DE602004020817D1 - Verfahren zur Laserbearbeitung und Vorrichtung zur Laserbearbeitung - Google Patents

Verfahren zur Laserbearbeitung und Vorrichtung zur Laserbearbeitung

Info

Publication number
DE602004020817D1
DE602004020817D1 DE602004020817T DE602004020817T DE602004020817D1 DE 602004020817 D1 DE602004020817 D1 DE 602004020817D1 DE 602004020817 T DE602004020817 T DE 602004020817T DE 602004020817 T DE602004020817 T DE 602004020817T DE 602004020817 D1 DE602004020817 D1 DE 602004020817D1
Authority
DE
Germany
Prior art keywords
laser processing
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004020817T
Other languages
English (en)
Inventor
Jun Amako
Susumu Kayamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE602004020817D1 publication Critical patent/DE602004020817D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
DE602004020817T 2003-02-03 2004-01-29 Verfahren zur Laserbearbeitung und Vorrichtung zur Laserbearbeitung Expired - Lifetime DE602004020817D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003025557 2003-02-03
JP2003369929A JP3775410B2 (ja) 2003-02-03 2003-10-30 レーザー加工方法、レーザー溶接方法並びにレーザー加工装置

Publications (1)

Publication Number Publication Date
DE602004020817D1 true DE602004020817D1 (de) 2009-06-10

Family

ID=32737721

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004020817T Expired - Lifetime DE602004020817D1 (de) 2003-02-03 2004-01-29 Verfahren zur Laserbearbeitung und Vorrichtung zur Laserbearbeitung

Country Status (5)

Country Link
US (1) US7009138B2 (de)
EP (2) EP1449610B1 (de)
JP (1) JP3775410B2 (de)
CN (1) CN1314302C (de)
DE (1) DE602004020817D1 (de)

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DE102006042280A1 (de) * 2005-09-08 2007-06-06 IMRA America, Inc., Ann Arbor Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
DE102006038422A1 (de) * 2006-08-17 2008-02-21 Bayerische Motoren Werke Ag Verfahren zum Verbinden mindestens zweier Werkstücke
JP2008221224A (ja) * 2007-03-08 2008-09-25 Nuclear Fuel Ind Ltd レーザ溶接方法およびレーザ溶接装置
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DE102010016628A1 (de) * 2010-02-26 2011-09-29 Reis Group Holding Gmbh & Co. Kg Verfahren und Anordnung zum stoffschlüssigen Verbinden von Materialien
EP2622400B1 (de) * 2010-09-27 2018-08-29 JENOPTIK Optical Systems GmbH Anordnung und verfahren zur erzeugung eines lichtstrahles für die materialbearbeitung
EP2478990B1 (de) 2011-01-21 2019-04-17 Leister Technologies AG Verfahren zum Einstellen eines Laserlichtspots zur Laserbearbeitung von Werkstücken sowie Laseranordnung zur Durchführung des Verfahrens
US8951819B2 (en) * 2011-07-11 2015-02-10 Applied Materials, Inc. Wafer dicing using hybrid split-beam laser scribing process with plasma etch
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WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
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US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
CN104923914B (zh) * 2014-03-20 2017-08-22 大族激光科技产业集团股份有限公司 一种元器件引脚的焊接方法
WO2015146591A1 (ja) * 2014-03-27 2015-10-01 プライムアースＥｖエナジー 株式会社 レーザ溶接装置、レーザ溶接方法及び電池ケース
WO2016007572A1 (en) 2014-07-08 2016-01-14 Corning Incorporated Methods and apparatuses for laser processing materials
EP3536440A1 (de) 2014-07-14 2019-09-11 Corning Incorporated Glasartikel mit einem defektweg
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
WO2016010954A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
WO2016034204A1 (en) * 2014-09-01 2016-03-10 Toyota Motor Europe Nv/Sa Systems for and method of welding with a laser beam point linear profile obliquely oriented relative to the travel direction
JP6487184B2 (ja) * 2014-11-10 2019-03-20 株式会社ディスコ レーザー発振機構
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
KR20170105562A (ko) 2015-01-12 2017-09-19 코닝 인코포레이티드 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단
EP3848334A1 (de) 2015-03-24 2021-07-14 Corning Incorporated Erdalkali-boroaluminosilikatglasartikel mit lasergeschnittener kante
JP2018516215A (ja) 2015-03-27 2018-06-21 コーニング インコーポレイテッド 気体透過性窓、および、その製造方法
JP6510971B2 (ja) * 2015-04-17 2019-05-08 日本特殊陶業株式会社 接合体の製造方法、及びスパークプラグの製造方法
CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
EP3184232A1 (de) * 2015-12-23 2017-06-28 Universität Stuttgart Bohrvorrichtung, verfahren und verwendung
EP3957611A1 (de) 2016-05-06 2022-02-23 Corning Incorporated Transparente substrate mit verbesserten seiteoberfläschen
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
JP6808130B2 (ja) * 2016-06-09 2021-01-06 福井県 レーザ加工方法およびレーザ加工装置
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
DE112017003559T5 (de) * 2016-07-14 2019-05-09 Mitsubishi Electric Corporation Laserbearbeitungsvorrichtung
EP3490945B1 (de) 2016-07-29 2020-10-14 Corning Incorporated Verfahren zur laserbearbeitung
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
EP3848333A1 (de) 2016-10-24 2021-07-14 Corning Incorporated Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN112658423A (zh) * 2019-10-15 2021-04-16 大族激光科技产业集团股份有限公司 一种多点同步锡焊方法和多点同步锡焊装置
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Also Published As

Publication number Publication date
CN1520249A (zh) 2004-08-11
EP1803522A2 (de) 2007-07-04
CN1314302C (zh) 2007-05-02
EP1449610A1 (de) 2004-08-25
JP3775410B2 (ja) 2006-05-17
JP2004255461A (ja) 2004-09-16
EP1803522A3 (de) 2008-06-25
US20050035102A1 (en) 2005-02-17
US7009138B2 (en) 2006-03-07
EP1449610B1 (de) 2009-04-29

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