DE60039996D1 - Chemisch-mechanische poliersysteme und verfahren zu ihrer verwendung - Google Patents

Chemisch-mechanische poliersysteme und verfahren zu ihrer verwendung

Info

Publication number
DE60039996D1
DE60039996D1 DE60039996T DE60039996T DE60039996D1 DE 60039996 D1 DE60039996 D1 DE 60039996D1 DE 60039996 T DE60039996 T DE 60039996T DE 60039996 T DE60039996 T DE 60039996T DE 60039996 D1 DE60039996 D1 DE 60039996D1
Authority
DE
Germany
Prior art keywords
chemical
polymer systems
mechanical polymer
metals
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60039996T
Other languages
English (en)
Inventor
Shumin Wang
Kaufman Vlasta Brusic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22527822&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60039996(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of DE60039996D1 publication Critical patent/DE60039996D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
DE60039996T 1999-08-13 2000-07-26 Chemisch-mechanische poliersysteme und verfahren zu ihrer verwendung Expired - Lifetime DE60039996D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14887899P 1999-08-13 1999-08-13
PCT/US2000/020368 WO2001012739A1 (en) 1999-08-13 2000-07-26 Chemical mechanical polishing systems and methods for their use

Publications (1)

Publication Number Publication Date
DE60039996D1 true DE60039996D1 (de) 2008-10-02

Family

ID=22527822

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60039996T Expired - Lifetime DE60039996D1 (de) 1999-08-13 2000-07-26 Chemisch-mechanische poliersysteme und verfahren zu ihrer verwendung

Country Status (13)

Country Link
US (2) US6840971B2 (de)
EP (1) EP1218464B1 (de)
JP (2) JP2003507894A (de)
KR (1) KR20020026954A (de)
CN (1) CN1209430C (de)
AT (1) ATE405618T1 (de)
AU (1) AU6379500A (de)
CA (1) CA2378771A1 (de)
DE (1) DE60039996D1 (de)
HK (1) HK1046424A1 (de)
IL (1) IL147235A0 (de)
TW (1) TW483805B (de)
WO (1) WO2001012739A1 (de)

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US6524167B1 (en) 2000-10-27 2003-02-25 Applied Materials, Inc. Method and composition for the selective removal of residual materials and barrier materials during substrate planarization
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US20030003747A1 (en) * 2001-06-29 2003-01-02 Jae Hong Kim Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same
JP2003041385A (ja) * 2001-07-27 2003-02-13 Ajinomoto Co Inc 金属表面保護膜形成剤及びその使用
US6953389B2 (en) * 2001-08-09 2005-10-11 Cheil Industries, Inc. Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching
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US7049237B2 (en) * 2001-12-21 2006-05-23 Micron Technology, Inc. Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
US7121926B2 (en) * 2001-12-21 2006-10-17 Micron Technology, Inc. Methods for planarization of group VIII metal-containing surfaces using a fixed abrasive article
US20030119316A1 (en) * 2001-12-21 2003-06-26 Micron Technology, Inc. Methods for planarization of group VIII metal-containing surfaces using oxidizing agents
US6884723B2 (en) * 2001-12-21 2005-04-26 Micron Technology, Inc. Methods for planarization of group VIII metal-containing surfaces using complexing agents
KR100451986B1 (ko) * 2001-12-31 2004-10-08 주식회사 하이닉스반도체 반도체 소자의 저장전극 콘택 플러그 형성방법
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US7160807B2 (en) * 2003-06-30 2007-01-09 Cabot Microelectronics Corporation CMP of noble metals
US7241725B2 (en) * 2003-09-25 2007-07-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Barrier polishing fluid
JP2005116987A (ja) * 2003-10-10 2005-04-28 Fujimi Inc 研磨用組成物
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US7022255B2 (en) 2003-10-10 2006-04-04 Dupont Air Products Nanomaterials Llc Chemical-mechanical planarization composition with nitrogen containing polymer and method for use
US20050090106A1 (en) * 2003-10-22 2005-04-28 Jinru Bian Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agent
US7255810B2 (en) * 2004-01-09 2007-08-14 Cabot Microelectronics Corporation Polishing system comprising a highly branched polymer
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JP2005268664A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
JP2005268666A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
JP4316406B2 (ja) * 2004-03-22 2009-08-19 株式会社フジミインコーポレーテッド 研磨用組成物
JP4644434B2 (ja) * 2004-03-24 2011-03-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP2006086462A (ja) * 2004-09-17 2006-03-30 Fujimi Inc 研磨用組成物およびそれを用いた配線構造体の製造法
JP2006135072A (ja) * 2004-11-05 2006-05-25 Fujimi Inc 研磨方法
JP2006179845A (ja) 2004-11-26 2006-07-06 Fuji Photo Film Co Ltd 金属用研磨液及び研磨方法
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US7998335B2 (en) * 2005-06-13 2011-08-16 Cabot Microelectronics Corporation Controlled electrochemical polishing method
TWI397577B (zh) * 2005-09-02 2013-06-01 Fujimi Inc 研磨用組成物
JP5026710B2 (ja) * 2005-09-02 2012-09-19 株式会社フジミインコーポレーテッド 研磨用組成物
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US7265055B2 (en) * 2005-10-26 2007-09-04 Cabot Microelectronics Corporation CMP of copper/ruthenium substrates
JP2007266075A (ja) * 2006-03-27 2007-10-11 Fujifilm Corp 金属用研磨液
US7585340B2 (en) * 2006-04-27 2009-09-08 Cabot Microelectronics Corporation Polishing composition containing polyether amine
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JP2008277723A (ja) 2007-03-30 2008-11-13 Fujifilm Corp 金属用研磨液及び研磨方法
US7976723B2 (en) * 2007-05-17 2011-07-12 International Business Machines Corporation Method for kinetically controlled etching of copper
US20090032006A1 (en) * 2007-07-31 2009-02-05 Chul Woo Nam Wire saw process
JP2009164186A (ja) * 2007-12-28 2009-07-23 Fujimi Inc 研磨用組成物
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US9202709B2 (en) 2008-03-19 2015-12-01 Fujifilm Corporation Polishing liquid for metal and polishing method using the same
KR101084676B1 (ko) * 2008-12-03 2011-11-22 주식회사 엘지화학 1차 화학적 기계적 연마용 슬러리 조성물 및 화학적 기계적 연마 방법
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JP5587620B2 (ja) * 2010-01-25 2014-09-10 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
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CN103831706B (zh) * 2012-11-27 2018-02-09 安集微电子（上海）有限公司 一种化学机械抛光工艺
CN103894918A (zh) * 2012-12-28 2014-07-02 安集微电子（上海）有限公司 一种化学机械抛光方法
CN103898512B (zh) * 2012-12-28 2018-10-26 安集微电子（上海）有限公司 一种用于铜互连的化学机械抛光液及工艺
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CN106661382B (zh) * 2014-07-15 2020-03-24 巴斯夫欧洲公司 化学机械抛光(cmp)组合物
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Also Published As

Publication number Publication date
CN1370208A (zh) 2002-09-18
US7354530B2 (en) 2008-04-08
CA2378771A1 (en) 2001-02-22
EP1218464A1 (de) 2002-07-03
JP2006287244A (ja) 2006-10-19
AU6379500A (en) 2001-03-13
KR20020026954A (ko) 2002-04-12
WO2001012739A1 (en) 2001-02-22
JP5073961B2 (ja) 2012-11-14
EP1218464B1 (de) 2008-08-20
US6840971B2 (en) 2005-01-11
US20030166337A1 (en) 2003-09-04
HK1046424A1 (zh) 2003-01-10
JP2003507894A (ja) 2003-02-25
US20050148187A1 (en) 2005-07-07
IL147235A0 (en) 2002-08-14
ATE405618T1 (de) 2008-09-15
CN1209430C (zh) 2005-07-06
TW483805B (en) 2002-04-21

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