DE60115714D1 - Widerstandselement für Flüssigkeitsstrahldruckkopf und Verfahren für dessen Herstellung - Google Patents

Widerstandselement für Flüssigkeitsstrahldruckkopf und Verfahren für dessen Herstellung

Info

Publication number
DE60115714D1
DE60115714D1 DE60115714T DE60115714T DE60115714D1 DE 60115714 D1 DE60115714 D1 DE 60115714D1 DE 60115714 T DE60115714 T DE 60115714T DE 60115714 T DE60115714 T DE 60115714T DE 60115714 D1 DE60115714 D1 DE 60115714D1
Authority
DE
Germany
Prior art keywords
making
same
resistance element
fluid jet
jet printhead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60115714T
Other languages
English (en)
Other versions
DE60115714T2 (de
Inventor
Zhizang Chen
Genbao Xu
Mark Alan Johnstone
John P Whitlock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE60115714D1 publication Critical patent/DE60115714D1/de
Application granted granted Critical
Publication of DE60115714T2 publication Critical patent/DE60115714T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
    • Y10T29/49039—Fabricating head structure or component thereof including measuring or testing with dual gap materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
DE60115714T 2000-12-20 2001-12-10 Widerstandselement für Flüssigkeitsstrahldruckkopf und Verfahren für dessen Herstellung Expired - Lifetime DE60115714T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US747725 2000-12-20
US09/747,725 US6457814B1 (en) 2000-12-20 2000-12-20 Fluid-jet printhead and method of fabricating a fluid-jet printhead

Publications (2)

Publication Number Publication Date
DE60115714D1 true DE60115714D1 (de) 2006-01-12
DE60115714T2 DE60115714T2 (de) 2006-09-14

Family

ID=25006352

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60115714T Expired - Lifetime DE60115714T2 (de) 2000-12-20 2001-12-10 Widerstandselement für Flüssigkeitsstrahldruckkopf und Verfahren für dessen Herstellung
DE60101138T Expired - Lifetime DE60101138T2 (de) 2000-12-20 2001-12-10 Flüssigkeitsstrahldruckkopf

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60101138T Expired - Lifetime DE60101138T2 (de) 2000-12-20 2001-12-10 Flüssigkeitsstrahldruckkopf

Country Status (8)

Country Link
US (2) US6457814B1 (de)
EP (2) EP1216836B1 (de)
JP (1) JP3642756B2 (de)
KR (1) KR100818032B1 (de)
BR (1) BR0106469B1 (de)
DE (2) DE60115714T2 (de)
HK (1) HK1043960B (de)
TW (1) TW514598B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6709882B2 (en) * 2001-08-27 2004-03-23 Lightwave Microsystems Corporation Planar lightwave circuit active device metallization process
US6767474B2 (en) 2002-07-19 2004-07-27 Hewlett-Packard Development Company, L.P. Fluid ejector head having a planar passivation layer
US6955419B2 (en) * 2003-11-05 2005-10-18 Xerox Corporation Ink jet apparatus
KR100555917B1 (ko) * 2003-12-26 2006-03-03 삼성전자주식회사 잉크젯 프린트 헤드 및 잉크젯 프린트 헤드의 제조방법
US7198358B2 (en) * 2004-02-05 2007-04-03 Hewlett-Packard Development Company, L.P. Heating element, fluid heating device, inkjet printhead, and print cartridge having the same and method of making the same
US7052122B2 (en) * 2004-02-19 2006-05-30 Dimatix, Inc. Printhead
US7273266B2 (en) * 2004-04-14 2007-09-25 Lexmark International, Inc. Micro-fluid ejection assemblies
US7488056B2 (en) * 2004-04-19 2009-02-10 Hewlett--Packard Development Company, L.P. Fluid ejection device
US7559630B2 (en) * 2006-03-22 2009-07-14 Lexmark International, Inc. Substantially planar fluid ejection actuators and methods related thereto
US20080129810A1 (en) * 2006-12-01 2008-06-05 Illinois Tool Works, Inc. Compliant chamber with check valve and internal energy absorbing element for inkjet printhead
KR20090008022A (ko) * 2007-07-16 2009-01-21 삼성전자주식회사 잉크젯 프린트 헤드 및 그 제조방법
US7837886B2 (en) * 2007-07-26 2010-11-23 Hewlett-Packard Development Company, L.P. Heating element
US7862156B2 (en) * 2007-07-26 2011-01-04 Hewlett-Packard Development Company, L.P. Heating element
US8390423B2 (en) * 2009-05-19 2013-03-05 Hewlett-Packard Development Company, L.P. Nanoflat resistor
US9289987B2 (en) 2012-10-31 2016-03-22 Hewlett-Packard Development Company, L.P. Heating element for a printhead
US10457048B2 (en) 2014-10-30 2019-10-29 Hewlett-Packard Development Company, L.P. Ink jet printhead
US10493757B2 (en) 2014-10-30 2019-12-03 Hewlett-Packard Development Company, L.P. Ink jet printhead
JP6642304B2 (ja) * 2016-06-27 2020-02-05 コニカミノルタ株式会社 インクジェットヘッド及びインクジェット記録装置
US11787180B2 (en) 2019-04-29 2023-10-17 Hewlett-Packard Development Company, L.P. Corrosion tolerant micro-electromechanical fluid ejection device
EP3877184A4 (de) * 2019-04-29 2022-06-15 Hewlett-Packard Development Company, L.P. Herstellung einer korrosionstoleranten mikroelektromechanischen flüssigkeitsausstossvorrichtung
US20220118763A1 (en) * 2019-07-03 2022-04-21 Hewlett-Packard Development Company, L.P. Fluid feed hole

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4513298A (en) * 1983-05-25 1985-04-23 Hewlett-Packard Company Thermal ink jet printhead
US4590482A (en) * 1983-12-14 1986-05-20 Hewlett-Packard Company Nozzle test apparatus and method for thermal ink jet systems
US4602421A (en) 1985-04-24 1986-07-29 The United States Of America As Represented By The Secretary Of The Air Force Low noise polycrystalline semiconductor resistors by hydrogen passivation
US4847674A (en) 1987-03-10 1989-07-11 Advanced Micro Devices, Inc. High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism
US4809428A (en) * 1987-12-10 1989-03-07 Hewlett-Packard Company Thin film device for an ink jet printhead and process for the manufacturing same
US4990939A (en) * 1988-09-01 1991-02-05 Ricoh Company, Ltd. Bubble jet printer head with improved operational speed
US5194877A (en) 1991-05-24 1993-03-16 Hewlett-Packard Company Process for manufacturing thermal ink jet printheads having metal substrates and printheads manufactured thereby
US5159353A (en) 1991-07-02 1992-10-27 Hewlett-Packard Company Thermal inkjet printhead structure and method for making the same
US5232865A (en) 1991-07-24 1993-08-03 Micron Technology, Inc. Method of fabricating vertically integrated oxygen-implanted polysilicon resistor
US5159430A (en) 1991-07-24 1992-10-27 Micron Technology, Inc. Vertically integrated oxygen-implanted polysilicon resistor
JP2750992B2 (ja) 1992-08-12 1998-05-18 三菱電機株式会社 半導体装置およびその製造方法
EP0603821B1 (de) 1992-12-22 1999-08-11 Canon Kabushiki Kaisha Tintenstrahldruckkopf und Herstellungsverfahren und Druckgerät mit Tintenstrahldruckkopf
US5330930A (en) 1992-12-31 1994-07-19 Chartered Semiconductor Manufacturing Pte Ltd. Formation of vertical polysilicon resistor having a nitride sidewall for small static RAM cell
US5459501A (en) 1993-02-01 1995-10-17 At&T Global Information Solutions Company Solid-state ink-jet print head
US6070969A (en) * 1994-03-23 2000-06-06 Hewlett-Packard Company Thermal inkjet printhead having a preferred nucleation site
US6056391A (en) 1994-03-29 2000-05-02 Canon Kabushiki Kaisha Substrate having layered electrode structure for use in ink jet head, ink jet head, ink jet pen, and ink jet apparatus
US6008082A (en) 1995-09-14 1999-12-28 Micron Technology, Inc. Method of making a resistor, method of making a diode, and SRAM circuitry and other integrated circuitry
US5883650A (en) 1995-12-06 1999-03-16 Hewlett-Packard Company Thin-film printhead device for an ink-jet printer
US5683930A (en) 1995-12-06 1997-11-04 Micron Technology Inc. SRAM cell employing substantially vertically elongated pull-up resistors and methods of making, and resistor constructions and methods of making
JPH10119341A (ja) * 1996-10-15 1998-05-12 Olympus Optical Co Ltd 静電像形成装置用電荷発生器及びその製造方法
US5710070A (en) 1996-11-08 1998-01-20 Chartered Semiconductor Manufacturing Pte Ltd. Application of titanium nitride and tungsten nitride thin film resistor for thermal ink jet technology
US6020905A (en) 1997-01-24 2000-02-01 Lexmark International, Inc. Ink jet printhead for drop size modulation
US5943076A (en) * 1997-02-24 1999-08-24 Xerox Corporation Printhead for thermal ink jet devices
JPH10291275A (ja) 1997-04-18 1998-11-04 Shigeo Kawabata 化粧パネル基材および化粧パネル

Also Published As

Publication number Publication date
EP1369241B1 (de) 2005-12-07
BR0106469B1 (pt) 2010-09-08
TW514598B (en) 2002-12-21
EP1216836A1 (de) 2002-06-26
US6457814B1 (en) 2002-10-01
KR100818032B1 (ko) 2008-03-31
BR0106469A (pt) 2002-08-13
HK1043960B (zh) 2004-04-16
HK1043960A1 (en) 2002-10-04
EP1369241A1 (de) 2003-12-10
US20020075346A1 (en) 2002-06-20
JP3642756B2 (ja) 2005-04-27
JP2002225276A (ja) 2002-08-14
DE60115714T2 (de) 2006-09-14
US6785956B2 (en) 2004-09-07
DE60101138T2 (de) 2004-09-23
DE60101138D1 (de) 2003-12-11
EP1216836B1 (de) 2003-11-05
KR20020050123A (ko) 2002-06-26
US20020135640A1 (en) 2002-09-26

Similar Documents

Publication Publication Date Title
DE60115714D1 (de) Widerstandselement für Flüssigkeitsstrahldruckkopf und Verfahren für dessen Herstellung
DE60220633D1 (de) Piezoelektrischer Tintenstrahldruckkopf und Verfahren zu seiner Herstellung
DE60318122D1 (de) Tintenstrahldruckkopf und Verfahren zu seiner Herstellung
DE60036326D1 (de) Mikroelektromechanisches Gerät, Flüssigkeitsausstosskopf und Verfahren zu seiner Herstellung
DE60113095D1 (de) Oberflächen entmineralisiertes osteoimplantat und verfahren zu seiner herstellung
DE10196769T1 (de) Tintenstrahl-Aufzeichnungsmedium und Verfahren zu dessen Herstellung
DE60113798D1 (de) Cmos/mems-integrierter Tintenstrahldruckkopf mit länglicher Bohrung und Verfahren zu seiner Herstellung
ATA10852001A (de) Bauelement und verfahren zu seiner herstellung
DE60131708D1 (de) Druckkopf und Verfahren zu dessen Herstellung
DE60136793D1 (de) Elektrostatisches spannfutterglied und verfahren zu seiner herstellung
DE60115902D1 (de) Osteoimplantat und verfahren zu seiner herstellung
DE69718410D1 (de) Tintenstrahlkopf und Verfahren zu dessen Herstellung
DE50214717D1 (de) Und verfahren zu seiner herstellung
DE60111716D1 (de) Cmos/mems integrierter Tintenstrahldruckkopf mit Querflussdüsenarchitektur auf Oxidbasis und Verfahren zu seiner Herstellung
DE60116422D1 (de) Schlauch und Verfahren zu seiner Herstellung
DE60239464D1 (de) Piezoelektrisches porzellan und verfahren zu seiner herstellung
DE60144032D1 (de) Galvanisch abgeschiedener verbundfilm und verfahren zu seiner herstellung
DE60229382D1 (de) Halbleiterbauelement auf gruppe-iii-nitrid-basis und verfahren zu seiner herstellung
DE69935395D1 (de) Selbstreinigender Tintenstrahldrucker mit Strömungsumkehr und Verfahren zum Zusammenbau des Druckers
DE60116486D1 (de) Gallengangstent und verfahren zu seiner herstellung
DE69420717T2 (de) Schaumbohrfluidum, Verfahren zur Herstellung und Bohrmethode
DE10191871T1 (de) Ein magnetorheologisches Fluid und ein Verfahren zur Herstellung desselben
DE60224376D1 (de) Elastomerfasern aus polyurethan und verfahren zu ihrer herstellung
DE69933168D1 (de) Tintenstrahldruckkopf und dessen Herstellungsverfahren
DE602004014210D1 (de) Tintenstrahldruckkopf und Verfahren zu dessen Herstellung

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition