DE60213981D1 - Element zur spannungsentlastung für einen beschleunigungssensor - Google Patents

Element zur spannungsentlastung für einen beschleunigungssensor

Info

Publication number
DE60213981D1
DE60213981D1 DE60213981T DE60213981T DE60213981D1 DE 60213981 D1 DE60213981 D1 DE 60213981D1 DE 60213981 T DE60213981 T DE 60213981T DE 60213981 T DE60213981 T DE 60213981T DE 60213981 D1 DE60213981 D1 DE 60213981D1
Authority
DE
Germany
Prior art keywords
acceleration sensor
voltage relief
relief
voltage
acceleration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60213981T
Other languages
English (en)
Other versions
DE60213981T2 (de
Inventor
David Malametz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of DE60213981D1 publication Critical patent/DE60213981D1/de
Application granted granted Critical
Publication of DE60213981T2 publication Critical patent/DE60213981T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/006—Details of instruments used for thermal compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0181—See-saws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/058—Rotation out of a plane parallel to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0133—Wet etching
DE60213981T 2001-05-15 2002-04-05 Element zur spannungsentlastung für einen beschleunigungssensor Expired - Lifetime DE60213981T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29124501P 2001-05-15 2001-05-15
US291245P 2001-05-15
PCT/US2002/010578 WO2002093180A1 (en) 2001-05-15 2002-04-05 Accelerometer strain relief structure

Publications (2)

Publication Number Publication Date
DE60213981D1 true DE60213981D1 (de) 2006-09-28
DE60213981T2 DE60213981T2 (de) 2007-08-30

Family

ID=23119513

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60213981T Expired - Lifetime DE60213981T2 (de) 2001-05-15 2002-04-05 Element zur spannungsentlastung für einen beschleunigungssensor

Country Status (7)

Country Link
US (1) US6634231B2 (de)
EP (1) EP1395835B1 (de)
JP (1) JP2004530134A (de)
KR (1) KR20030097874A (de)
CN (1) CN1656382A (de)
DE (1) DE60213981T2 (de)
WO (1) WO2002093180A1 (de)

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US6618654B1 (en) * 2002-10-25 2003-09-09 The Boeing Company Method and system for discovering and recovering unused service life
US6912902B2 (en) * 2003-03-26 2005-07-05 Honeywell International Inc. Bending beam accelerometer with differential capacitive pickoff
US7069790B1 (en) * 2005-05-17 2006-07-04 Honeywell International Inc. Systems and methods for measuring relative thermal expansion coefficient of low thermal coefficient of expansion materials
FR2887989B1 (fr) * 2005-07-04 2007-09-07 Sagem Defense Securite Capteur inertiel a courant perturbateur reduit par branches de compensation
JP4486025B2 (ja) * 2005-11-15 2010-06-23 アルプス電気株式会社 荷重センサ
US8499629B2 (en) * 2008-10-10 2013-08-06 Honeywell International Inc. Mounting system for torsional suspension of a MEMS device
IT1395419B1 (it) 2009-09-07 2012-09-14 Milano Politecnico Accelerometro risonante mems con migliorate caretteristiche elettriche
JP5375624B2 (ja) * 2010-01-18 2013-12-25 セイコーエプソン株式会社 加速度センサー、及び加速度検出装置
FR2957414B1 (fr) * 2010-03-15 2012-09-28 Commissariat Energie Atomique Capteur de force a bruit reduit
FR2966813A1 (fr) * 2010-10-29 2012-05-04 Thales Sa Microsysteme electromecanique (mems).
IT1405796B1 (it) 2010-11-26 2014-01-24 St Microelectronics Srl Struttura di accelerometro biassiale risonante di tipo microelettromeccanico
JP5678741B2 (ja) * 2011-03-11 2015-03-04 セイコーエプソン株式会社 加速度検出器、加速度検出デバイス及び電子機器
JP5688641B2 (ja) * 2011-05-18 2015-03-25 日本電信電話株式会社 微小機械振動子の製造方法および微小機械振動子
JP2012242343A (ja) * 2011-05-24 2012-12-10 Seiko Epson Corp 加速度センサー及び加速度検出装置
JP5950087B2 (ja) * 2012-03-27 2016-07-13 セイコーエプソン株式会社 物理量検出デバイス、物理量検出器、および電子機器
WO2014077299A1 (ja) * 2012-11-19 2014-05-22 株式会社村田製作所 角加速度センサ
KR101454123B1 (ko) * 2013-08-29 2014-10-22 삼성전기주식회사 가속도 센서
US9658244B2 (en) * 2014-07-08 2017-05-23 Honeywell International Inc. Reducing hysteresis effects in accelerometer
US9705432B2 (en) * 2014-09-30 2017-07-11 Apple Inc. Micro pick up array pivot mount design for strain amplification
US9689888B2 (en) 2014-11-14 2017-06-27 Honeywell International Inc. In-plane vibrating beam accelerometer
US10823754B2 (en) 2014-11-14 2020-11-03 Honeywell International Inc. Accelerometer with strain compensation
CN105699693B (zh) 2014-12-11 2019-04-12 意法半导体股份有限公司 具有减少漂移功能的z轴微机电检测结构
JP6476869B2 (ja) * 2015-01-06 2019-03-06 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
ITUB20154667A1 (it) * 2015-10-14 2017-04-14 St Microelectronics Srl Dispositivo sensore microelettromeccanico con ridotta sensibilita' agli stress
CN105866470A (zh) * 2016-05-05 2016-08-17 中国工程物理研究院电子工程研究所 一种一体式石英双振梁加速度计
CN107015025B (zh) * 2017-05-12 2019-06-25 北京航空航天大学 一种差动式石墨烯谐振梁加速度传感器
US11686581B2 (en) * 2020-06-08 2023-06-27 Analog Devices, Inc. Stress-relief MEMS gyroscope
US11692825B2 (en) 2020-06-08 2023-07-04 Analog Devices, Inc. Drive and sense stress relief apparatus
US11698257B2 (en) 2020-08-24 2023-07-11 Analog Devices, Inc. Isotropic attenuated motion gyroscope

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165279A (en) * 1989-07-06 1992-11-24 Sundstrand Corporation Monolithic accelerometer with flexurally mounted force transducer
US5097172A (en) * 1990-07-20 1992-03-17 Sundstrand Data Control, Inc. Mounting system for transducer
US5241862A (en) * 1990-12-24 1993-09-07 Litton Systems, Inc. Integrated accelerometer with single hardstop geometry
US5205171A (en) 1991-01-11 1993-04-27 Northrop Corporation Miniature silicon accelerometer and method
US5331853A (en) * 1991-02-08 1994-07-26 Alliedsignal Inc. Micromachined rate and acceleration sensor
US5241861A (en) * 1991-02-08 1993-09-07 Sundstrand Corporation Micromachined rate and acceleration sensor
US5289719A (en) * 1991-11-13 1994-03-01 New Sd, Inc. Accelerometer with temperature compensation and matched force transducers
US5349855A (en) 1992-04-07 1994-09-27 The Charles Stark Draper Laboratory, Inc. Comb drive micromechanical tuning fork gyro
US5650568A (en) 1993-02-10 1997-07-22 The Charles Stark Draper Laboratory, Inc. Gimballed vibrating wheel gyroscope having strain relief features
US5948981A (en) 1996-05-21 1999-09-07 Alliedsignal Inc. Vibrating beam accelerometer
DE69718467T2 (de) 1996-06-11 2003-09-25 Allied Signal Inc Kompensation von nichtlinearitäten zweiter ordnung in sensoren mit doppelend-stimmgabeln
US5996411A (en) * 1996-11-25 1999-12-07 Alliedsignal Inc. Vibrating beam accelerometer and method for manufacturing the same
DE19817357B4 (de) * 1998-04-18 2008-10-30 Robert Bosch Gmbh Mikromechanisches Bauelement
US6257060B1 (en) * 1999-06-22 2001-07-10 Alliedsignal Inc. Combined enhanced shock load capability and stress isolation structure for an improved performance silicon micro-machined accelerometer
FR2808264B1 (fr) * 2000-04-28 2002-06-07 Commissariat Energie Atomique Structure mecanique micro-usinee et dispositif incorporant la structure

Also Published As

Publication number Publication date
EP1395835A1 (de) 2004-03-10
US6634231B2 (en) 2003-10-21
KR20030097874A (ko) 2003-12-31
US20020170355A1 (en) 2002-11-21
WO2002093180A1 (en) 2002-11-21
JP2004530134A (ja) 2004-09-30
CN1656382A (zh) 2005-08-17
DE60213981T2 (de) 2007-08-30
EP1395835B1 (de) 2006-08-16

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