DE60206082D1 - Kostengünstiges elektronisches modul und herstellungsverfahren dafür - Google Patents

Kostengünstiges elektronisches modul und herstellungsverfahren dafür

Info

Publication number: DE60206082D1
Authority: DE; Germany
Prior art keywords: manufacturing; cost; electronic module; method therefor; effective electronic
Prior art date: 2001-12-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60206082T

Other languages

English (en)

Inventor

Francois Droz

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NID SA

Original Assignee

NID SA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-12-11

Filing date

2002-12-10

Publication date

2005-10-13

2002-12-10 Application filed by NID SA filed Critical NID SA

2005-10-13 Application granted granted Critical

2005-10-13 Publication of DE60206082D1 publication Critical patent/DE60206082D1/de

2022-12-11 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices

DE60206082T 2001-12-11 2002-12-10 Kostengünstiges elektronisches modul und herstellungsverfahren dafür Expired - Lifetime DE60206082D1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
CH22582001		2001-12-11
PCT/IB2002/005291 WO2003049894A1 (fr)	2001-12-11	2002-12-10	Module electronique a faible cout et procede de fabrication d'un tel module

Publications (1)

Publication Number	Publication Date
DE60206082D1 true DE60206082D1 (de)	2005-10-13

Family

ID=4568259

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60206082T Expired - Lifetime DE60206082D1 (de)	2001-12-11	2002-12-10	Kostengünstiges elektronisches modul und herstellungsverfahren dafür

Country Status (15)

Country	Link
US (1)	US20050085005A1 (de)
EP (1)	EP1485226B1 (de)
JP (1)	JP2005530218A (de)
KR (1)	KR20040073465A (de)
CN (1)	CN1602235A (de)
AR (1)	AR037813A1 (de)
AT (1)	ATE303877T1 (de)
AU (1)	AU2002366586A1 (de)
BR (1)	BR0214636A (de)
CA (1)	CA2468516A1 (de)
DE (1)	DE60206082D1 (de)
MX (1)	MXPA04005575A (de)
RU (1)	RU2004116272A (de)
TW (1)	TW200300990A (de)
WO (1)	WO2003049894A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8316535B2 (en) *	2002-10-11	2012-11-27	Nagraid Sa	Electronic device comprising a visible electronic element connected to an internal module and manufacturing process of such a device
PA8584401A1 (es) *	2002-10-11	2005-02-04	Nagraid Sa	Modulo electronico que implica un elemento aparente sobre una cara y metodo de fabricacion de tal modulo
AU2007314354A1 (en) *	2006-10-31	2008-05-08	Solicore, Inc.	Powered authenticating cards
WO2008054715A2 (en) *	2006-10-31	2008-05-08	Solicore, Inc.	Powered print advertisements, product packaging, and trading cards
US8181879B2 (en) *	2006-12-29	2012-05-22	Solicore, Inc.	Mailing apparatus for powered cards
WO2008082616A1 (en) *	2006-12-29	2008-07-10	Solicore, Inc.	Card configured to receive separate battery
WO2010070964A1 (ja) *	2008-12-16	2010-06-24	株式会社村田製作所	回路モジュール及びその管理方法
JP2012160216A (ja) *	2012-05-30	2012-08-23	Toshiba Corp	非接触式リーダライタ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5637925A (en) *	1988-02-05	1997-06-10	Raychem Ltd	Uses of uniaxially electrically conductive articles
US5631447A (en) *	1988-02-05	1997-05-20	Raychem Limited	Uses of uniaxially electrically conductive articles
DE19516250C1 (de) *	1995-04-26	1996-07-04	Mannesmann Ag	Verfahren zum Verbinden eines mikromechanischen Drucksensors mit einem Anschlußstück
US5904992A (en) *	1996-09-26	1999-05-18	Mcdonnell Douglas Corporation	Floating superplastic forming/diffusion bonding die, product and process

2002
- 2002-12-09 TW TW091135558A patent/TW200300990A/zh unknown
- 2002-12-10 RU RU2004116272/02A patent/RU2004116272A/ru not_active Application Discontinuation
- 2002-12-10 JP JP2003550936A patent/JP2005530218A/ja active Pending
- 2002-12-10 BR BR0214636-3A patent/BR0214636A/pt not_active IP Right Cessation
- 2002-12-10 AT AT02804647T patent/ATE303877T1/de not_active IP Right Cessation
- 2002-12-10 EP EP02804647A patent/EP1485226B1/de not_active Expired - Lifetime
- 2002-12-10 WO PCT/IB2002/005291 patent/WO2003049894A1/fr active IP Right Grant
- 2002-12-10 AR ARP020104773A patent/AR037813A1/es unknown
- 2002-12-10 CN CNA028248066A patent/CN1602235A/zh active Pending
- 2002-12-10 CA CA002468516A patent/CA2468516A1/en not_active Abandoned
- 2002-12-10 AU AU2002366586A patent/AU2002366586A1/en not_active Abandoned
- 2002-12-10 DE DE60206082T patent/DE60206082D1/de not_active Expired - Lifetime
- 2002-12-10 MX MXPA04005575A patent/MXPA04005575A/es unknown
- 2002-12-10 US US10/497,822 patent/US20050085005A1/en not_active Abandoned
- 2002-12-10 KR KR10-2004-7008869A patent/KR20040073465A/ko not_active Application Discontinuation

Also Published As

Publication number	Publication date
BR0214636A (pt)	2004-11-03
KR20040073465A (ko)	2004-08-19
AU2002366586A1 (en)	2003-06-23
EP1485226A1 (de)	2004-12-15
EP1485226B1 (de)	2005-09-07
CA2468516A1 (en)	2003-06-19
CN1602235A (zh)	2005-03-30
RU2004116272A (ru)	2005-06-10
WO2003049894A1 (fr)	2003-06-19
US20050085005A1 (en)	2005-04-21
MXPA04005575A (es)	2004-12-06
TW200300990A (en)	2003-06-16
JP2005530218A (ja)	2005-10-06
AR037813A1 (es)	2004-12-09
ATE303877T1 (de)	2005-09-15

Similar Documents

Publication	Publication Date	Title
NO20034071D0 (no)	2003-09-15	Elektronisk modul omfattende kjölesubstrat og relaterte metoder
DE60037057D1 (de)	2007-12-27	Halbleiterelement und Herstellungsverfahren dafür
DE60030931D1 (de)	2006-11-09	Halbleiteranordnung und Herstellungsverfahren dafür
DE69938767D1 (de)	2008-07-03	Halbleiterbauelement und dessen herstellungsverfahren, bauelementsubstrat, und elektronisches bauelement
DE60319898D1 (de)	2008-05-08	Halbleiter-Bauelement und Herstellungsverfahren
EP1489657A4 (de)	2011-06-29	Halbleiterchip-anbringplatte, verfahren zu ihrer herstellung und halbleitermodul
EP1494285A4 (de)	2006-05-17	Schaltungsmodul und verfahren zu seiner herstellung
NO20006133D0 (no)	2000-12-01	Elektronisk halvlederkomponent
DE60230840D1 (de)	2009-03-05	Halbleiteranordnung und Herstellungsverfahren dafür
DE60220762D1 (de)	2007-08-02	Halbleiterbauelement und zugehöriges Herstellungsverfahren
NO20034070D0 (no)	2003-09-15	Elektronisk modul omfattende et kjölesubstrat med fluid- dissosierende elektroder, og relaterte metoder
DE60231538D1 (de)	2009-04-23	Sputtertarget und herstellungsverfahren dafür
DE60210834D1 (de)	2006-06-01	Halbleiterbauelement und zugehöriges Herstellungsverfahren
GB2382923B (en)	2004-05-05	Semiconductor integrated circuit and its layout method
DE60134189D1 (de)	2008-07-10	Halbleiteranordnung und Herstellungsverfahren
DE60322190D1 (de)	2008-08-28	Halbleiteranordnung und entsprechendes Herstellungsverfahren
SG111128A1 (en)	2005-05-30	Integrated circuit package and manufacturing method therefor
DE60206082D1 (de)	2005-10-13	Kostengünstiges elektronisches modul und herstellungsverfahren dafür
DE60227139D1 (de)	2008-07-31	Halbleiter-IC-Module, Herstellungsmethode und Verwendung
DE60302916D1 (de)	2006-02-02	Halbleiterlaser und Herstellungsverfahren
DE60231784D1 (de)	2009-05-14	Überbrückungs-Chipbauteil und Montierungsanordnung dafür
DE60236994D1 (de)	2010-08-26	Halbleiterbauelement und dessen Herstellungsverfahren
DE60239246D1 (de)	2011-04-07	Elektronischer Leistungsmodul und Leistungsbauelement für diesen Modul
DE60207179D1 (de)	2005-12-15	Airbag Modul
ATE391252T1 (de)	2008-04-15	Riemen mit niedrigem modul

Legal Events

Date	Code	Title	Description
2006-08-10	8332	No legal effect for de