DE60127232D1 - Lineare antriebsvorrichtung zur anwendung in einer plasmabehandlungsvorrichtung - Google Patents
Lineare antriebsvorrichtung zur anwendung in einer plasmabehandlungsvorrichtungInfo
- Publication number
- DE60127232D1 DE60127232D1 DE60127232T DE60127232T DE60127232D1 DE 60127232 D1 DE60127232 D1 DE 60127232D1 DE 60127232 T DE60127232 T DE 60127232T DE 60127232 T DE60127232 T DE 60127232T DE 60127232 D1 DE60127232 D1 DE 60127232D1
- Authority
- DE
- Germany
- Prior art keywords
- application
- plasma treatment
- linear drive
- drive device
- treatment device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/474,843 US6350317B1 (en) | 1999-12-30 | 1999-12-30 | Linear drive system for use in a plasma processing system |
US474843 | 1999-12-30 | ||
PCT/US2001/000057 WO2001050498A1 (en) | 1999-12-30 | 2001-01-02 | Linear drive system for use in a plasma processing system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60127232D1 true DE60127232D1 (de) | 2007-04-26 |
DE60127232T2 DE60127232T2 (de) | 2007-11-15 |
Family
ID=23885169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60127232T Expired - Lifetime DE60127232T2 (de) | 1999-12-30 | 2001-01-02 | Lineare antriebsvorrichtung zur anwendung in einer plasmabehandlungsvorrichtung |
Country Status (9)
Country | Link |
---|---|
US (3) | US6350317B1 (de) |
EP (1) | EP1243017B1 (de) |
JP (1) | JP4991069B2 (de) |
KR (1) | KR100751748B1 (de) |
CN (1) | CN100392792C (de) |
AU (1) | AU2925701A (de) |
DE (1) | DE60127232T2 (de) |
IL (1) | IL150254A0 (de) |
WO (1) | WO2001050498A1 (de) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0250853A (ja) * | 1988-08-12 | 1990-02-20 | Nec Corp | 画像形成装置 |
US6350317B1 (en) * | 1999-12-30 | 2002-02-26 | Lam Research Corporation | Linear drive system for use in a plasma processing system |
WO2001052302A1 (en) * | 2000-01-10 | 2001-07-19 | Tokyo Electron Limited | Segmented electrode assembly and method for plasma processing |
GB0019848D0 (en) * | 2000-08-11 | 2000-09-27 | Rtc Systems Ltd | Apparatus and method for coating substrates |
US6492774B1 (en) * | 2000-10-04 | 2002-12-10 | Lam Research Corporation | Wafer area pressure control for plasma confinement |
US6391787B1 (en) * | 2000-10-13 | 2002-05-21 | Lam Research Corporation | Stepped upper electrode for plasma processing uniformity |
US20020142612A1 (en) * | 2001-03-30 | 2002-10-03 | Han-Ming Wu | Shielding plate in plasma for uniformity improvement |
US20030024900A1 (en) * | 2001-07-24 | 2003-02-06 | Tokyo Electron Limited | Variable aspect ratio plasma source |
US6806653B2 (en) * | 2002-01-31 | 2004-10-19 | Tokyo Electron Limited | Method and structure to segment RF coupling to silicon electrode |
US6926803B2 (en) * | 2002-04-17 | 2005-08-09 | Lam Research Corporation | Confinement ring support assembly |
US6936135B2 (en) * | 2002-04-17 | 2005-08-30 | Lam Research Corporation | Twist-N-Lock wafer area pressure ring and assembly for reducing particulate contaminant in a plasma processing chamber |
JP4847009B2 (ja) | 2002-05-23 | 2011-12-28 | ラム リサーチ コーポレーション | 半導体処理プラズマ反応器用の多部品電極および多部品電極の一部を取り換える方法 |
ITBO20020411A1 (it) * | 2002-06-27 | 2003-12-29 | Sir Meccanica S R L | Macchina alesatrice saldatrice portatile |
KR100426816B1 (ko) * | 2002-07-31 | 2004-04-14 | 삼성전자주식회사 | 진공압조절장치가 개선된 플라즈마 처리장치 |
JP2004119448A (ja) * | 2002-09-24 | 2004-04-15 | Nec Kyushu Ltd | プラズマエッチング装置およびプラズマエッチング方法 |
US20040118344A1 (en) | 2002-12-20 | 2004-06-24 | Lam Research Corporation | System and method for controlling plasma with an adjustable coupling to ground circuit |
US20040261712A1 (en) * | 2003-04-25 | 2004-12-30 | Daisuke Hayashi | Plasma processing apparatus |
US7296534B2 (en) * | 2003-04-30 | 2007-11-20 | Tokyo Electron Limited | Hybrid ball-lock attachment apparatus |
US20070286965A1 (en) * | 2006-06-08 | 2007-12-13 | Martin Jay Seamons | Methods for the reduction and elimination of particulate contamination with cvd of amorphous carbon |
US20060043067A1 (en) * | 2004-08-26 | 2006-03-02 | Lam Research Corporation | Yttria insulator ring for use inside a plasma chamber |
US7343842B2 (en) * | 2004-10-28 | 2008-03-18 | Axon Llc | Apparatus for cutting film tubing |
KR100790392B1 (ko) * | 2004-11-12 | 2008-01-02 | 삼성전자주식회사 | 반도체 제조장치 |
KR100598988B1 (ko) * | 2005-05-18 | 2006-07-12 | 주식회사 하이닉스반도체 | 오버레이 버니어 및 이를 이용한 반도체소자의 제조방법 |
US7897217B2 (en) * | 2005-11-18 | 2011-03-01 | Tokyo Electron Limited | Method and system for performing plasma enhanced atomic layer deposition |
JP4865352B2 (ja) * | 2006-02-17 | 2012-02-01 | 三菱重工業株式会社 | プラズマ処理装置及びプラズマ処理方法 |
US7824519B2 (en) * | 2007-05-18 | 2010-11-02 | Lam Research Corporation | Variable volume plasma processing chamber and associated methods |
TWI421360B (zh) * | 2007-12-06 | 2014-01-01 | Intevac Inc | 雙面濺射蝕刻基板之系統與方法(一) |
TWI516175B (zh) * | 2008-02-08 | 2016-01-01 | 蘭姆研究公司 | 在電漿處理腔室中穩定壓力的方法及其程式儲存媒體 |
KR101588482B1 (ko) * | 2008-07-07 | 2016-01-25 | 램 리써치 코포레이션 | 플라즈마 처리 챔버에 사용하기 위한 진공 갭을 포함하는 플라즈마 대향 프로브 장치 |
US8206506B2 (en) * | 2008-07-07 | 2012-06-26 | Lam Research Corporation | Showerhead electrode |
TWI475592B (zh) | 2008-07-07 | 2015-03-01 | Lam Res Corp | 用來偵測電漿處理腔室中之電漿不穩定性的被動電容耦合靜電探針裝置 |
US8161906B2 (en) * | 2008-07-07 | 2012-04-24 | Lam Research Corporation | Clamped showerhead electrode assembly |
US8221582B2 (en) | 2008-07-07 | 2012-07-17 | Lam Research Corporation | Clamped monolithic showerhead electrode |
US8540844B2 (en) * | 2008-12-19 | 2013-09-24 | Lam Research Corporation | Plasma confinement structures in plasma processing systems |
JP2012514703A (ja) * | 2008-12-31 | 2012-06-28 | エフ. ヒメネス、オマール | フレキシャ部材を組み入れた可撓性ジョイント構成 |
US8628577B1 (en) | 2009-03-19 | 2014-01-14 | Ex Technology, Llc | Stable device for intervertebral distraction and fusion |
US8402918B2 (en) * | 2009-04-07 | 2013-03-26 | Lam Research Corporation | Showerhead electrode with centering feature |
US8272346B2 (en) | 2009-04-10 | 2012-09-25 | Lam Research Corporation | Gasket with positioning feature for clamped monolithic showerhead electrode |
US9358125B2 (en) | 2009-07-22 | 2016-06-07 | Spinex Tec, Llc | Coaxial screw gear sleeve mechanism |
KR102219924B1 (ko) * | 2009-08-31 | 2021-02-23 | 램 리써치 코포레이션 | 무선 주파수 (rf) 접지 복귀 장치들 |
US8992722B2 (en) * | 2009-09-01 | 2015-03-31 | Lam Research Corporation | Direct drive arrangement to control confinement rings positioning and methods thereof |
US8419959B2 (en) * | 2009-09-18 | 2013-04-16 | Lam Research Corporation | Clamped monolithic showerhead electrode |
US20110073257A1 (en) * | 2009-09-28 | 2011-03-31 | Rajinder Dhindsa | Unitized confinement ring arrangements and methods thereof |
JP3160877U (ja) * | 2009-10-13 | 2010-07-15 | ラム リサーチ コーポレーションLam Research Corporation | シャワーヘッド電極アセンブリの端部クランプ留めおよび機械固定される内側電極 |
US8636746B2 (en) | 2009-12-31 | 2014-01-28 | Spinex Tec, Llc | Methods and apparatus for insertion of vertebral body distraction and fusion devices |
US9184028B2 (en) * | 2010-08-04 | 2015-11-10 | Lam Research Corporation | Dual plasma volume processing apparatus for neutral/ion flux control |
US20130059448A1 (en) * | 2011-09-07 | 2013-03-07 | Lam Research Corporation | Pulsed Plasma Chamber in Dual Chamber Configuration |
US8573152B2 (en) | 2010-09-03 | 2013-11-05 | Lam Research Corporation | Showerhead electrode |
CN102595764A (zh) * | 2012-03-13 | 2012-07-18 | 苏州爱因智能设备有限公司 | 用于电子直线加速器的自动频率控制驱动装置 |
US8895452B2 (en) | 2012-05-31 | 2014-11-25 | Lam Research Corporation | Substrate support providing gap height and planarization adjustment in plasma processing chamber |
JP5985338B2 (ja) * | 2012-09-28 | 2016-09-06 | 小島プレス工業株式会社 | プラズマcvd装置 |
JP5992288B2 (ja) | 2012-10-15 | 2016-09-14 | 東京エレクトロン株式会社 | ガス導入装置及び誘導結合プラズマ処理装置 |
TWI627305B (zh) * | 2013-03-15 | 2018-06-21 | 應用材料股份有限公司 | 用於轉盤處理室之具有剛性板的大氣蓋 |
US8940049B1 (en) | 2014-04-01 | 2015-01-27 | Ex Technology, Llc | Expandable intervertebral cage |
US9486328B2 (en) | 2014-04-01 | 2016-11-08 | Ex Technology, Llc | Expandable intervertebral cage |
CN104900473B (zh) * | 2015-04-24 | 2017-04-05 | 北京精诚铂阳光电设备有限公司 | 平行度调节装置及cvd生长膜装置 |
US10533251B2 (en) | 2015-12-31 | 2020-01-14 | Lam Research Corporation | Actuator to dynamically adjust showerhead tilt in a semiconductor processing apparatus |
KR101680850B1 (ko) * | 2016-06-28 | 2016-11-29 | 주식회사 기가레인 | 배기유로의 크기가 조절되는 플라즈마 처리 장치 |
US9899193B1 (en) * | 2016-11-02 | 2018-02-20 | Varian Semiconductor Equipment Associates, Inc. | RF ion source with dynamic volume control |
CN107339791A (zh) * | 2017-07-25 | 2017-11-10 | 广东美的制冷设备有限公司 | 百叶驱动装置、空调器的百叶组件和空调器 |
US11670490B2 (en) | 2017-09-29 | 2023-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit fabrication system with adjustable gas injector |
CN111586957B (zh) * | 2019-02-19 | 2021-05-04 | 大连理工大学 | 一种容性耦合等离子体放电装置 |
US11234835B2 (en) | 2019-03-05 | 2022-02-01 | Octagon Spine Llc | Transversely expandable minimally invasive intervertebral cage |
US11497622B2 (en) | 2019-03-05 | 2022-11-15 | Ex Technology, Llc | Transversely expandable minimally invasive intervertebral cage and insertion and extraction device |
CN111863578B (zh) * | 2019-04-28 | 2023-06-16 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理设备 |
US20220298631A1 (en) * | 2019-06-21 | 2022-09-22 | Lam Research Corporation | Bidirectional indexing apparatus |
CN112309807B (zh) * | 2019-08-02 | 2022-12-30 | 中微半导体设备(上海)股份有限公司 | 等离子体刻蚀设备 |
CN113035680A (zh) * | 2019-12-24 | 2021-06-25 | 中微半导体设备(上海)股份有限公司 | 用于真空设备的调平机构和等离子体处理装置 |
WO2022164447A1 (en) * | 2021-01-29 | 2022-08-04 | Applied Materials, Inc. | Cathode drive unit, deposition system, method of operating a deposition system and method of manufacturing a coated substrate |
US20230113063A1 (en) * | 2021-10-11 | 2023-04-13 | Applied Materials, Inc. | Dynamic processing chamber baffle |
US20230114104A1 (en) * | 2021-10-11 | 2023-04-13 | Applied Materials, Inc. | Dynamic processing chamber baffle |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5729577A (en) | 1980-07-30 | 1982-02-17 | Anelva Corp | Automatic continuous sputtering apparatus |
US4478701A (en) * | 1983-12-30 | 1984-10-23 | Rca Corporation | Target support adjusting fixture |
JPS61291032A (ja) | 1985-06-17 | 1986-12-20 | Fujitsu Ltd | 真空装置 |
CN1008932B (zh) * | 1985-11-08 | 1990-07-25 | 冶金工业部北京钢铁设计研究总院 | 数字式脉冲阀系统 |
JPS62158342A (ja) * | 1986-01-06 | 1987-07-14 | Oki Electric Ind Co Ltd | 基板上下装置 |
JPS63193527A (ja) * | 1987-02-06 | 1988-08-10 | Mitsubishi Electric Corp | エツチング装置 |
US4851095A (en) * | 1988-02-08 | 1989-07-25 | Optical Coating Laboratory, Inc. | Magnetron sputtering apparatus and process |
US4944860A (en) * | 1988-11-04 | 1990-07-31 | Eaton Corporation | Platen assembly for a vacuum processing system |
JPH07110991B2 (ja) * | 1989-10-02 | 1995-11-29 | 株式会社日立製作所 | プラズマ処理装置およびプラズマ処理方法 |
JPH03203317A (ja) | 1989-12-29 | 1991-09-05 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
CN2068025U (zh) * | 1990-04-30 | 1990-12-26 | 彭建国 | 多功能汽车半轴套管拉压机 |
US5178739A (en) * | 1990-10-31 | 1993-01-12 | International Business Machines Corporation | Apparatus for depositing material into high aspect ratio holes |
US5284561A (en) * | 1991-11-13 | 1994-02-08 | Materials Research Corporation | Method and apparatus for sputter coating employing machine readable indicia carried by target assembly |
DE69432165T2 (de) * | 1993-03-15 | 2003-12-11 | Kobe Steel Ltd | Vorrichtung und system zum lichtbogenionenplattieren |
US5354413A (en) | 1993-03-18 | 1994-10-11 | Advanced Micro Devices, Inc. | Electrode position controller for a semiconductor etching device |
JPH0786252A (ja) * | 1993-09-20 | 1995-03-31 | Fujitsu Ltd | ドライエッチング装置とドライエッチング方法 |
US5552124A (en) | 1994-06-22 | 1996-09-03 | Applied Materials, Inc. | Stationary focus ring for plasma reactor |
US5534751A (en) * | 1995-07-10 | 1996-07-09 | Lam Research Corporation | Plasma etching apparatus utilizing plasma confinement |
US5672882A (en) | 1995-12-29 | 1997-09-30 | Advanced Micro Devices, Inc. | Ion implantation device with a closed-loop process chamber pressure control system |
US5961798A (en) * | 1996-02-13 | 1999-10-05 | Diamond Black Technologies, Inc. | System and method for vacuum coating of articles having precise and reproducible positioning of articles |
US5889248A (en) * | 1997-09-08 | 1999-03-30 | Abb Power T&D Company Inc. | Operating mechanism for combined interrupter disconnect switch |
JP3161392B2 (ja) * | 1997-11-28 | 2001-04-25 | 日本電気株式会社 | プラズマcvd装置とそのドライクリーニング方法 |
US6019060A (en) | 1998-06-24 | 2000-02-01 | Lam Research Corporation | Cam-based arrangement for positioning confinement rings in a plasma processing chamber |
US6350317B1 (en) * | 1999-12-30 | 2002-02-26 | Lam Research Corporation | Linear drive system for use in a plasma processing system |
-
1999
- 1999-12-30 US US09/474,843 patent/US6350317B1/en not_active Expired - Lifetime
-
2001
- 2001-01-02 CN CNB018058981A patent/CN100392792C/zh not_active Expired - Fee Related
- 2001-01-02 EP EP01939994A patent/EP1243017B1/de not_active Expired - Lifetime
- 2001-01-02 IL IL15025401A patent/IL150254A0/xx not_active IP Right Cessation
- 2001-01-02 AU AU29257/01A patent/AU2925701A/en not_active Abandoned
- 2001-01-02 WO PCT/US2001/000057 patent/WO2001050498A1/en active IP Right Grant
- 2001-01-02 JP JP2001550778A patent/JP4991069B2/ja not_active Expired - Lifetime
- 2001-01-02 DE DE60127232T patent/DE60127232T2/de not_active Expired - Lifetime
- 2001-01-02 KR KR1020027008132A patent/KR100751748B1/ko not_active IP Right Cessation
- 2001-11-05 US US10/012,265 patent/US6669811B2/en not_active Expired - Lifetime
-
2003
- 2003-11-05 US US10/702,682 patent/US6863784B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2001050498A1 (en) | 2001-07-12 |
IL150254A0 (en) | 2002-12-01 |
US20040108301A1 (en) | 2004-06-10 |
US6350317B1 (en) | 2002-02-26 |
CN100392792C (zh) | 2008-06-04 |
AU2925701A (en) | 2001-07-16 |
US6863784B2 (en) | 2005-03-08 |
EP1243017A1 (de) | 2002-09-25 |
US20020100555A1 (en) | 2002-08-01 |
US6669811B2 (en) | 2003-12-30 |
JP4991069B2 (ja) | 2012-08-01 |
WO2001050498A9 (en) | 2002-12-05 |
KR100751748B1 (ko) | 2007-08-27 |
DE60127232T2 (de) | 2007-11-15 |
CN1429398A (zh) | 2003-07-09 |
EP1243017B1 (de) | 2007-03-14 |
KR20020063599A (ko) | 2002-08-03 |
JP2003519908A (ja) | 2003-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60127232D1 (de) | Lineare antriebsvorrichtung zur anwendung in einer plasmabehandlungsvorrichtung | |
DE60136980D1 (de) | Wirbelsäulenimplantat, Antriebswerkzeug und Mutterführung | |
FI20000863A0 (fi) | Uusi hoitomenetelmä | |
DE60028849D1 (de) | Sterilisationsmethode | |
NO20021526D0 (no) | Anordning for kloakkbehandling | |
BR0000174B1 (pt) | dispositivo de acionamento | |
DE50114985D1 (de) | Elektrowerkzeug mit Schnellspanneinrichtung zur Aufnahme eines Werkzeuges | |
EP1210915A3 (de) | Laserbehandlungsgerät | |
EP1455946A4 (de) | Abfallaufbereitungsvorrichtung | |
AU2002360134A1 (en) | Micro- or nano-electronic component comprising a power source and means for protecting the power source | |
DE60219711D1 (de) | Beleuchtungsvorrichtung und -verfahren zur Beleuchtung einer gekrümmten Oberfläche | |
DE60138239D1 (de) | Plasmabehandlungsgerät | |
EP1463585A4 (de) | Abfallbehandlungsvorrichtung | |
DE60134018D1 (de) | Chtung zur anwendung damit | |
AU2001279280A1 (en) | Component source interchange gantry | |
DE50005409D1 (de) | Hör-behandlungsgerät | |
FI20002830A (fi) | Menetelmä ja järjestelmä kaavinterätarpeen hallitsemiseksi | |
AUPR964901A0 (en) | Waste treatment apparatus | |
AU2001244011A1 (en) | Biofiltering device for treating wastewater | |
AU5691400A (en) | Fluid treatment device | |
AU2002231719A1 (en) | Energy-optimized waste treatment apparatus | |
DE29821695U1 (de) | Mikroskop mit Tischantrieb | |
DE10195348D2 (de) | Verfahren zum Betreiben einer Vakuumpumpe und Fördereinheit mit einer Vakuumpumpe | |
AU2002338024A1 (en) | Embroidery surface treating device | |
ES1047333Y (es) | Maquina laminadora perfeccionada |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |