DE602005001547D1 - System und Verfahren zur Fehlermarkierung auf einem Substrat bei maskenlosen Anwendungen - Google Patents

System und Verfahren zur Fehlermarkierung auf einem Substrat bei maskenlosen Anwendungen

Info

Publication number
DE602005001547D1
DE602005001547D1 DE602005001547T DE602005001547T DE602005001547D1 DE 602005001547 D1 DE602005001547 D1 DE 602005001547D1 DE 602005001547 T DE602005001547 T DE 602005001547T DE 602005001547 T DE602005001547 T DE 602005001547T DE 602005001547 D1 DE602005001547 D1 DE 602005001547D1
Authority
DE
Germany
Prior art keywords
maskless
applications
substrate
bad marking
marking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005001547T
Other languages
English (en)
Other versions
DE602005001547T2 (de
Inventor
Martinus Hendricus Hendr Hoeks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of DE602005001547D1 publication Critical patent/DE602005001547D1/de
Application granted granted Critical
Publication of DE602005001547T2 publication Critical patent/DE602005001547T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE602005001547T 2004-12-28 2005-12-16 System und Verfahren zur Fehlermarkierung auf einem Substrat bei maskenlosen Anwendungen Active DE602005001547T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/022,926 US7403865B2 (en) 2004-12-28 2004-12-28 System and method for fault indication on a substrate in maskless applications
US22926 2004-12-28

Publications (2)

Publication Number Publication Date
DE602005001547D1 true DE602005001547D1 (de) 2007-08-16
DE602005001547T2 DE602005001547T2 (de) 2008-03-20

Family

ID=35966987

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005001547T Active DE602005001547T2 (de) 2004-12-28 2005-12-16 System und Verfahren zur Fehlermarkierung auf einem Substrat bei maskenlosen Anwendungen

Country Status (8)

Country Link
US (1) US7403865B2 (de)
EP (1) EP1677155B1 (de)
JP (1) JP2006191065A (de)
KR (1) KR100682609B1 (de)
CN (1) CN1797219A (de)
DE (1) DE602005001547T2 (de)
SG (1) SG123751A1 (de)
TW (1) TWI301563B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7403865B2 (en) * 2004-12-28 2008-07-22 Asml Netherlands B.V. System and method for fault indication on a substrate in maskless applications
US8539395B2 (en) * 2010-03-05 2013-09-17 Micronic Laser Systems Ab Method and apparatus for merging multiple geometrical pixel images and generating a single modulator pixel image
JP6795444B2 (ja) * 2017-04-06 2020-12-02 ルネサスエレクトロニクス株式会社 異常検知システム、半導体装置の製造システムおよび製造方法
US11914305B2 (en) * 2020-02-18 2024-02-27 Applied Materials, Inc. Data inspection for digital lithography for HVM using offline and inline approach
CN113534614B (zh) * 2021-06-28 2023-09-19 上海华力集成电路制造有限公司 一种基于扫描式曝光机的动态照明方法

Family Cites Families (29)

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US3875416A (en) * 1970-06-30 1975-04-01 Texas Instruments Inc Methods and apparatus for the production of semiconductor devices by electron-beam patterning and devices produced thereby
US5523193A (en) * 1988-05-31 1996-06-04 Texas Instruments Incorporated Method and apparatus for patterning and imaging member
DE59105735D1 (de) * 1990-05-02 1995-07-20 Fraunhofer Ges Forschung Belichtungsvorrichtung.
US5229872A (en) * 1992-01-21 1993-07-20 Hughes Aircraft Company Exposure device including an electrically aligned electronic mask for micropatterning
US6219015B1 (en) * 1992-04-28 2001-04-17 The Board Of Directors Of The Leland Stanford, Junior University Method and apparatus for using an array of grating light valves to produce multicolor optical images
JPH05313353A (ja) * 1992-05-09 1993-11-26 Asahi Optical Co Ltd マスクフィルム検査装置
JP3224041B2 (ja) * 1992-07-29 2001-10-29 株式会社ニコン 露光方法及び装置
US5729331A (en) * 1993-06-30 1998-03-17 Nikon Corporation Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus
JP3339149B2 (ja) * 1993-12-08 2002-10-28 株式会社ニコン 走査型露光装置ならびに露光方法
US5677703A (en) * 1995-01-06 1997-10-14 Texas Instruments Incorporated Data loading circuit for digital micro-mirror device
US5530482A (en) * 1995-03-21 1996-06-25 Texas Instruments Incorporated Pixel data processing for spatial light modulator having staggered pixels
US6133986A (en) * 1996-02-28 2000-10-17 Johnson; Kenneth C. Microlens scanner for microlithography and wide-field confocal microscopy
EP0956516B1 (de) 1997-01-29 2002-04-10 Micronic Laser Systems Ab Verfahren und gerät zur erzeugung eines musters auf einem mit fotoresist beschichteten substrat mittels fokusiertem laserstrahl
US6177980B1 (en) * 1997-02-20 2001-01-23 Kenneth C. Johnson High-throughput, maskless lithography system
SE509062C2 (sv) 1997-02-28 1998-11-30 Micronic Laser Systems Ab Dataomvandlingsmetod för en laserskrivare med flera strålar för mycket komplexa mikrokolitografiska mönster
US5982553A (en) * 1997-03-20 1999-11-09 Silicon Light Machines Display device incorporating one-dimensional grating light-valve array
SE9800665D0 (sv) * 1998-03-02 1998-03-02 Micronic Laser Systems Ab Improved method for projection printing using a micromirror SLM
SE516914C2 (sv) * 1999-09-09 2002-03-19 Micronic Laser Systems Ab Metoder och rastrerare för högpresterande mönstergenerering
KR100827874B1 (ko) * 2000-05-22 2008-05-07 가부시키가이샤 니콘 노광 장치, 노광 장치의 제조 방법, 노광 방법, 마이크로 장치의 제조 방법, 및 디바이스의 제조 방법
US7302111B2 (en) * 2001-09-12 2007-11-27 Micronic Laser Systems A.B. Graphics engine for high precision lithography
JP3563384B2 (ja) * 2001-11-08 2004-09-08 大日本スクリーン製造株式会社 画像記録装置
KR100674245B1 (ko) * 2001-11-27 2007-01-25 에이에스엠엘 네델란즈 비.브이. 이미징 장치
TWI298825B (en) * 2002-06-12 2008-07-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US6870554B2 (en) * 2003-01-07 2005-03-22 Anvik Corporation Maskless lithography with multiplexed spatial light modulators
EP1482373A1 (de) * 2003-05-30 2004-12-01 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
JP4501481B2 (ja) * 2004-03-22 2010-07-14 セイコーエプソン株式会社 マルチプロジェクションシステムのための画像補正方法
US7020582B1 (en) * 2004-04-28 2006-03-28 Altera Corporation Methods and apparatus for laser marking of integrated circuit faults
US7643192B2 (en) * 2004-11-24 2010-01-05 Asml Holding N.V. Pattern generator using a dual phase step element and method of using same
US7403865B2 (en) * 2004-12-28 2008-07-22 Asml Netherlands B.V. System and method for fault indication on a substrate in maskless applications

Also Published As

Publication number Publication date
US7403865B2 (en) 2008-07-22
EP1677155A1 (de) 2006-07-05
KR100682609B1 (ko) 2007-02-15
US20060142967A1 (en) 2006-06-29
EP1677155B1 (de) 2007-07-04
TW200627089A (en) 2006-08-01
TWI301563B (en) 2008-10-01
JP2006191065A (ja) 2006-07-20
KR20060076751A (ko) 2006-07-04
DE602005001547T2 (de) 2008-03-20
SG123751A1 (en) 2006-07-26
CN1797219A (zh) 2006-07-05

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