DE60205560D1 - Eingebaute mikroelektromechanische (MEMS) Sensorvorrichtung für Leistungshalbleiter - Google Patents
Eingebaute mikroelektromechanische (MEMS) Sensorvorrichtung für LeistungshalbleiterInfo
- Publication number
- DE60205560D1 DE60205560D1 DE60205560T DE60205560T DE60205560D1 DE 60205560 D1 DE60205560 D1 DE 60205560D1 DE 60205560 T DE60205560 T DE 60205560T DE 60205560 T DE60205560 T DE 60205560T DE 60205560 D1 DE60205560 D1 DE 60205560D1
- Authority
- DE
- Germany
- Prior art keywords
- microelectromechanical
- mems
- built
- sensor device
- power semiconductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2621—Circuits therefor for testing field effect transistors, i.e. FET's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/146—Measuring arrangements for current not covered by other subgroups of G01R15/14, e.g. using current dividers, shunts, or measuring a voltage drop
- G01R15/148—Measuring arrangements for current not covered by other subgroups of G01R15/14, e.g. using current dividers, shunts, or measuring a voltage drop involving the measuring of a magnetic field or electric field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39731 | 1998-03-16 | ||
| US10/039,731 US6690178B2 (en) | 2001-10-26 | 2001-10-26 | On-board microelectromechanical system (MEMS) sensing device for power semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60205560D1 true DE60205560D1 (de) | 2005-09-22 |
| DE60205560T2 DE60205560T2 (de) | 2006-06-08 |
Family
ID=21907066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60205560T Expired - Lifetime DE60205560T2 (de) | 2001-10-26 | 2002-10-25 | Eingebaute mikroelektromechanische (MEMS) Sensorvorrichtung für Leistungshalbleiter |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6690178B2 (de) |
| EP (1) | EP1306678B1 (de) |
| DE (1) | DE60205560T2 (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6803755B2 (en) * | 1999-09-21 | 2004-10-12 | Rockwell Automation Technologies, Inc. | Microelectromechanical system (MEMS) with improved beam suspension |
| EP1487738B1 (de) * | 2002-03-08 | 2008-09-03 | Cornell Research Foundation, Inc. | Mikroelektromechanische siliziumcarbidbauteile mit elektronischen schaltungen |
| US7113676B2 (en) * | 2003-12-04 | 2006-09-26 | David Piede | Planar waveguide optical isolator in thin silicon-on-isolator (SOI) structure |
| US7112951B2 (en) * | 2004-06-07 | 2006-09-26 | General Electric Company | MEMS based current sensor using magnetic-to-mechanical conversion and reference components |
| US7221144B2 (en) * | 2004-06-07 | 2007-05-22 | General Electric Company | Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivities |
| EP1871527B1 (de) | 2004-12-23 | 2017-09-27 | Abbott Point of Care Inc. | Molekulares diagnostiksystem |
| CN100430740C (zh) * | 2005-06-09 | 2008-11-05 | 中国科学院电子学研究所 | 交错振动式电场传感器 |
| US7132822B1 (en) * | 2006-02-28 | 2006-11-07 | Watlow Electric Manufacturing Company | Multi-processor restart stabilization system and method |
| US8045298B2 (en) * | 2007-12-20 | 2011-10-25 | Hitachi Global Storage Technologies Netherlands B.V. | Three terminal magnetic sensing device having a track width defined in a localized region by a patterned insulator and methods of making the same |
| US8659285B2 (en) * | 2008-10-09 | 2014-02-25 | Nxp B.V. | Current sensor and current sensing method |
| DE102011075047B4 (de) | 2011-05-02 | 2022-03-03 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Erkennen einer Fehlerart in einem Stellgeber |
| US9018937B2 (en) * | 2012-01-17 | 2015-04-28 | Honeywell International Inc. | MEMS-based voltmeter |
| JP6115519B2 (ja) * | 2014-05-27 | 2017-04-19 | セイコーエプソン株式会社 | Ｍｅｍｓ駆動装置、電子機器、及びｍｅｍｓ駆動方法 |
| US10033179B2 (en) | 2014-07-02 | 2018-07-24 | Analog Devices Global Unlimited Company | Method of and apparatus for protecting a switch, such as a MEMS switch, and to a MEMS switch including such a protection apparatus |
| FR3042905B1 (fr) * | 2015-10-23 | 2018-11-16 | Vmicro | Dispositif et systeme microelectromecanique avec transducteur resistif a faible impedance |
| JP6546576B2 (ja) * | 2016-10-11 | 2019-07-17 | 矢崎総業株式会社 | 電圧センサ |
| US20220368249A1 (en) * | 2020-12-18 | 2022-11-17 | Board Of Regents, The University Of Texas System | MEMS Nanopositioner and Method of Fabrication |
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| EP0369593B1 (de) | 1988-10-06 | 1993-12-22 | Lucas Industries Public Limited Company | Verarbeitungsschaltung für einen Reluktanzumformer |
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| US5025346A (en) | 1989-02-17 | 1991-06-18 | Regents Of The University Of California | Laterally driven resonant microstructures |
| EP0459723B1 (de) | 1990-05-30 | 1996-01-17 | Hitachi, Ltd. | Halbleiterbeschleunigungsmesser und Kraftfahrzeugsteuerungssystem mit einem solchen |
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-
2001
- 2001-10-26 US US10/039,731 patent/US6690178B2/en not_active Expired - Fee Related
-
2002
- 2002-10-25 EP EP02023958A patent/EP1306678B1/de not_active Expired - Fee Related
- 2002-10-25 DE DE60205560T patent/DE60205560T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1306678B1 (de) | 2005-08-17 |
| EP1306678A1 (de) | 2003-05-02 |
| US6690178B2 (en) | 2004-02-10 |
| DE60205560T2 (de) | 2006-06-08 |
| US20030080754A1 (en) | 2003-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |