DE60127232D1 - Lineare antriebsvorrichtung zur anwendung in einer plasmabehandlungsvorrichtung - Google Patents

Lineare antriebsvorrichtung zur anwendung in einer plasmabehandlungsvorrichtung

Info

Publication number
DE60127232D1
DE60127232D1 DE60127232T DE60127232T DE60127232D1 DE 60127232 D1 DE60127232 D1 DE 60127232D1 DE 60127232 T DE60127232 T DE 60127232T DE 60127232 T DE60127232 T DE 60127232T DE 60127232 D1 DE60127232 D1 DE 60127232D1
Authority
DE
Germany
Prior art keywords
application
plasma treatment
linear drive
drive device
treatment device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60127232T
Other languages
English (en)
Other versions
DE60127232T2 (de
Inventor
Fangli Hao
Keith Dawson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE60127232D1 publication Critical patent/DE60127232D1/de
Application granted granted Critical
Publication of DE60127232T2 publication Critical patent/DE60127232T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32568Relative arrangement or disposition of electrodes; moving means
DE60127232T 1999-12-30 2001-01-02 Lineare antriebsvorrichtung zur anwendung in einer plasmabehandlungsvorrichtung Expired - Lifetime DE60127232T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/474,843 US6350317B1 (en) 1999-12-30 1999-12-30 Linear drive system for use in a plasma processing system
US474843 1999-12-30
PCT/US2001/000057 WO2001050498A1 (en) 1999-12-30 2001-01-02 Linear drive system for use in a plasma processing system

Publications (2)

Publication Number Publication Date
DE60127232D1 true DE60127232D1 (de) 2007-04-26
DE60127232T2 DE60127232T2 (de) 2007-11-15

Family

ID=23885169

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60127232T Expired - Lifetime DE60127232T2 (de) 1999-12-30 2001-01-02 Lineare antriebsvorrichtung zur anwendung in einer plasmabehandlungsvorrichtung

Country Status (9)

Country Link
US (3) US6350317B1 (de)
EP (1) EP1243017B1 (de)
JP (1) JP4991069B2 (de)
KR (1) KR100751748B1 (de)
CN (1) CN100392792C (de)
AU (1) AU2925701A (de)
DE (1) DE60127232T2 (de)
IL (1) IL150254A0 (de)
WO (1) WO2001050498A1 (de)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0250853A (ja) * 1988-08-12 1990-02-20 Nec Corp 画像形成装置
US6350317B1 (en) * 1999-12-30 2002-02-26 Lam Research Corporation Linear drive system for use in a plasma processing system
WO2001052302A1 (en) * 2000-01-10 2001-07-19 Tokyo Electron Limited Segmented electrode assembly and method for plasma processing
GB0019848D0 (en) * 2000-08-11 2000-09-27 Rtc Systems Ltd Apparatus and method for coating substrates
US6492774B1 (en) * 2000-10-04 2002-12-10 Lam Research Corporation Wafer area pressure control for plasma confinement
US6391787B1 (en) * 2000-10-13 2002-05-21 Lam Research Corporation Stepped upper electrode for plasma processing uniformity
US20020142612A1 (en) * 2001-03-30 2002-10-03 Han-Ming Wu Shielding plate in plasma for uniformity improvement
US20030024900A1 (en) * 2001-07-24 2003-02-06 Tokyo Electron Limited Variable aspect ratio plasma source
US6806653B2 (en) * 2002-01-31 2004-10-19 Tokyo Electron Limited Method and structure to segment RF coupling to silicon electrode
US6926803B2 (en) * 2002-04-17 2005-08-09 Lam Research Corporation Confinement ring support assembly
US6936135B2 (en) * 2002-04-17 2005-08-30 Lam Research Corporation Twist-N-Lock wafer area pressure ring and assembly for reducing particulate contaminant in a plasma processing chamber
JP4847009B2 (ja) 2002-05-23 2011-12-28 ラム リサーチ コーポレーション 半導体処理プラズマ反応器用の多部品電極および多部品電極の一部を取り換える方法
ITBO20020411A1 (it) * 2002-06-27 2003-12-29 Sir Meccanica S R L Macchina alesatrice saldatrice portatile
KR100426816B1 (ko) * 2002-07-31 2004-04-14 삼성전자주식회사 진공압조절장치가 개선된 플라즈마 처리장치
JP2004119448A (ja) * 2002-09-24 2004-04-15 Nec Kyushu Ltd プラズマエッチング装置およびプラズマエッチング方法
US20040118344A1 (en) 2002-12-20 2004-06-24 Lam Research Corporation System and method for controlling plasma with an adjustable coupling to ground circuit
US20040261712A1 (en) * 2003-04-25 2004-12-30 Daisuke Hayashi Plasma processing apparatus
US7296534B2 (en) * 2003-04-30 2007-11-20 Tokyo Electron Limited Hybrid ball-lock attachment apparatus
US20070286965A1 (en) * 2006-06-08 2007-12-13 Martin Jay Seamons Methods for the reduction and elimination of particulate contamination with cvd of amorphous carbon
US20060043067A1 (en) * 2004-08-26 2006-03-02 Lam Research Corporation Yttria insulator ring for use inside a plasma chamber
US7343842B2 (en) * 2004-10-28 2008-03-18 Axon Llc Apparatus for cutting film tubing
KR100790392B1 (ko) * 2004-11-12 2008-01-02 삼성전자주식회사 반도체 제조장치
KR100598988B1 (ko) * 2005-05-18 2006-07-12 주식회사 하이닉스반도체 오버레이 버니어 및 이를 이용한 반도체소자의 제조방법
US7897217B2 (en) * 2005-11-18 2011-03-01 Tokyo Electron Limited Method and system for performing plasma enhanced atomic layer deposition
JP4865352B2 (ja) * 2006-02-17 2012-02-01 三菱重工業株式会社 プラズマ処理装置及びプラズマ処理方法
US7824519B2 (en) * 2007-05-18 2010-11-02 Lam Research Corporation Variable volume plasma processing chamber and associated methods
TWI421360B (zh) * 2007-12-06 2014-01-01 Intevac Inc 雙面濺射蝕刻基板之系統與方法(一)
TWI516175B (zh) * 2008-02-08 2016-01-01 蘭姆研究公司 在電漿處理腔室中穩定壓力的方法及其程式儲存媒體
KR101588482B1 (ko) * 2008-07-07 2016-01-25 램 리써치 코포레이션 플라즈마 처리 챔버에 사용하기 위한 진공 갭을 포함하는 플라즈마 대향 프로브 장치
US8206506B2 (en) * 2008-07-07 2012-06-26 Lam Research Corporation Showerhead electrode
TWI475592B (zh) 2008-07-07 2015-03-01 Lam Res Corp 用來偵測電漿處理腔室中之電漿不穩定性的被動電容耦合靜電探針裝置
US8161906B2 (en) * 2008-07-07 2012-04-24 Lam Research Corporation Clamped showerhead electrode assembly
US8221582B2 (en) 2008-07-07 2012-07-17 Lam Research Corporation Clamped monolithic showerhead electrode
US8540844B2 (en) * 2008-12-19 2013-09-24 Lam Research Corporation Plasma confinement structures in plasma processing systems
JP2012514703A (ja) * 2008-12-31 2012-06-28 エフ. ヒメネス、オマール フレキシャ部材を組み入れた可撓性ジョイント構成
US8628577B1 (en) 2009-03-19 2014-01-14 Ex Technology, Llc Stable device for intervertebral distraction and fusion
US8402918B2 (en) * 2009-04-07 2013-03-26 Lam Research Corporation Showerhead electrode with centering feature
US8272346B2 (en) 2009-04-10 2012-09-25 Lam Research Corporation Gasket with positioning feature for clamped monolithic showerhead electrode
US9358125B2 (en) 2009-07-22 2016-06-07 Spinex Tec, Llc Coaxial screw gear sleeve mechanism
KR102219924B1 (ko) * 2009-08-31 2021-02-23 램 리써치 코포레이션 무선 주파수 (rf) 접지 복귀 장치들
US8992722B2 (en) * 2009-09-01 2015-03-31 Lam Research Corporation Direct drive arrangement to control confinement rings positioning and methods thereof
US8419959B2 (en) * 2009-09-18 2013-04-16 Lam Research Corporation Clamped monolithic showerhead electrode
US20110073257A1 (en) * 2009-09-28 2011-03-31 Rajinder Dhindsa Unitized confinement ring arrangements and methods thereof
JP3160877U (ja) * 2009-10-13 2010-07-15 ラム リサーチ コーポレーションLam Research Corporation シャワーヘッド電極アセンブリの端部クランプ留めおよび機械固定される内側電極
US8636746B2 (en) 2009-12-31 2014-01-28 Spinex Tec, Llc Methods and apparatus for insertion of vertebral body distraction and fusion devices
US9184028B2 (en) * 2010-08-04 2015-11-10 Lam Research Corporation Dual plasma volume processing apparatus for neutral/ion flux control
US20130059448A1 (en) * 2011-09-07 2013-03-07 Lam Research Corporation Pulsed Plasma Chamber in Dual Chamber Configuration
US8573152B2 (en) 2010-09-03 2013-11-05 Lam Research Corporation Showerhead electrode
CN102595764A (zh) * 2012-03-13 2012-07-18 苏州爱因智能设备有限公司 用于电子直线加速器的自动频率控制驱动装置
US8895452B2 (en) 2012-05-31 2014-11-25 Lam Research Corporation Substrate support providing gap height and planarization adjustment in plasma processing chamber
JP5985338B2 (ja) * 2012-09-28 2016-09-06 小島プレス工業株式会社 プラズマcvd装置
JP5992288B2 (ja) 2012-10-15 2016-09-14 東京エレクトロン株式会社 ガス導入装置及び誘導結合プラズマ処理装置
TWI627305B (zh) * 2013-03-15 2018-06-21 應用材料股份有限公司 用於轉盤處理室之具有剛性板的大氣蓋
US8940049B1 (en) 2014-04-01 2015-01-27 Ex Technology, Llc Expandable intervertebral cage
US9486328B2 (en) 2014-04-01 2016-11-08 Ex Technology, Llc Expandable intervertebral cage
CN104900473B (zh) * 2015-04-24 2017-04-05 北京精诚铂阳光电设备有限公司 平行度调节装置及cvd生长膜装置
US10533251B2 (en) 2015-12-31 2020-01-14 Lam Research Corporation Actuator to dynamically adjust showerhead tilt in a semiconductor processing apparatus
KR101680850B1 (ko) * 2016-06-28 2016-11-29 주식회사 기가레인 배기유로의 크기가 조절되는 플라즈마 처리 장치
US9899193B1 (en) * 2016-11-02 2018-02-20 Varian Semiconductor Equipment Associates, Inc. RF ion source with dynamic volume control
CN107339791A (zh) * 2017-07-25 2017-11-10 广东美的制冷设备有限公司 百叶驱动装置、空调器的百叶组件和空调器
US11670490B2 (en) 2017-09-29 2023-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit fabrication system with adjustable gas injector
CN111586957B (zh) * 2019-02-19 2021-05-04 大连理工大学 一种容性耦合等离子体放电装置
US11234835B2 (en) 2019-03-05 2022-02-01 Octagon Spine Llc Transversely expandable minimally invasive intervertebral cage
US11497622B2 (en) 2019-03-05 2022-11-15 Ex Technology, Llc Transversely expandable minimally invasive intervertebral cage and insertion and extraction device
CN111863578B (zh) * 2019-04-28 2023-06-16 中微半导体设备(上海)股份有限公司 一种等离子体处理设备
US20220298631A1 (en) * 2019-06-21 2022-09-22 Lam Research Corporation Bidirectional indexing apparatus
CN112309807B (zh) * 2019-08-02 2022-12-30 中微半导体设备(上海)股份有限公司 等离子体刻蚀设备
CN113035680A (zh) * 2019-12-24 2021-06-25 中微半导体设备(上海)股份有限公司 用于真空设备的调平机构和等离子体处理装置
WO2022164447A1 (en) * 2021-01-29 2022-08-04 Applied Materials, Inc. Cathode drive unit, deposition system, method of operating a deposition system and method of manufacturing a coated substrate
US20230113063A1 (en) * 2021-10-11 2023-04-13 Applied Materials, Inc. Dynamic processing chamber baffle
US20230114104A1 (en) * 2021-10-11 2023-04-13 Applied Materials, Inc. Dynamic processing chamber baffle

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729577A (en) 1980-07-30 1982-02-17 Anelva Corp Automatic continuous sputtering apparatus
US4478701A (en) * 1983-12-30 1984-10-23 Rca Corporation Target support adjusting fixture
JPS61291032A (ja) 1985-06-17 1986-12-20 Fujitsu Ltd 真空装置
CN1008932B (zh) * 1985-11-08 1990-07-25 冶金工业部北京钢铁设计研究总院 数字式脉冲阀系统
JPS62158342A (ja) * 1986-01-06 1987-07-14 Oki Electric Ind Co Ltd 基板上下装置
JPS63193527A (ja) * 1987-02-06 1988-08-10 Mitsubishi Electric Corp エツチング装置
US4851095A (en) * 1988-02-08 1989-07-25 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
US4944860A (en) * 1988-11-04 1990-07-31 Eaton Corporation Platen assembly for a vacuum processing system
JPH07110991B2 (ja) * 1989-10-02 1995-11-29 株式会社日立製作所 プラズマ処理装置およびプラズマ処理方法
JPH03203317A (ja) 1989-12-29 1991-09-05 Matsushita Electric Ind Co Ltd プラズマ処理装置
CN2068025U (zh) * 1990-04-30 1990-12-26 彭建国 多功能汽车半轴套管拉压机
US5178739A (en) * 1990-10-31 1993-01-12 International Business Machines Corporation Apparatus for depositing material into high aspect ratio holes
US5284561A (en) * 1991-11-13 1994-02-08 Materials Research Corporation Method and apparatus for sputter coating employing machine readable indicia carried by target assembly
DE69432165T2 (de) * 1993-03-15 2003-12-11 Kobe Steel Ltd Vorrichtung und system zum lichtbogenionenplattieren
US5354413A (en) 1993-03-18 1994-10-11 Advanced Micro Devices, Inc. Electrode position controller for a semiconductor etching device
JPH0786252A (ja) * 1993-09-20 1995-03-31 Fujitsu Ltd ドライエッチング装置とドライエッチング方法
US5552124A (en) 1994-06-22 1996-09-03 Applied Materials, Inc. Stationary focus ring for plasma reactor
US5534751A (en) * 1995-07-10 1996-07-09 Lam Research Corporation Plasma etching apparatus utilizing plasma confinement
US5672882A (en) 1995-12-29 1997-09-30 Advanced Micro Devices, Inc. Ion implantation device with a closed-loop process chamber pressure control system
US5961798A (en) * 1996-02-13 1999-10-05 Diamond Black Technologies, Inc. System and method for vacuum coating of articles having precise and reproducible positioning of articles
US5889248A (en) * 1997-09-08 1999-03-30 Abb Power T&D Company Inc. Operating mechanism for combined interrupter disconnect switch
JP3161392B2 (ja) * 1997-11-28 2001-04-25 日本電気株式会社 プラズマcvd装置とそのドライクリーニング方法
US6019060A (en) 1998-06-24 2000-02-01 Lam Research Corporation Cam-based arrangement for positioning confinement rings in a plasma processing chamber
US6350317B1 (en) * 1999-12-30 2002-02-26 Lam Research Corporation Linear drive system for use in a plasma processing system

Also Published As

Publication number Publication date
WO2001050498A1 (en) 2001-07-12
IL150254A0 (en) 2002-12-01
US20040108301A1 (en) 2004-06-10
US6350317B1 (en) 2002-02-26
CN100392792C (zh) 2008-06-04
AU2925701A (en) 2001-07-16
US6863784B2 (en) 2005-03-08
EP1243017A1 (de) 2002-09-25
US20020100555A1 (en) 2002-08-01
US6669811B2 (en) 2003-12-30
JP4991069B2 (ja) 2012-08-01
WO2001050498A9 (en) 2002-12-05
KR100751748B1 (ko) 2007-08-27
DE60127232T2 (de) 2007-11-15
CN1429398A (zh) 2003-07-09
EP1243017B1 (de) 2007-03-14
KR20020063599A (ko) 2002-08-03
JP2003519908A (ja) 2003-06-24

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