DE602004020817D1 - Verfahren zur Laserbearbeitung und Vorrichtung zur Laserbearbeitung - Google Patents
Verfahren zur Laserbearbeitung und Vorrichtung zur LaserbearbeitungInfo
- Publication number
- DE602004020817D1 DE602004020817D1 DE602004020817T DE602004020817T DE602004020817D1 DE 602004020817 D1 DE602004020817 D1 DE 602004020817D1 DE 602004020817 T DE602004020817 T DE 602004020817T DE 602004020817 T DE602004020817 T DE 602004020817T DE 602004020817 D1 DE602004020817 D1 DE 602004020817D1
- Authority
- DE
- Germany
- Prior art keywords
- laser processing
- laser
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003025557 | 2003-02-03 | ||
JP2003369929A JP3775410B2 (ja) | 2003-02-03 | 2003-10-30 | レーザー加工方法、レーザー溶接方法並びにレーザー加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004020817D1 true DE602004020817D1 (de) | 2009-06-10 |
Family
ID=32737721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004020817T Expired - Lifetime DE602004020817D1 (de) | 2003-02-03 | 2004-01-29 | Verfahren zur Laserbearbeitung und Vorrichtung zur Laserbearbeitung |
Country Status (5)
Country | Link |
---|---|
US (1) | US7009138B2 (de) |
EP (2) | EP1449610B1 (de) |
JP (1) | JP3775410B2 (de) |
CN (1) | CN1314302C (de) |
DE (1) | DE602004020817D1 (de) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3775410B2 (ja) * | 2003-02-03 | 2006-05-17 | セイコーエプソン株式会社 | レーザー加工方法、レーザー溶接方法並びにレーザー加工装置 |
US7820936B2 (en) * | 2004-07-02 | 2010-10-26 | Boston Scientific Scimed, Inc. | Method and apparatus for controlling and adjusting the intensity profile of a laser beam employed in a laser welder for welding polymeric and metallic components |
JP5420172B2 (ja) * | 2004-10-06 | 2014-02-19 | リモ パテントフェルヴァルトゥング ゲーエムベーハー ウント コー.カーゲー | レーザ装置 |
JP2008544859A (ja) * | 2005-06-29 | 2008-12-11 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | レーザ溶接システム及び方法 |
DE102006042280A1 (de) * | 2005-09-08 | 2007-06-06 | IMRA America, Inc., Ann Arbor | Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser |
DE102006038422A1 (de) * | 2006-08-17 | 2008-02-21 | Bayerische Motoren Werke Ag | Verfahren zum Verbinden mindestens zweier Werkstücke |
JP2008221224A (ja) * | 2007-03-08 | 2008-09-25 | Nuclear Fuel Ind Ltd | レーザ溶接方法およびレーザ溶接装置 |
CN101439431A (zh) * | 2007-11-21 | 2009-05-27 | 新科实业有限公司 | 多束激光接合机及接合方法 |
FR2935621B1 (fr) * | 2008-09-05 | 2011-10-14 | John Sanjay Swamidas | Technique de brasage par laser holographie. |
US8629843B2 (en) * | 2009-10-01 | 2014-01-14 | Blackberry Limited | Piezoelectric assembly |
DE102010016628A1 (de) * | 2010-02-26 | 2011-09-29 | Reis Group Holding Gmbh & Co. Kg | Verfahren und Anordnung zum stoffschlüssigen Verbinden von Materialien |
EP2622400B1 (de) * | 2010-09-27 | 2018-08-29 | JENOPTIK Optical Systems GmbH | Anordnung und verfahren zur erzeugung eines lichtstrahles für die materialbearbeitung |
EP2478990B1 (de) | 2011-01-21 | 2019-04-17 | Leister Technologies AG | Verfahren zum Einstellen eines Laserlichtspots zur Laserbearbeitung von Werkstücken sowie Laseranordnung zur Durchführung des Verfahrens |
US8951819B2 (en) * | 2011-07-11 | 2015-02-10 | Applied Materials, Inc. | Wafer dicing using hybrid split-beam laser scribing process with plasma etch |
CN102500855B (zh) * | 2011-10-25 | 2014-06-25 | 深圳市联赢激光股份有限公司 | 一种用于半导体激光器的锡焊接方法 |
WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
KR20140118554A (ko) * | 2013-03-29 | 2014-10-08 | 삼성디스플레이 주식회사 | 광학계 및 기판 밀봉 방법 |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
CN104923914B (zh) * | 2014-03-20 | 2017-08-22 | 大族激光科技产业集团股份有限公司 | 一种元器件引脚的焊接方法 |
WO2015146591A1 (ja) * | 2014-03-27 | 2015-10-01 | プライムアースEvエナジー 株式会社 | レーザ溶接装置、レーザ溶接方法及び電池ケース |
WO2016007572A1 (en) | 2014-07-08 | 2016-01-14 | Corning Incorporated | Methods and apparatuses for laser processing materials |
EP3536440A1 (de) | 2014-07-14 | 2019-09-11 | Corning Incorporated | Glasartikel mit einem defektweg |
CN208586209U (zh) | 2014-07-14 | 2019-03-08 | 康宁股份有限公司 | 一种用于在工件中形成限定轮廓的多个缺陷的系统 |
CN107073641B (zh) | 2014-07-14 | 2020-11-10 | 康宁股份有限公司 | 接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法 |
WO2016010954A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
WO2016034204A1 (en) * | 2014-09-01 | 2016-03-10 | Toyota Motor Europe Nv/Sa | Systems for and method of welding with a laser beam point linear profile obliquely oriented relative to the travel direction |
JP6487184B2 (ja) * | 2014-11-10 | 2019-03-20 | 株式会社ディスコ | レーザー発振機構 |
US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
KR20170105562A (ko) | 2015-01-12 | 2017-09-19 | 코닝 인코포레이티드 | 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단 |
EP3848334A1 (de) | 2015-03-24 | 2021-07-14 | Corning Incorporated | Erdalkali-boroaluminosilikatglasartikel mit lasergeschnittener kante |
JP2018516215A (ja) | 2015-03-27 | 2018-06-21 | コーニング インコーポレイテッド | 気体透過性窓、および、その製造方法 |
JP6510971B2 (ja) * | 2015-04-17 | 2019-05-08 | 日本特殊陶業株式会社 | 接合体の製造方法、及びスパークプラグの製造方法 |
CN107835794A (zh) | 2015-07-10 | 2018-03-23 | 康宁股份有限公司 | 在挠性基材板中连续制造孔的方法和与此相关的产品 |
EP3184232A1 (de) * | 2015-12-23 | 2017-06-28 | Universität Stuttgart | Bohrvorrichtung, verfahren und verwendung |
EP3957611A1 (de) | 2016-05-06 | 2022-02-23 | Corning Incorporated | Transparente substrate mit verbesserten seiteoberfläschen |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
JP6808130B2 (ja) * | 2016-06-09 | 2021-01-06 | 福井県 | レーザ加工方法およびレーザ加工装置 |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
DE112017003559T5 (de) * | 2016-07-14 | 2019-05-09 | Mitsubishi Electric Corporation | Laserbearbeitungsvorrichtung |
EP3490945B1 (de) | 2016-07-29 | 2020-10-14 | Corning Incorporated | Verfahren zur laserbearbeitung |
US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
EP3848333A1 (de) | 2016-10-24 | 2021-07-14 | Corning Incorporated | Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
CN112658423A (zh) * | 2019-10-15 | 2021-04-16 | 大族激光科技产业集团股份有限公司 | 一种多点同步锡焊方法和多点同步锡焊装置 |
WO2021083487A1 (en) * | 2019-10-28 | 2021-05-06 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Laser system and method for driving a laser system |
CN113798705B (zh) * | 2021-09-07 | 2023-07-07 | 哈尔滨焊接研究院有限公司 | 一种大功率激光焊接特性高通量检测方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3831743A1 (de) | 1988-09-17 | 1990-03-29 | Philips Patentverwaltung | Vorrichtung zur bearbeitung eines werkstueckes mit laserlicht und verwendung dieser vorrichtung |
JP2723798B2 (ja) * | 1994-04-28 | 1998-03-09 | 三菱電機株式会社 | レーザ転写加工装置 |
US6008914A (en) * | 1994-04-28 | 1999-12-28 | Mitsubishi Denki Kabushiki Kaisha | Laser transfer machining apparatus |
JPH08279529A (ja) | 1995-04-05 | 1996-10-22 | Toshiba Corp | 電子部品実装装置及びはんだ付け方法 |
JPH09199845A (ja) | 1996-01-19 | 1997-07-31 | Toshiba Corp | Yagレーザ加熱装置 |
EP0838297A1 (de) * | 1996-08-20 | 1998-04-29 | MTA Automation AG | Lötkopf einer automatischen Lötanlage |
JP2910720B2 (ja) | 1997-03-07 | 1999-06-23 | 日本電気株式会社 | はんだ付け方法 |
DE19983939B4 (de) * | 1999-03-05 | 2005-02-17 | Mitsubishi Denki K.K. | Laserstrahlmaschine |
JP2000280225A (ja) * | 1999-04-02 | 2000-10-10 | Murata Mfg Co Ltd | セラミックグリーンシートの加工方法及び加工装置 |
IL133073A (en) * | 1999-11-22 | 2003-06-24 | Yaakov Amitai | Method and system for treating a target plane with a laser beam |
JP3720681B2 (ja) * | 2000-06-26 | 2005-11-30 | 株式会社ファインディバイス | レーザー式はんだ付け方法及び装置 |
JP3775410B2 (ja) * | 2003-02-03 | 2006-05-17 | セイコーエプソン株式会社 | レーザー加工方法、レーザー溶接方法並びにレーザー加工装置 |
-
2003
- 2003-10-30 JP JP2003369929A patent/JP3775410B2/ja not_active Expired - Fee Related
- 2003-12-30 CN CNB2003101243727A patent/CN1314302C/zh not_active Expired - Fee Related
-
2004
- 2004-01-29 EP EP04001892A patent/EP1449610B1/de not_active Expired - Lifetime
- 2004-01-29 DE DE602004020817T patent/DE602004020817D1/de not_active Expired - Lifetime
- 2004-01-29 US US10/767,857 patent/US7009138B2/en active Active
- 2004-01-29 EP EP07006870A patent/EP1803522A3/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN1520249A (zh) | 2004-08-11 |
EP1803522A2 (de) | 2007-07-04 |
CN1314302C (zh) | 2007-05-02 |
EP1449610A1 (de) | 2004-08-25 |
JP3775410B2 (ja) | 2006-05-17 |
JP2004255461A (ja) | 2004-09-16 |
EP1803522A3 (de) | 2008-06-25 |
US20050035102A1 (en) | 2005-02-17 |
US7009138B2 (en) | 2006-03-07 |
EP1449610B1 (de) | 2009-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |