DE60134467D1 - Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat - Google Patents

Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat

Info

Publication number
DE60134467D1
DE60134467D1 DE60134467T DE60134467T DE60134467D1 DE 60134467 D1 DE60134467 D1 DE 60134467D1 DE 60134467 T DE60134467 T DE 60134467T DE 60134467 T DE60134467 T DE 60134467T DE 60134467 D1 DE60134467 D1 DE 60134467D1
Authority
DE
Germany
Prior art keywords
curable composition
layer circuit
film
circuit board
multilayer substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60134467T
Other languages
English (en)
Inventor
Yasuhiro Wakizaka
Kanji Yuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Application granted granted Critical
Publication of DE60134467D1 publication Critical patent/DE60134467D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C08G65/485—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/60—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
DE60134467T 2000-03-30 2001-03-30 Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat Expired - Fee Related DE60134467D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000095184A JP4231976B2 (ja) 2000-03-30 2000-03-30 硬化性組成物及び多層回路基板
PCT/JP2001/002798 WO2001072902A1 (fr) 2000-03-30 2001-03-30 Composition reticulable et substrat de circuit multicouche

Publications (1)

Publication Number Publication Date
DE60134467D1 true DE60134467D1 (de) 2008-07-31

Family

ID=18610117

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60134467T Expired - Fee Related DE60134467D1 (de) 2000-03-30 2001-03-30 Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat

Country Status (7)

Country Link
US (1) US6955848B2 (de)
EP (1) EP1275695B1 (de)
JP (1) JP4231976B2 (de)
KR (1) KR20020086732A (de)
AT (1) ATE398656T1 (de)
DE (1) DE60134467D1 (de)
WO (1) WO2001072902A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4300382B2 (ja) * 2000-03-30 2009-07-22 日本ゼオン株式会社 絶縁材料、絶縁材料の製造方法および多層回路基板の製造方法
JP4770004B2 (ja) * 2000-06-30 2011-09-07 日立化成工業株式会社 樹脂組成物、積層板及び配線板
WO2003087235A1 (fr) * 2002-04-15 2003-10-23 Zeon Corporation Vernis, article façonne, film isolant electrique, stratifie, suspension ignifuge et procede de production de particules ignifuges et de vernis
JP3887357B2 (ja) * 2003-07-30 2007-02-28 日本油脂株式会社 めっき可能な架橋性樹脂組成物、架橋性樹脂成形品および架橋樹脂成形品
JP4694162B2 (ja) * 2004-07-21 2011-06-08 富士フイルム株式会社 硬化性樹脂組成物並びにこれを用いたカラーフィルタ用樹脂皮膜およびカラーフィルタ
WO2007023944A1 (ja) * 2005-08-26 2007-03-01 Zeon Corporation 複合樹脂成形体、積層体、多層回路基板および電子機器
US7758964B2 (en) * 2006-02-10 2010-07-20 3M Innovative Properties Company Flame resistant covercoat for flexible circuit
JP4984743B2 (ja) * 2006-08-24 2012-07-25 日本化成株式会社 架橋剤、架橋性エラストマー組成物およびその成形体、架橋性熱可塑性樹脂組成物およびその成形体
JP5092315B2 (ja) * 2006-08-24 2012-12-05 日本化成株式会社 イソシアヌレート誘導体、架橋剤、架橋性エラストマー組成物およびその成形体、架橋性熱可塑性樹脂組成物およびその成形体
WO2008047583A1 (fr) * 2006-09-29 2008-04-24 Zeon Corporation Composition de résine durcissable, corps composite, corps moulé, lamellé et carte de circuit imprimé multicouche
JP2010077333A (ja) * 2008-09-29 2010-04-08 Fuji Electric Fa Components & Systems Co Ltd 難燃性樹脂組成物
US20100087079A1 (en) * 2008-10-07 2010-04-08 Eumi Pyun Composition, method of making the same, and use therefor
CA2811661C (en) * 2010-09-30 2017-05-30 Dow Global Technologies Llc Method for manufacturing flexible multilayer electrical articles with improved layer adhesion
KR101228734B1 (ko) 2010-11-05 2013-02-01 삼성전기주식회사 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층배선기판
JP5323033B2 (ja) * 2010-12-06 2013-10-23 富士フイルム株式会社 カラーフィルタ用樹脂皮膜およびカラーフィルタ
JP5590245B2 (ja) * 2011-08-23 2014-09-17 日本ゼオン株式会社 硬化性樹脂組成物、フィルム、プリプレグ、積層体、硬化物、及び複合体
CN102926202B (zh) * 2012-09-25 2014-12-03 台州学院 一种阻燃涂层及其制备方法和应用
WO2014091750A1 (ja) * 2012-12-13 2014-06-19 日本ゼオン株式会社 硬化性樹脂組成物、絶縁フィルム、プリプレグ、硬化物、複合体、及び、電子材料用基板
TWI540944B (zh) * 2014-07-14 2016-07-01 啟碁科技股份有限公司 基板結構的製造方法、基板結構以及金屬構件
CN105307378B (zh) * 2014-07-18 2018-10-19 启碁科技股份有限公司 基板结构的制造方法、基板结构以及金属构件
TWI526129B (zh) * 2014-11-05 2016-03-11 Elite Material Co Ltd Multilayer printed circuit boards with dimensional stability
CN113150484B (zh) * 2021-03-23 2022-05-13 浙江大学 一种用于高频覆铜板的coc基复合基板材料及制备方法

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US4292151A (en) * 1978-03-01 1981-09-29 Teijin Limited Process for preparing a cured copolyetherester elastomeric composition
JPS5572304A (en) * 1978-11-28 1980-05-31 Teijin Ltd Insulating material
JPS6055927B2 (ja) * 1978-11-28 1985-12-07 帝人株式会社 電気絶縁材
JPS5698161A (en) * 1980-01-04 1981-08-07 Teijin Ltd Manufacture of conductive composite film
US4691045A (en) * 1984-12-06 1987-09-01 Nippon Shokubai Kagaku Co., Ltd. Hydroxyl group-containing (meth)acrylate oligomer, prepolymer therefrom, and method for use thereof
JPH01174552A (ja) 1987-12-28 1989-07-11 Sakai Chem Ind Co Ltd 塩素含有樹脂組成物
JPH01174522A (ja) * 1987-12-28 1989-07-11 Hitachi Chem Co Ltd 感光性樹脂組成物
JP2857893B2 (ja) 1988-12-21 1999-02-17 三井化学株式会社 難燃性環状オレフィン系重合体組成物
US5180767A (en) 1988-12-21 1993-01-19 Mitsui Petrochemical Industries, Ltd. Flame retardant cyclic olefinic polymer composition
JPH0726014B2 (ja) * 1989-03-08 1995-03-22 旭化成工業株式会社 難燃化樹脂組成物
DE69204689T2 (de) * 1991-01-11 1996-05-09 Asahi Chemical Ind Eine härtbare Polyphenylenetherharzzusammensetzung und eine daraus herstellbare gehärtete Harzzusammensetzung.
JP3282315B2 (ja) * 1993-09-28 2002-05-13 ジェイエスアール株式会社 難燃性樹脂組成物
DE19509173B4 (de) * 1994-03-14 2005-06-16 Nippon Zeon Co., Ltd. Masse aus einem Epoxygruppen enthaltenden thermoplastischen Norbornenharz und ihre Verwendung
JP3361616B2 (ja) * 1994-06-09 2003-01-07 積水化学工業株式会社 ポリオレフィン系難燃架橋性樹脂組成物
JPH08236942A (ja) * 1995-02-28 1996-09-13 Asahi Chem Ind Co Ltd 新しい多層回路基板
JPH10316665A (ja) * 1997-05-13 1998-12-02 Nippon Kasei Chem Co Ltd 置換イソシアヌレートの製造方法
JP3922318B2 (ja) * 1997-09-30 2007-05-30 日本ゼオン株式会社 難燃性樹脂組成物
JPH11189743A (ja) 1997-12-26 1999-07-13 Nippon Zeon Co Ltd 環状オレフィン系樹脂電線被覆材料
JP3952560B2 (ja) * 1997-10-31 2007-08-01 日本ゼオン株式会社 複合フィルム

Also Published As

Publication number Publication date
US20030146421A1 (en) 2003-08-07
JP2001279087A (ja) 2001-10-10
EP1275695A1 (de) 2003-01-15
KR20020086732A (ko) 2002-11-18
US6955848B2 (en) 2005-10-18
EP1275695B1 (de) 2008-06-18
JP4231976B2 (ja) 2009-03-04
WO2001072902A1 (fr) 2001-10-04
EP1275695A4 (de) 2003-08-06
ATE398656T1 (de) 2008-07-15

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee