DE602007006718D1 - Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Einheit - Google Patents

Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Einheit

Info

Publication number
DE602007006718D1
DE602007006718D1 DE602007006718T DE602007006718T DE602007006718D1 DE 602007006718 D1 DE602007006718 D1 DE 602007006718D1 DE 602007006718 T DE602007006718 T DE 602007006718T DE 602007006718 T DE602007006718 T DE 602007006718T DE 602007006718 D1 DE602007006718 D1 DE 602007006718D1
Authority
DE
Germany
Prior art keywords
producing
light
emitting unit
emitting
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007006718T
Other languages
English (en)
Inventor
Yong Suk Kim
Hoon Hurh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
LG Innotek Co Ltd
Original Assignee
LG Electronics Inc
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Electronics Inc, LG Innotek Co Ltd filed Critical LG Electronics Inc
Publication of DE602007006718D1 publication Critical patent/DE602007006718D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2703—Means for controlling the runner flow, e.g. runner switches, adjustable runners or gates
    • B29C45/2704—Controlling the filling rates or the filling times of two or more mould cavities by controlling the cross section or the length of the runners or the gates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE602007006718T 2006-06-09 2007-02-12 Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Einheit Active DE602007006718D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060052037A KR100789951B1 (ko) 2006-06-09 2006-06-09 발광 유닛 제작 장치 및 방법

Publications (1)

Publication Number Publication Date
DE602007006718D1 true DE602007006718D1 (de) 2010-07-08

Family

ID=38526556

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007006718T Active DE602007006718D1 (de) 2006-06-09 2007-02-12 Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Einheit

Country Status (7)

Country Link
US (2) US7496270B2 (de)
EP (1) EP1864780B1 (de)
JP (3) JP5087294B2 (de)
KR (1) KR100789951B1 (de)
CN (1) CN101085543B (de)
DE (1) DE602007006718D1 (de)
TW (1) TWI426621B (de)

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US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
KR100894561B1 (ko) * 2007-07-13 2009-04-24 (주)마이크로샤인 렌즈 타입의 광 분포/조정 발광 다이오드 패키지 제조 방법
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
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KR100993317B1 (ko) * 2008-08-26 2010-11-09 삼성전기주식회사 발광 다이오드 패키지의 렌즈 제조방법
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
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JP5327042B2 (ja) * 2009-03-26 2013-10-30 豊田合成株式会社 Ｌｅｄランプの製造方法
TWI485878B (zh) * 2009-04-01 2015-05-21 Lite On Technology Corp 形成發光二極體之透鏡結構之方法及其相關架構
KR101092517B1 (ko) * 2009-11-27 2011-12-13 (주)프로맥엘이디 발광 다이오드 패키지 제조 방법
US9379153B2 (en) * 2010-04-22 2016-06-28 Visera Technologies Company Limited Method for forming image sensing device
TWM397030U (en) * 2010-08-16 2011-01-21 Liang Meng Plastic Share Co Ltd LED packaging structure
KR20120105146A (ko) * 2011-03-15 2012-09-25 삼성전자주식회사 발광소자 패키지의 제조장치 및 이를 이용한 발광소자 패키지의 제조방법
KR101762174B1 (ko) 2011-03-25 2017-08-07 삼성전자 주식회사 발광소자 패키지 및 제조방법
JP5659903B2 (ja) * 2011-03-29 2015-01-28 ソニー株式会社 発光素子・受光素子組立体及びその製造方法
US8564004B2 (en) * 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
KR101863547B1 (ko) * 2011-12-16 2018-06-05 삼성전자주식회사 발광소자 패키지에서 리플렉터를 형성하는 방법 및 장치
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
EP2994290B1 (de) 2013-05-10 2023-10-04 ABL IP Holding LLC Silikonoptik
CN107222981B (zh) * 2013-05-20 2019-07-02 日月光半导体制造股份有限公司 电子模块的制造方法
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
KR102277127B1 (ko) 2014-10-17 2021-07-15 삼성전자주식회사 발광소자 패키지
US9970629B2 (en) 2015-10-19 2018-05-15 GE Lighting Solutions, LLC Remote phosphor lighting devices and methods
KR102579748B1 (ko) * 2019-05-08 2023-09-19 삼성전자주식회사 디스플레이 모듈 및 디스플레이 모듈 몰딩 방법
CN114447197A (zh) * 2022-01-25 2022-05-06 金振华 一种led集成封装的复眼阵列透镜制备方法

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Also Published As

Publication number Publication date
US20090136179A1 (en) 2009-05-28
JP2014195083A (ja) 2014-10-09
EP1864780A3 (de) 2008-02-20
KR100789951B1 (ko) 2008-01-03
CN101085543A (zh) 2007-12-12
US20070286550A1 (en) 2007-12-13
KR20070117865A (ko) 2007-12-13
EP1864780A2 (de) 2007-12-12
JP2012235147A (ja) 2012-11-29
TW200746467A (en) 2007-12-16
US7869674B2 (en) 2011-01-11
JP2007329450A (ja) 2007-12-20
US7496270B2 (en) 2009-02-24
JP5087294B2 (ja) 2012-12-05
TWI426621B (zh) 2014-02-11
CN101085543B (zh) 2013-01-23
EP1864780B1 (de) 2010-05-26

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