DE602005004949D1 - Lithographischer Apparat und Methode zur Herstellung einer Vorrichtung - Google Patents

Lithographischer Apparat und Methode zur Herstellung einer Vorrichtung

Info

Publication number
DE602005004949D1
DE602005004949D1 DE602005004949T DE602005004949T DE602005004949D1 DE 602005004949 D1 DE602005004949 D1 DE 602005004949D1 DE 602005004949 T DE602005004949 T DE 602005004949T DE 602005004949 T DE602005004949 T DE 602005004949T DE 602005004949 D1 DE602005004949 D1 DE 602005004949D1
Authority
DE
Germany
Prior art keywords
making
lithographic apparatus
lithographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005004949T
Other languages
English (en)
Other versions
DE602005004949T2 (de
Inventor
Der Feltz Gustaaf Willem Van
Johan Christiaan Ge Hoefnagels
Cheng-Qun Gui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of DE602005004949D1 publication Critical patent/DE602005004949D1/de
Application granted granted Critical
Publication of DE602005004949T2 publication Critical patent/DE602005004949T2/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
DE602005004949T 2004-03-29 2005-03-15 Lithographischer Apparat und Methode zur Herstellung einer Vorrichtung Expired - Fee Related DE602005004949T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US811070 1985-12-19
US10/811,070 US7561251B2 (en) 2004-03-29 2004-03-29 Lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
DE602005004949D1 true DE602005004949D1 (de) 2008-04-10
DE602005004949T2 DE602005004949T2 (de) 2009-03-12

Family

ID=34887663

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005004949T Expired - Fee Related DE602005004949T2 (de) 2004-03-29 2005-03-15 Lithographischer Apparat und Methode zur Herstellung einer Vorrichtung

Country Status (8)

Country Link
US (2) US7561251B2 (de)
EP (1) EP1582928B1 (de)
JP (1) JP4459850B2 (de)
KR (2) KR20060044936A (de)
CN (1) CN1677246B (de)
DE (1) DE602005004949T2 (de)
SG (1) SG115813A1 (de)
TW (1) TWI282490B (de)

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US20070182808A1 (en) 2005-10-26 2007-08-09 Lars Stiblert Writing apparatuses and methods
KR101415313B1 (ko) * 2006-02-28 2014-07-04 마이크로닉 마이데이터 아베 기판 처리 및 분석용 플랫폼, 장치, 시스템, 그리고 방법
US20090153749A1 (en) * 2007-12-14 2009-06-18 Stephen Randall Mixon Portable projector background color correction scheme
CN102414622A (zh) * 2009-04-27 2012-04-11 Asml荷兰有限公司 光刻设备和检测器设备
KR101698141B1 (ko) * 2009-12-08 2017-01-19 삼성전자 주식회사 마스크리스 노광장치 및 그 제어방법
EP2365390A3 (de) 2010-03-12 2017-10-04 ASML Netherlands B.V. Lithographische Vorrichtung und Verfahren
KR101136722B1 (ko) * 2010-06-30 2012-04-19 (주)인터플렉스 인쇄회로기판 제조방법
WO2014140046A2 (en) 2013-03-12 2014-09-18 Micronic Mydata AB Mechanically produced alignment fiducial method and device
WO2014140047A2 (en) 2013-03-12 2014-09-18 Micronic Mydata AB Method and device for writing photomasks with reduced mura errors
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CN110361938B (zh) * 2018-03-26 2021-03-02 上海微电子装备（集团）股份有限公司 一种曝光方法及半导体器件的制造方法
US10996572B2 (en) * 2019-02-15 2021-05-04 Applied Materials, Inc. Model based dynamic positional correction for digital lithography tools
US11774869B2 (en) 2019-04-10 2023-10-03 Asml Netherlands B.V. Method and system for determining overlay

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Also Published As

Publication number Publication date
US20100014059A1 (en) 2010-01-21
KR20060044936A (ko) 2006-05-16
CN1677246A (zh) 2005-10-05
JP2005286333A (ja) 2005-10-13
EP1582928B1 (de) 2008-02-27
TW200602813A (en) 2006-01-16
KR20070058418A (ko) 2007-06-08
JP4459850B2 (ja) 2010-04-28
DE602005004949T2 (de) 2009-03-12
TWI282490B (en) 2007-06-11
CN1677246B (zh) 2011-09-28
US7561251B2 (en) 2009-07-14
EP1582928A1 (de) 2005-10-05
US20050213067A1 (en) 2005-09-29
US8502954B2 (en) 2013-08-06
SG115813A1 (en) 2005-10-28

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