DE602005024676D1 - Ultraniedriges elektromagnetische störungen abschirmendes gehäuse - Google Patents

Ultraniedriges elektromagnetische störungen abschirmendes gehäuse

Info

Publication number
DE602005024676D1
DE602005024676D1 DE602005024676T DE602005024676T DE602005024676D1 DE 602005024676 D1 DE602005024676 D1 DE 602005024676D1 DE 602005024676 T DE602005024676 T DE 602005024676T DE 602005024676 T DE602005024676 T DE 602005024676T DE 602005024676 D1 DE602005024676 D1 DE 602005024676D1
Authority
DE
Germany
Prior art keywords
frame
lid
flanges
generally
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005024676T
Other languages
English (en)
Inventor
Igor Vinokor
Vladislav Pirkhalo
Anatoliy Shlahtichman
Eugene Smyk
Zoilo Anthony Favela
Gerald R Englich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Publication of DE602005024676D1 publication Critical patent/DE602005024676D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE602005024676T 2004-01-29 2005-01-27 Ultraniedriges elektromagnetische störungen abschirmendes gehäuse Active DE602005024676D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US54018004P 2004-01-29 2004-01-29
PCT/US2005/002997 WO2005072420A2 (en) 2004-01-29 2005-01-27 Ultra-low height electromagnetic interference shielding enclosure

Publications (1)

Publication Number Publication Date
DE602005024676D1 true DE602005024676D1 (de) 2010-12-23

Family

ID=34826197

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005024676T Active DE602005024676D1 (de) 2004-01-29 2005-01-27 Ultraniedriges elektromagnetische störungen abschirmendes gehäuse

Country Status (8)

Country Link
US (3) US7109411B2 (de)
EP (1) EP1738625B1 (de)
JP (1) JP2007520088A (de)
CN (1) CN100566525C (de)
AT (1) ATE488123T1 (de)
DE (1) DE602005024676D1 (de)
TW (1) TWI351918B (de)
WO (1) WO2005072420A2 (de)

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TWI281845B (en) * 2005-06-21 2007-05-21 Yuan Deng Metals Ind Co Ltd Shielding case and the manufacturing method thereof
US7399931B2 (en) * 2006-03-09 2008-07-15 Laird Technologies, Inc. Gaskets for protecting fingerprint readers from electrostatic discharge surges
JP4858254B2 (ja) * 2007-03-26 2012-01-18 カシオ計算機株式会社 構造体の係合装着構造
US7501587B2 (en) * 2007-04-16 2009-03-10 Laird Technologies, Inc. Mounting clips for use with electromagnetic interference shielding and methods of using the same
US7903431B2 (en) * 2007-06-14 2011-03-08 Laird Technologies, Inc. Electromagnetic interference shielding apparatus
CN101340806B (zh) * 2007-07-06 2012-10-31 莱尔德电子材料（上海）有限公司 屏蔽装置和制造屏蔽装置的方法
US7504592B1 (en) * 2007-08-31 2009-03-17 Laird Technologies, Inc. Electromagnetic interference shields and related manufacturing methods
CN101453826B (zh) * 2007-11-28 2011-12-21 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构
US7772505B2 (en) * 2008-02-22 2010-08-10 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus and related methods
CN201230063Y (zh) * 2008-03-25 2009-04-29 富士康(昆山)电脑接插件有限公司 电连接器组件
CN101568250A (zh) * 2008-04-22 2009-10-28 深圳富泰宏精密工业有限公司 电磁波屏蔽装置
CN101578032B (zh) 2008-05-09 2011-06-22 莱尔德电子材料(深圳)有限公司 屏蔽装置和制造屏蔽装置的方法
US7638717B1 (en) * 2008-08-06 2009-12-29 Apple Inc. Can spring housing contact
CN101662924A (zh) * 2008-08-26 2010-03-03 深圳富泰宏精密工业有限公司 电磁屏蔽盖
CN101686630B (zh) * 2008-09-26 2012-07-04 深圳富泰宏精密工业有限公司 屏蔽罩结构
TWI407899B (zh) * 2008-10-17 2013-09-01 Fih Hong Kong Ltd 屏蔽罩結構
CN102036540A (zh) * 2009-09-30 2011-04-27 莱尔德技术股份有限公司 屏蔽外壳
CN102193596A (zh) * 2010-03-02 2011-09-21 鸿富锦精密工业（深圳）有限公司 电子装置壳体
CN102193598A (zh) * 2010-03-05 2011-09-21 鸿富锦精密工业（深圳）有限公司 电子装置壳体
CN201657591U (zh) * 2010-03-08 2010-11-24 国基电子（上海）有限公司 电磁屏蔽装置
CN201700123U (zh) * 2010-03-16 2011-01-05 鸿富锦精密工业（深圳）有限公司 电磁屏蔽装置
KR20130038503A (ko) * 2011-10-10 2013-04-18 삼성전자주식회사 전자장치의 ｐｂａ 적층구조
TWI565399B (zh) * 2012-07-31 2017-01-01 Tdk Taiwan Corp Anti - electromagnetic interference structure of wireless power transmission device
TWI548338B (zh) * 2012-08-07 2016-09-01 緯創資通股份有限公司 屏蔽裝置及具有屏蔽裝置之電子裝置
US9155233B2 (en) 2012-08-31 2015-10-06 Sierra Wireless, Inc. Electromagnetic shield configured to inhibit deformation
US20140218851A1 (en) 2013-02-01 2014-08-07 Microsoft Corporation Shield Can
US9462732B2 (en) 2013-03-13 2016-10-04 Laird Technologies, Inc. Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
CN104093262A (zh) * 2013-04-01 2014-10-08 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN104122937A (zh) * 2013-04-23 2014-10-29 鸿富锦精密工业(武汉)有限公司 接口固定装置
CN203722975U (zh) * 2013-11-19 2014-07-16 中兴通讯股份有限公司 一种移动终端散热装置和屏蔽罩架
KR102223618B1 (ko) * 2014-02-21 2021-03-05 삼성전자주식회사 쉴드캔 고정구조
KR102382008B1 (ko) * 2015-07-30 2022-04-04 삼성전자주식회사 쉴드 커버 및 그것을 포함하는 전자 장치
JP6504116B2 (ja) * 2016-06-20 2019-04-24 京セラドキュメントソリューションズ株式会社 シールド構造、電子機器
CN107801365A (zh) * 2016-09-02 2018-03-13 中兴通讯股份有限公司 屏蔽件、主板、屏蔽套件
TWI612886B (zh) * 2017-03-08 2018-01-21 啓碁科技股份有限公司 電子裝置及其屏蔽罩
US10893636B2 (en) * 2017-03-10 2021-01-12 Laird Technologies Inc. Method for forming a pickup area of a board level shield
JP2018207040A (ja) * 2017-06-08 2018-12-27 株式会社東芝 シールドケース
US10314214B2 (en) * 2017-10-12 2019-06-04 Getac Technology Corporation Vapor chamber with electromagnetic shielding function

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US4626963A (en) * 1985-02-28 1986-12-02 Rca Corporation Wave solderable RF shield member for a printed circuit board
US4754101A (en) 1986-10-23 1988-06-28 Instrument Specialties Co., Inc. Electromagnetic shield for printed circuit board
US5032689A (en) * 1989-08-15 1991-07-16 Halligan Brian S EMI/RFI shielding vent and method of use
US5383098A (en) 1991-09-19 1995-01-17 Motorola, Inc. Shield assembly
FI109960B (fi) * 1991-09-19 2002-10-31 Nokia Corp Elektroninen laite
US5354951A (en) 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
US5422433A (en) 1993-11-15 1995-06-06 Motorola, Inc. Radio frequency isolation shield having reclosable opening
US5436802A (en) 1994-03-16 1995-07-25 Motorola Method and apparatus for shielding an electrical circuit that is disposed on a substrate
US5414597A (en) * 1994-05-04 1995-05-09 Ford Motor Company Shielded circuit module
US5495399A (en) 1994-07-05 1996-02-27 Motorola, Inc. Shield with detachable grasp support member
US5530202A (en) 1995-01-09 1996-06-25 At&T Corp. Metallic RF or thermal shield for automatic vacuum placement
CA2151331A1 (en) * 1995-06-08 1996-12-09 Henry W. C. Mok Emi shield
DE69732174T2 (de) * 1997-03-19 2005-12-29 Telefonaktiebolaget Lm Ericsson (Publ) Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte
WO1999041963A1 (en) * 1998-02-17 1999-08-19 Parker-Hannifin Corporation Emi shielded vent panel and method
US6235985B1 (en) * 1998-04-13 2001-05-22 Lucent Technologies, Inc. Low profile printed circuit board RF shield for radiating pin
US6390320B2 (en) * 1998-04-29 2002-05-21 Cisco Technology, Inc. Easily installable and removable electro-magnetic interference shielding faceplate
US6136131A (en) 1998-06-02 2000-10-24 Instrument Specialties Company, Inc. Method of shielding and obtaining access to a component on a printed circuit board
GB2351183B (en) * 1999-06-18 2003-10-15 Nokia Mobile Phones Ltd Shielding can for a printed circuit board
US6552261B2 (en) 2001-04-27 2003-04-22 Bmi, Inc. Push-fit shield
US6949706B2 (en) * 2001-09-28 2005-09-27 Siemens Information And Communication Mobile, Llc Radio frequency shield for electronic equipment
TWI316387B (en) * 2003-12-30 2009-10-21 Asustek Comp Inc Electronic apparatus and shielding module thereof

Also Published As

Publication number Publication date
EP1738625A2 (de) 2007-01-03
WO2005072420A3 (en) 2006-01-05
US7285732B2 (en) 2007-10-23
TW200541448A (en) 2005-12-16
EP1738625B1 (de) 2010-11-10
US7109411B2 (en) 2006-09-19
US20070012479A1 (en) 2007-01-18
WO2005072420A2 (en) 2005-08-11
US20080000683A1 (en) 2008-01-03
US20050219831A1 (en) 2005-10-06
EP1738625A4 (de) 2009-05-27
JP2007520088A (ja) 2007-07-19
TWI351918B (en) 2011-11-01
CN100566525C (zh) 2009-12-02
CN1914967A (zh) 2007-02-14
US7345248B2 (en) 2008-03-18
ATE488123T1 (de) 2010-11-15

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