DE602006009637D1 - Inspektionssystem und -vorrichtung - Google Patents
Inspektionssystem und -vorrichtungInfo
- Publication number
- DE602006009637D1 DE602006009637D1 DE602006009637T DE602006009637T DE602006009637D1 DE 602006009637 D1 DE602006009637 D1 DE 602006009637D1 DE 602006009637 T DE602006009637 T DE 602006009637T DE 602006009637 T DE602006009637 T DE 602006009637T DE 602006009637 D1 DE602006009637 D1 DE 602006009637D1
- Authority
- DE
- Germany
- Prior art keywords
- sample
- work function
- vibrating
- nvcpd
- vcpd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007689 inspection Methods 0.000 title 1
- 239000000523 sample Substances 0.000 abstract 6
- 238000003384 imaging method Methods 0.000 abstract 2
- 238000011109 contamination Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 238000005259 measurement Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/312—Contactless testing by capacitive methods
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/002—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the work function voltage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N2033/0095—Semiconductive materials
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/078,255 US7107158B2 (en) | 2003-02-03 | 2005-03-11 | Inspection system and apparatus |
PCT/US2006/007872 WO2006098925A1 (en) | 2005-03-11 | 2006-03-06 | Inspection system and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006009637D1 true DE602006009637D1 (de) | 2009-11-19 |
Family
ID=36488556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006009637T Active DE602006009637D1 (de) | 2005-03-11 | 2006-03-06 | Inspektionssystem und -vorrichtung |
Country Status (9)
Country | Link |
---|---|
US (3) | US7107158B2 (de) |
EP (1) | EP1869436B1 (de) |
JP (1) | JP4459289B2 (de) |
KR (1) | KR100950641B1 (de) |
CN (1) | CN101069092B (de) |
AT (1) | ATE445154T1 (de) |
DE (1) | DE602006009637D1 (de) |
TW (1) | TWI317809B (de) |
WO (1) | WO2006098925A1 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7107158B2 (en) * | 2003-02-03 | 2006-09-12 | Qcept Technologies, Inc. | Inspection system and apparatus |
US7579947B2 (en) * | 2005-10-19 | 2009-08-25 | Rosemount Inc. | Industrial process sensor with sensor coating detection |
US7732225B2 (en) * | 2006-06-29 | 2010-06-08 | Texas Instruments Incorporated | Method for measuring contamination in liquids at PPQ levels |
US7659734B2 (en) * | 2007-03-07 | 2010-02-09 | Qcept Technologies, Inc. | Semiconductor inspection system and apparatus utilizing a non-vibrating contact potential difference sensor and controlled illumination |
JP4982213B2 (ja) * | 2007-03-12 | 2012-07-25 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置及び欠陥検査方法 |
US7607647B2 (en) * | 2007-03-20 | 2009-10-27 | Kla-Tencor Technologies Corporation | Stabilizing a substrate using a vacuum preload air bearing chuck |
US7739065B1 (en) * | 2007-06-12 | 2010-06-15 | Pdf Solutions, Incorporated | Inspection plan optimization based on layout attributes and process variance |
US7775856B2 (en) | 2007-09-27 | 2010-08-17 | Applied Materials, Inc. | Method for removal of surface films from reclaim substrates |
US7900526B2 (en) * | 2007-11-30 | 2011-03-08 | Qcept Technologies, Inc. | Defect classification utilizing data from a non-vibrating contact potential difference sensor |
US7944550B2 (en) * | 2008-02-29 | 2011-05-17 | International Business Machines Corporation | System and method for detecting local mechanical stress in integreated devices |
JP2009245991A (ja) * | 2008-03-28 | 2009-10-22 | Tdk Corp | チップ部品の実装装置 |
US7752000B2 (en) * | 2008-05-02 | 2010-07-06 | Qcept Technologies, Inc. | Calibration of non-vibrating contact potential difference measurements to detect surface variations that are perpendicular to the direction of sensor motion |
EP2394294B1 (de) * | 2009-02-03 | 2014-04-02 | Qcept Technologies Inc. | Prüfsystem für strukturierte wafer anhand eines vibrationsfreien kontaktpotenzialdifferenzsensors |
US8549922B2 (en) | 2010-03-10 | 2013-10-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Motion detection using capacitor having different work function materials |
TWI426279B (zh) * | 2011-06-22 | 2014-02-11 | Air Force Inst Of Technology | 電氣線路狀態檢視方法及其檢視溶液 |
CN102840910B (zh) * | 2011-06-23 | 2014-05-14 | 启碁科技股份有限公司 | 具有振动测试功能的电子装置及建立振动测试算法的方法 |
JP6021909B2 (ja) | 2011-07-21 | 2016-11-09 | ブルックス オートメーション インコーポレイテッド | 低温試料グループホルダーにおける寸法変化の補正のための方法と装置 |
US9453801B2 (en) | 2012-05-25 | 2016-09-27 | Kla-Tencor Corporation | Photoemission monitoring of EUV mirror and mask surface contamination in actinic EUV systems |
US20140078495A1 (en) * | 2012-09-14 | 2014-03-20 | Stmicroelectronics, Inc. | Inline metrology for attaining full wafer map of uniformity and surface charge |
TWI525317B (zh) * | 2013-10-08 | 2016-03-11 | 國立清華大學 | 整合影像分析與資料挖礦之自動光學檢測缺陷影像分類方法 |
US9625557B2 (en) | 2014-05-22 | 2017-04-18 | Qcept Investments, Llc | Work function calibration of a non-contact voltage sensor |
US20160013085A1 (en) * | 2014-07-10 | 2016-01-14 | Applied Materials, Inc. | In-Situ Acoustic Monitoring of Chemical Mechanical Polishing |
CN104101824B (zh) * | 2014-07-24 | 2017-06-27 | 上海华力微电子有限公司 | 监控图形晶片栅极氧化层表面的方法 |
CN104103540B (zh) * | 2014-07-24 | 2017-02-15 | 上海华力微电子有限公司 | 监控图形晶片栅极氧化层表面的方法 |
US9766186B2 (en) * | 2014-08-27 | 2017-09-19 | Kla-Tencor Corp. | Array mode repeater detection |
CN107073614B (zh) * | 2015-10-30 | 2019-01-04 | 三菱电机株式会社 | 线放电加工机、线放电加工机的控制装置的控制方法及定位方法 |
US10497092B2 (en) * | 2015-11-19 | 2019-12-03 | Camtek Ltd | Continuous light inspection |
CN106199372A (zh) * | 2016-07-04 | 2016-12-07 | 中国科学院新疆理化技术研究所 | 用于晶片级器件辐射效应试验的x射线辐照测试设备 |
US10388445B2 (en) * | 2016-12-21 | 2019-08-20 | Eaton Intelligent Power Limited | Current sensing circuit and current sensing assembly including the same |
JP2019045231A (ja) * | 2017-08-31 | 2019-03-22 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
DE102017121338A1 (de) | 2017-09-14 | 2019-03-14 | Dürr Dental SE | Verfahren zur Ermittlung der Qualität einer Speicherfolie sowie Speicherfolienscanner hierfür |
KR20200121908A (ko) | 2018-03-13 | 2020-10-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 연마 동안 진동들의 모니터링 |
CN111336792B (zh) * | 2018-12-19 | 2022-03-11 | 江苏鲁汶仪器有限公司 | 一种干燥微水珠的腔体 |
CN110082655A (zh) * | 2019-05-13 | 2019-08-02 | 国网北京市电力公司 | 可视化设备检测方法及仪器及其在智能电网中的应用 |
TWI756836B (zh) * | 2019-09-30 | 2022-03-01 | 台灣積體電路製造股份有限公司 | 量測方法和半導體結構的形成方法 |
US20220230927A1 (en) * | 2021-04-15 | 2022-07-21 | Jnk Tech | Glass and wafer inspection system and a method of use thereof |
US11508590B2 (en) * | 2021-04-15 | 2022-11-22 | Jnk Tech | Substrate inspection system and method of use thereof |
Family Cites Families (76)
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DE297509C (de) | ||||
US4166974A (en) | 1978-01-23 | 1979-09-04 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus and method for measuring capacitive energy |
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JPS6189501A (ja) * | 1984-10-08 | 1986-05-07 | Hitachi Ltd | 境界面測定装置 |
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US5087533A (en) | 1989-10-12 | 1992-02-11 | Brown Paul M | Contact potential difference cell |
DD297509A5 (de) | 1990-03-13 | 1992-01-09 | Kloeden,Rolf,De | Kapazitiver sensor zur beruehrungslosen rauheitsmessung |
DE4018993A1 (de) | 1990-06-13 | 1991-12-19 | Max Planck Inst Eisenforschung | Verfahren und einrichtung zur untersuchung beschichteter metalloberflaechen |
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US7308367B2 (en) * | 2003-02-03 | 2007-12-11 | Qcept Technologies, Inc. | Wafer inspection system |
US7107158B2 (en) * | 2003-02-03 | 2006-09-12 | Qcept Technologies, Inc. | Inspection system and apparatus |
US6957154B2 (en) * | 2003-02-03 | 2005-10-18 | Qcept Technologies, Inc. | Semiconductor wafer inspection system |
CN1523343A (zh) * | 2003-02-20 | 2004-08-25 | 上海市计量测试技术研究院 | 检测n型重掺硅单晶片或锭晶格缺陷的方法 |
US7152476B2 (en) * | 2003-07-25 | 2006-12-26 | Qcept Technologies, Inc. | Measurement of motions of rotating shafts using non-vibrating contact potential difference sensor |
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-
2005
- 2005-03-11 US US11/078,255 patent/US7107158B2/en not_active Expired - Fee Related
-
2006
- 2006-02-24 TW TW095106226A patent/TWI317809B/zh not_active IP Right Cessation
- 2006-03-06 AT AT06737092T patent/ATE445154T1/de not_active IP Right Cessation
- 2006-03-06 EP EP06737092A patent/EP1869436B1/de not_active Not-in-force
- 2006-03-06 KR KR1020077020655A patent/KR100950641B1/ko not_active IP Right Cessation
- 2006-03-06 WO PCT/US2006/007872 patent/WO2006098925A1/en active Application Filing
- 2006-03-06 DE DE602006009637T patent/DE602006009637D1/de active Active
- 2006-03-06 JP JP2008500790A patent/JP4459289B2/ja not_active Expired - Fee Related
- 2006-03-06 CN CN2006800012638A patent/CN101069092B/zh not_active Expired - Fee Related
- 2006-09-12 US US11/519,501 patent/US7337076B2/en not_active Expired - Fee Related
-
2008
- 2008-02-25 US US12/036,897 patent/US7634365B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20070010954A1 (en) | 2007-01-11 |
JP4459289B2 (ja) | 2010-04-28 |
US20080162066A1 (en) | 2008-07-03 |
EP1869436A1 (de) | 2007-12-26 |
WO2006098925A1 (en) | 2006-09-21 |
JP2008536104A (ja) | 2008-09-04 |
US7337076B2 (en) | 2008-02-26 |
ATE445154T1 (de) | 2009-10-15 |
EP1869436B1 (de) | 2009-10-07 |
TW200710386A (en) | 2007-03-16 |
KR100950641B1 (ko) | 2010-04-01 |
KR20070112156A (ko) | 2007-11-22 |
CN101069092B (zh) | 2011-04-27 |
CN101069092A (zh) | 2007-11-07 |
US7634365B2 (en) | 2009-12-15 |
TWI317809B (en) | 2009-12-01 |
US20050162178A1 (en) | 2005-07-28 |
US7107158B2 (en) | 2006-09-12 |
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