100226548B1 (ko) 1996-12-24 1999-10-15 김영환 웨이퍼 습식 처리 장치
JP3463971B2 (ja) 1996-12-26 2003-11-05 出光興産株式会社 有機アクティブel発光装置
US5869929A (en) 1997-02-04 1999-02-09 Idemitsu Kosan Co., Ltd. Multicolor luminescent device
JP3544280B2 (ja) 1997-03-27 2004-07-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3784491B2 (ja) * 1997-03-28 2006-06-14 株式会社半導体エネルギー研究所 アクティブマトリクス型の表示装置
DE19715658A1 (de) 1997-04-16 1998-10-22 Philips Leiterplatten At Gmbh Multifunktions-Leiterplatte mit opto-elektronisch aktivem Bauelement
US5937272A (en) * 1997-06-06 1999-08-10 Eastman Kodak Company Patterned organic layers in a full-color organic electroluminescent display array on a thin film transistor array substrate
US5972419A (en) 1997-06-13 1999-10-26 Hewlett-Packard Company Electroluminescent display and method for making the same
US6215244B1 (en) 1997-06-16 2001-04-10 Canon Kabushiki Kaisha Stacked organic light emitting device with specific electrode arrangement
JP3541625B2 (ja) 1997-07-02 2004-07-14 セイコーエプソン株式会社 表示装置及びアクティブマトリクス基板
US6843937B1 (en) 1997-07-16 2005-01-18 Seiko Epson Corporation Composition for an organic EL element and method of manufacturing the organic EL element
GB9715907D0 (en) * 1997-07-29 1997-10-01 Cambridge Consultants Electroluminescent device production process
US6203391B1 (en) 1997-08-04 2001-03-20 Lumimove Company, Mo L.L.C. Electroluminescent sign
EP0940797B1 (de) 1997-08-21 2005-03-23 Seiko Epson Corporation Anzeigevorrichtung mit aktiver matrix
JP3269995B2 (ja) * 1997-08-28 2002-04-02 本田技研工業株式会社 車両の運動制御装置
JP3885303B2 (ja) * 1997-08-29 2007-02-21 セイコーエプソン株式会社 発光基板の製造方法
JP3830238B2 (ja) * 1997-08-29 2006-10-04 セイコーエプソン株式会社 アクティブマトリクス型装置
JP3439636B2 (ja) 1997-09-01 2003-08-25 株式会社クボタ 早期安定型埋立処分方法
JP3633229B2 (ja) 1997-09-01 2005-03-30 セイコーエプソン株式会社 発光素子の製造方法および多色表示装置の製造方法
US6403236B1 (en) 1997-09-04 2002-06-11 Sumitomo Chemical Company, Limited Polymer light emitting device
JP3723336B2 (ja) * 1997-11-18 2005-12-07 三洋電機株式会社 液晶表示装置
JP3543170B2 (ja) 1998-02-24 2004-07-14 カシオ計算機株式会社 電界発光素子及びその製造方法
JPH11273859A (ja) * 1998-03-24 1999-10-08 Sony Corp 有機電界発光素子及びその製造方法
DE69918308T2 (de) * 1998-04-10 2004-10-21 E Ink Corp Elektronische anzeige basierend auf organischen feldeffekt-transistoren
TW410478B (en) 1998-05-29 2000-11-01 Lucent Technologies Inc Thin-film transistor monolithically integrated with an organic light-emitting diode
US6166489A (en) 1998-09-15 2000-12-26 The Trustees Of Princeton University Light emitting device using dual light emitting stacks to achieve full-color emission
US8853696B1 (en) * 1999-06-04 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and electronic device
TW527735B (en) * 1999-06-04 2003-04-11 Semiconductor Energy Lab Electro-optical device
TW512543B (en) * 1999-06-28 2002-12-01 Semiconductor Energy Lab Method of manufacturing an electro-optical device
TW556357B (en) * 1999-06-28 2003-10-01 Semiconductor Energy Lab Method of manufacturing an electro-optical device
US6174613B1 (en) * 1999-07-29 2001-01-16 Agilent Technologies, Inc. Method and apparatus for fabricating polymer-based electroluminescent displays
JP3942770B2 (ja) * 1999-09-22 2007-07-11 株式会社半導体エネルギー研究所 El表示装置及び電子装置
TW480722B (en) * 1999-10-12 2002-03-21 Semiconductor Energy Lab Manufacturing method of electro-optical device
US7222981B2 (en) * 2001-02-15 2007-05-29 Semiconductor Energy Laboratory Co., Ltd. EL display device and electronic device
US6835954B2 (en) * 2001-12-29 2004-12-28 Lg.Philips Lcd Co., Ltd. Active matrix organic electroluminescent display device
KR100484591B1 (ko) * 2001-12-29 2005-04-20 엘지.필립스 엘시디 주식회사 능동행렬 유기전기발광소자 및 그의 제조 방법
TW200305119A (en) * 2002-03-15 2003-10-16 Sanyo Electric Co Electroluminescence display device and method for making the same
JP2004152563A (ja) * 2002-10-30 2004-05-27 Canon Inc 表示装置
US7183146B2 (en) * 2003-01-17 2007-02-27 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
JP2007012504A (ja) * 2005-07-01 2007-01-18 Toppan Printing Co Ltd 有機el素子の製造方法及び有機el素子
JP2007242816A (ja) * 2006-03-07 2007-09-20 Toppan Printing Co Ltd 有機エレクトロルミネッセンスデバイス及びその製造方法

Also Published As

Publication number Publication date
EP1615275B1 (de) 2017-04-26
EP2262031A2 (de) 2010-12-15
CN1279515A (zh) 2001-01-10
CN1279515B (zh) 2012-05-30
US6958251B2 (en) 2005-10-25
US6420200B1 (en) 2002-07-16
CN102610565A (zh) 2012-07-25
EP2262031A3 (de) 2012-04-11
US20060046358A1 (en) 2006-03-02
EP1615275A3 (de) 2007-12-05
EP1065725B1 (de) 2007-08-29
KR20050076723A (ko) 2005-07-26
US7342251B2 (en) 2008-03-11
EP1065725A3 (de) 2004-05-19
TW556357B (en) 2003-10-01
DE60036157T2 (de) 2008-01-03
CN102610565B (zh) 2014-10-22
US20020182968A1 (en) 2002-12-05
EP1615275A2 (de) 2006-01-11
EP1065725A2 (de) 2001-01-03
KR20010066877A (ko) 2001-07-11

Similar Documents

Publication Publication Date Title
DE60036157D1 (de) Herstellungsverfahren einer elektrooptischen Vorrichtung
DE60034401D1 (de) Herstellungsverfahren einer elektrooptischen Vorrichtung
DE69836216D1 (de) Herstellungsverfahren einer elektrooptischen Vorrichtung
DE60027367D1 (de) Elektrooptische Vorrichtung
DE69924100D1 (de) Vorrichtung zum reversiblen einbringen einer endoprothese
DE10080916T1 (de) Verfahren zur Herstellung einer photovoltaischen Vorrichtung
ATE332514T1 (de) Verfahren zur hilfsweisen befestigung einer brille und gerät
DE69838410D1 (de) Herstellungsverfahren einer optischen Halbleitervorrichtung
DE50009173D1 (de) Vorrichtung mit mindestens einer mehrere einzel-lichtquellen umfassenden lichtquelle
DE60233840D1 (de) Elektrooptische Vorrichtung und zugehöriges Herstellungsverfahren
DE50014725D1 (de) Optoelektronische Vorrichtung
DE60020656D1 (de) Autofokusgerät und -verfahren
DE69937217D1 (de) Vorrichtung mit einer Induktivität
DE60028319D1 (de) System und Verfahren zur Kommunikation mit einer integrierten Schaltung
DE60133865D1 (de) Verfahren zur Ansteuerung einer elektrooptischen Vorrichtung, elektrooptische Vorrichtung und elektronisches Gerät
DE69917978D1 (de) Vorrichtung und Verfahren zur Komplettierung einer unterirdischen Bohrung
DE60045463D1 (de) Verfahren zur Herstellung einer elektrolumineszenten Anzeigevorrichtung
DE60118668D1 (de) Kommunikationsverfahren einer elektronischen Vorrichtung
DE60044969D1 (de) Herstellungsverfahren einer integrierten schaltung
DE60035447D1 (de) Herstellungsverfahren einer Elektronenemittierenden Vorrichtung
DE50114296D1 (de) Optoelektronische Vorrichtung
DE50002116D1 (de) Verfahren zur identifizierung einer integrierten schaltung
DE60014484D1 (de) Anreiss-Vorrichtung und -Verfahren
DE29810418U1 (de) Optoelektronische Vorrichtung
DE50015842D1 (de) Optoelektronische Vorrichtung

Legal Events

Date Code Title Description
8363 Opposition against the patent