DE60220912D1 - Speichervorrichtung mit einem sich selbst einbauenden polymer und verfahren zur herstellung derselben - Google Patents

Speichervorrichtung mit einem sich selbst einbauenden polymer und verfahren zur herstellung derselben

Info

Publication number
DE60220912D1
DE60220912D1 DE60220912T DE60220912T DE60220912D1 DE 60220912 D1 DE60220912 D1 DE 60220912D1 DE 60220912 T DE60220912 T DE 60220912T DE 60220912 T DE60220912 T DE 60220912T DE 60220912 D1 DE60220912 D1 DE 60220912D1
Authority
DE
Germany
Prior art keywords
self
production
memory device
installing
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60220912T
Other languages
English (en)
Other versions
DE60220912T2 (de
Inventor
Juri H Krieger
Nikolay F Yudanov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE60220912D1 publication Critical patent/DE60220912D1/de
Publication of DE60220912T2 publication Critical patent/DE60220912T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0014RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5664Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using organic memory material storage elements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0014RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • G11C13/0016RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Memories (AREA)
DE60220912T 2001-05-07 2002-05-07 Speichervorrichtung mit einem sich selbst einbauenden polymer und verfahren zur herstellung derselben Expired - Lifetime DE60220912T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US28905401P 2001-05-07 2001-05-07
US289054P 2001-05-07
PCT/US2002/014236 WO2002091384A1 (en) 2001-05-07 2002-05-07 A memory device with a self-assembled polymer film and method of making the same

Publications (2)

Publication Number Publication Date
DE60220912D1 true DE60220912D1 (de) 2007-08-09
DE60220912T2 DE60220912T2 (de) 2008-02-28

Family

ID=23109830

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60220912T Expired - Lifetime DE60220912T2 (de) 2001-05-07 2002-05-07 Speichervorrichtung mit einem sich selbst einbauenden polymer und verfahren zur herstellung derselben

Country Status (7)

Country Link
US (2) US6855977B2 (de)
EP (1) EP1397809B1 (de)
JP (1) JP4886160B2 (de)
KR (1) KR100900080B1 (de)
CN (1) CN100403450C (de)
DE (1) DE60220912T2 (de)
WO (1) WO2002091384A1 (de)

Families Citing this family (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6727192B2 (en) 2001-03-01 2004-04-27 Micron Technology, Inc. Methods of metal doping a chalcogenide material
US6818481B2 (en) 2001-03-07 2004-11-16 Micron Technology, Inc. Method to manufacture a buried electrode PCRAM cell
US6734455B2 (en) 2001-03-15 2004-05-11 Micron Technology, Inc. Agglomeration elimination for metal sputter deposition of chalcogenides
EP1388179A1 (de) 2001-05-07 2004-02-11 Advanced Micro Devices, Inc. Schaltelement mit speichereffekt
WO2002091385A1 (en) * 2001-05-07 2002-11-14 Advanced Micro Devices, Inc. Molecular memory cell
US6627944B2 (en) 2001-05-07 2003-09-30 Advanced Micro Devices, Inc. Floating gate memory device using composite molecular material
US6781868B2 (en) 2001-05-07 2004-08-24 Advanced Micro Devices, Inc. Molecular memory device
JP4886160B2 (ja) * 2001-05-07 2012-02-29 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド セルフアセンブリによるポリマーフィルムを用いた記憶装置およびその製造方法
US6844608B2 (en) 2001-05-07 2005-01-18 Advanced Micro Devices, Inc. Reversible field-programmable electric interconnects
US7102150B2 (en) 2001-05-11 2006-09-05 Harshfield Steven T PCRAM memory cell and method of making same
US6838720B2 (en) * 2001-08-13 2005-01-04 Advanced Micro Devices, Inc. Memory device with active passive layers
US6806526B2 (en) 2001-08-13 2004-10-19 Advanced Micro Devices, Inc. Memory device
US6858481B2 (en) * 2001-08-13 2005-02-22 Advanced Micro Devices, Inc. Memory device with active and passive layers
US6768157B2 (en) 2001-08-13 2004-07-27 Advanced Micro Devices, Inc. Memory device
EP1434232B1 (de) 2001-08-13 2007-09-19 Advanced Micro Devices, Inc. Speicherzelle
US6737312B2 (en) 2001-08-27 2004-05-18 Micron Technology, Inc. Method of fabricating dual PCRAM cells sharing a common electrode
US6881623B2 (en) 2001-08-29 2005-04-19 Micron Technology, Inc. Method of forming chalcogenide comprising devices, method of forming a programmable memory cell of memory circuitry, and a chalcogenide comprising device
US6955940B2 (en) 2001-08-29 2005-10-18 Micron Technology, Inc. Method of forming chalcogenide comprising devices
US6646902B2 (en) 2001-08-30 2003-11-11 Micron Technology, Inc. Method of retaining memory state in a programmable conductor RAM
US6709958B2 (en) * 2001-08-30 2004-03-23 Micron Technology, Inc. Integrated circuit device and fabrication using metal-doped chalcogenide materials
US6815818B2 (en) 2001-11-19 2004-11-09 Micron Technology, Inc. Electrode structure for use in an integrated circuit
US6791859B2 (en) 2001-11-20 2004-09-14 Micron Technology, Inc. Complementary bit PCRAM sense amplifier and method of operation
US20030143782A1 (en) 2002-01-31 2003-07-31 Gilton Terry L. Methods of forming germanium selenide comprising devices and methods of forming silver selenide comprising structures
US6791885B2 (en) 2002-02-19 2004-09-14 Micron Technology, Inc. Programmable conductor random access memory and method for sensing same
US6847535B2 (en) 2002-02-20 2005-01-25 Micron Technology, Inc. Removable programmable conductor memory card and associated read/write device and method of operation
US6809362B2 (en) 2002-02-20 2004-10-26 Micron Technology, Inc. Multiple data state memory cell
US7151273B2 (en) 2002-02-20 2006-12-19 Micron Technology, Inc. Silver-selenide/chalcogenide glass stack for resistance variable memory
US6849868B2 (en) 2002-03-14 2005-02-01 Micron Technology, Inc. Methods and apparatus for resistance variable material cells
US6751114B2 (en) 2002-03-28 2004-06-15 Micron Technology, Inc. Method for programming a memory cell
US6864500B2 (en) * 2002-04-10 2005-03-08 Micron Technology, Inc. Programmable conductor memory cell structure
US6731528B2 (en) * 2002-05-03 2004-05-04 Micron Technology, Inc. Dual write cycle programmable conductor memory system and method of operation
US6890790B2 (en) 2002-06-06 2005-05-10 Micron Technology, Inc. Co-sputter deposition of metal-doped chalcogenides
US6825135B2 (en) 2002-06-06 2004-11-30 Micron Technology, Inc. Elimination of dendrite formation during metal/chalcogenide glass deposition
US6864521B2 (en) 2002-08-29 2005-03-08 Micron Technology, Inc. Method to control silver concentration in a resistance variable memory element
US6831019B1 (en) 2002-08-29 2004-12-14 Micron Technology, Inc. Plasma etching methods and methods of forming memory devices comprising a chalcogenide comprising layer received operably proximate conductive electrodes
US7364644B2 (en) 2002-08-29 2008-04-29 Micron Technology, Inc. Silver selenide film stoichiometry and morphology control in sputter deposition
US6867996B2 (en) * 2002-08-29 2005-03-15 Micron Technology, Inc. Single-polarity programmable resistance-variable memory element
US7012276B2 (en) * 2002-09-17 2006-03-14 Advanced Micro Devices, Inc. Organic thin film Zener diodes
US6903394B2 (en) * 2002-11-27 2005-06-07 Micron Technology, Inc. CMOS imager with improved color response
US7220985B2 (en) * 2002-12-09 2007-05-22 Spansion, Llc Self aligned memory element and wordline
US7482621B2 (en) * 2003-02-03 2009-01-27 The Regents Of The University Of California Rewritable nano-surface organic electrical bistable devices
EP1606215B1 (de) * 2003-02-25 2008-12-17 Yeda Research And Development Co., Ltd. Nanoskopische struktur und diese verwendende vorrichtung
US6813178B2 (en) * 2003-03-12 2004-11-02 Micron Technology, Inc. Chalcogenide glass constant current device, and its method of fabrication and operation
US7022579B2 (en) 2003-03-14 2006-04-04 Micron Technology, Inc. Method for filling via with metal
US20070042154A1 (en) * 2003-04-08 2007-02-22 Seagate Technology Llc Self-assembled monolayer enhanced DLC coatings
US7050327B2 (en) 2003-04-10 2006-05-23 Micron Technology, Inc. Differential negative resistance memory
US7049153B2 (en) * 2003-04-23 2006-05-23 Micron Technology, Inc. Polymer-based ferroelectric memory
US6921912B2 (en) * 2003-06-03 2005-07-26 Micron Technology, Inc. Diode/superionic conductor/polymer memory structure
US6787458B1 (en) * 2003-07-07 2004-09-07 Advanced Micro Devices, Inc. Polymer memory device formed in via opening
US7259039B2 (en) * 2003-07-09 2007-08-21 Spansion Llc Memory device and methods of using and making the device
US7274035B2 (en) * 2003-09-03 2007-09-25 The Regents Of The University Of California Memory devices based on electric field programmable films
US7317521B2 (en) 2003-09-18 2008-01-08 Micron Technology, Inc. Particle detection method
US6852586B1 (en) * 2003-10-01 2005-02-08 Advanced Micro Devices, Inc. Self assembly of conducting polymer for formation of polymer memory cell
WO2005086627A2 (en) * 2003-12-03 2005-09-22 The Regents Of The University Of California Three-terminal electrical bistable devices
US20050162895A1 (en) * 2004-01-28 2005-07-28 Kuhr Werner G. Molecular memory arrays and devices
US6956761B2 (en) * 2004-03-10 2005-10-18 Micron Technology, Inc. Method to manufacture polymer memory with copper ion switching species
US7583551B2 (en) 2004-03-10 2009-09-01 Micron Technology, Inc. Power management control and controlling memory refresh operations
US20050212022A1 (en) * 2004-03-24 2005-09-29 Greer Edward C Memory cell having an electric field programmable storage element, and method of operating same
US7608855B2 (en) * 2004-04-02 2009-10-27 Spansion Llc Polymer dielectrics for memory element array interconnect
EP1748866B1 (de) * 2004-04-29 2011-03-09 Zettacore, Inc. Molekularspeicher sowie verarbeitungssysteme und verfahren dafür
US7750341B2 (en) * 2004-05-17 2010-07-06 The Regents Of The University Of California Bistable nanoparticle-polymer composite for use in memory devices
US7554111B2 (en) * 2004-05-20 2009-06-30 The Regents Of The University Of California Nanoparticle-polymer bistable devices
US7326950B2 (en) 2004-07-19 2008-02-05 Micron Technology, Inc. Memory device with switching glass layer
US7354793B2 (en) 2004-08-12 2008-04-08 Micron Technology, Inc. Method of forming a PCRAM device incorporating a resistance-variable chalocogenide element
US7365411B2 (en) 2004-08-12 2008-04-29 Micron Technology, Inc. Resistance variable memory with temperature tolerant materials
WO2006043611A1 (en) * 2004-10-22 2006-04-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CA2587051A1 (en) * 2004-10-28 2006-05-11 The Regents Of The University Of California Organic-complex thin film for nonvolatile memory applications
US7876596B2 (en) 2004-11-08 2011-01-25 Waseda University Memory element and method for manufacturing same
US7374174B2 (en) 2004-12-22 2008-05-20 Micron Technology, Inc. Small electrode for resistance variable devices
US20060131555A1 (en) * 2004-12-22 2006-06-22 Micron Technology, Inc. Resistance variable devices with controllable channels
US7317200B2 (en) 2005-02-23 2008-01-08 Micron Technology, Inc. SnSe-based limited reprogrammable cell
US7427770B2 (en) 2005-04-22 2008-09-23 Micron Technology, Inc. Memory array for increased bit density
US7709289B2 (en) 2005-04-22 2010-05-04 Micron Technology, Inc. Memory elements having patterned electrodes and method of forming the same
US20070009821A1 (en) * 2005-07-08 2007-01-11 Charlotte Cutler Devices containing multi-bit data
US7274034B2 (en) 2005-08-01 2007-09-25 Micron Technology, Inc. Resistance variable memory device with sputtered metal-chalcogenide region and method of fabrication
US7332735B2 (en) 2005-08-02 2008-02-19 Micron Technology, Inc. Phase change memory cell and method of formation
US7579615B2 (en) 2005-08-09 2009-08-25 Micron Technology, Inc. Access transistor for memory device
KR101369864B1 (ko) * 2005-08-12 2014-03-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그 제조방법
US7251154B2 (en) 2005-08-15 2007-07-31 Micron Technology, Inc. Method and apparatus providing a cross-point memory array using a variable resistance memory cell and capacitance
KR100630437B1 (ko) * 2005-08-31 2006-10-02 삼성전자주식회사 비휘발성 유기물 저항 메모리 장치 및 그 제조 방법
KR100691928B1 (ko) * 2005-09-16 2007-03-09 삼성전자주식회사 엠보싱 구조물에 의해 형성된 메모리 활성 영역을 포함하는유기 메모리 소자
KR100814031B1 (ko) * 2006-01-13 2008-03-17 한국과학기술원 폴리머 메모리 소자 및 이의 제조 방법
US20070196673A1 (en) * 2006-02-17 2007-08-23 Seagate Technology Llc Lubricative and protective thin film
US7605410B2 (en) * 2006-02-23 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN100415508C (zh) * 2006-05-30 2008-09-03 浙江大学 一种高阻隔性自组装多层复合薄膜的制备方法
US7560723B2 (en) 2006-08-29 2009-07-14 Micron Technology, Inc. Enhanced memory density resistance variable memory cells, arrays, devices and systems including the same, and methods of fabrication
KR100836759B1 (ko) * 2006-10-04 2008-06-10 삼성전자주식회사 유기 메모리 소자 및 그 형성 방법
US8283724B2 (en) 2007-02-26 2012-10-09 Semiconductor Energy Laboratory Co., Ltd. Memory element and semiconductor device, and method for manufacturing the same
US8467236B2 (en) 2008-08-01 2013-06-18 Boise State University Continuously variable resistor
US8483643B2 (en) 2009-01-29 2013-07-09 Panasonic Corporation Harmonic rejection mixer
FR2957925B1 (fr) * 2010-03-29 2012-04-13 Centre Nat Rech Scient Polymeres organometalliques monocouches, et procede de synthese

Family Cites Families (108)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5012598B1 (de) 1970-04-02 1975-05-13
US3810127A (en) 1970-06-23 1974-05-07 Intel Corp Programmable circuit {13 {11 the method of programming thereof and the devices so programmed
JPS5589980A (en) 1978-11-27 1980-07-08 Nec Corp Semiconductor memory unit
US4267558A (en) 1979-01-05 1981-05-12 Texas Instruments Incorporated Electrically erasable memory with self-limiting erase
US4371883A (en) 1980-03-14 1983-02-01 The Johns Hopkins University Current controlled bistable electrical organic thin film switching device
US4652894A (en) 1980-03-14 1987-03-24 The Johns Hopkins University Electrical organic thin film switching device switching between detectably different oxidation states
JPS5864068A (ja) 1981-10-14 1983-04-16 Agency Of Ind Science & Technol 不揮発性半導体メモリの書き込み方法
US4677742A (en) 1983-01-18 1987-07-07 Energy Conversion Devices, Inc. Electronic matrix arrays and method for making the same
GB2160049B (en) 1984-05-28 1987-06-03 Suwa Seikosha Kk A non-volatile memory circuit
JPH0630394B2 (ja) * 1984-10-31 1994-04-20 株式会社日立製作所 接合素子の製造方法
US5034192A (en) 1984-11-23 1991-07-23 Massachusetts Institute Of Technology Molecule-based microelectronic devices
US4631562A (en) 1985-05-31 1986-12-23 Rca Corporation Zener diode structure
DE3602887A1 (de) * 1986-01-31 1987-08-06 Bayer Ag Nichtfluechtiger elektronischer speicher
US4727514A (en) 1986-02-11 1988-02-23 Texas Instruments Incorporated Programmable memory with memory cells programmed by addressing
US4834911A (en) 1986-08-25 1989-05-30 Electro-Organic Company Intrinsically conductive and semiconductive polymers, products formed with such polymers and methods of forming same
EP0268370B1 (de) 1986-10-13 1995-06-28 Canon Kabushiki Kaisha Schaltungselement
JPH0828000B2 (ja) * 1987-05-27 1996-03-21 株式会社リコー 強誘電性高分子光メモリ−
AU2485788A (en) * 1987-07-28 1989-03-01 Maxdem, Inc. Electrically settable resistance device
JPH01100788A (ja) 1987-10-13 1989-04-19 Hitachi Ltd 半導体集積回路装置
US4839700A (en) 1987-12-16 1989-06-13 California Institute Of Technology Solid-state non-volatile electronically programmable reversible variable resistance device
US5440518A (en) 1991-06-12 1995-08-08 Hazani; Emanuel Non-volatile memory circuits, architecture and methods
US5136212A (en) 1988-02-18 1992-08-04 Canon Kabushiki Kaisha Electron emitting device, electron generator employing said electron emitting device, and method for driving said generator
US5208301A (en) * 1988-05-13 1993-05-04 Ohio State University Research Foundation Sulfonated polyaniline compositions, ammonium salts thereof, process for their preparation and uses thereof
US5196912A (en) 1988-10-28 1993-03-23 Casio Computer Co., Ltd. Thin film transistor having memory function and method for using thin film transistor as memory element
US5892244A (en) 1989-01-10 1999-04-06 Mitsubishi Denki Kabushiki Kaisha Field effect transistor including πconjugate polymer and liquid crystal display including the field effect transistor
JP2636035B2 (ja) 1989-02-27 1997-07-30 松下電器産業株式会社 強誘電性液晶組成物および強誘電性液晶表示装置
EP0418504B1 (de) 1989-07-25 1995-04-05 Matsushita Electric Industrial Co., Ltd. Speicherbauelement aus organischem Halbleiter mit einer MISFET-Struktur und sein Kontrollverfahren
US5206525A (en) 1989-12-27 1993-04-27 Nippon Petrochemicals Co., Ltd. Electric element capable of controlling the electric conductivity of π-conjugated macromolecular materials
US5552627A (en) 1990-04-12 1996-09-03 Actel Corporation Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayers
US5272101A (en) 1990-04-12 1993-12-21 Actel Corporation Electrically programmable antifuse and fabrication processes
US5130380A (en) 1990-05-29 1992-07-14 Carew Evan B Conductive polymers
JPH0770731B2 (ja) 1990-11-22 1995-07-31 松下電器産業株式会社 電気可塑性素子
US5245543A (en) 1990-12-21 1993-09-14 Texas Instruments Incorporated Method and apparatus for integrated circuit design
US5296716A (en) 1991-01-18 1994-03-22 Energy Conversion Devices, Inc. Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom
FR2672158B1 (fr) 1991-01-24 1993-04-09 Commissariat Energie Atomique Capteur pour la detection d'especes chimiques ou de photons utilisant un transistor a effet de champ.
JP3224829B2 (ja) 1991-08-15 2001-11-05 株式会社東芝 有機電界効果型素子
GB9117680D0 (en) 1991-08-16 1991-10-02 Philips Electronic Associated Electronic matrix array devices
JP3454821B2 (ja) 1991-08-19 2003-10-06 エナージー・コンバーション・デバイセス・インコーポレーテッド 電気的に消去可能な、直接重ね書き可能なマルチビット単セルメモリ素子およびそれらから作製したアレイ
US5563081A (en) 1992-03-23 1996-10-08 Rohm Co., Inc. Method for making a nonvolatile memory device utilizing a field effect transistor having a ferroelectric gate film
JP2822791B2 (ja) 1992-06-30 1998-11-11 日本電気株式会社 半導体装置
RU2071126C1 (ru) 1992-08-27 1996-12-27 Кригер Юрий Генрихович Запоминающий элемент
US6559469B1 (en) * 1992-10-23 2003-05-06 Symetrix Corporation Ferroelectric and high dielectric constant transistors
US5579199A (en) 1992-11-26 1996-11-26 Sharp Kabushiki Kaisha Non-volatile memory device and a method for producing the same
US5581111A (en) 1993-07-07 1996-12-03 Actel Corporation Dielectric-polysilicon-dielectric antifuse for field programmable logic applications
US5818749A (en) 1993-08-20 1998-10-06 Micron Technology, Inc. Integrated circuit memory device
JPH07106440A (ja) 1993-10-04 1995-04-21 Hitachi Ltd 不揮発性半導体記憶装置及びそれを用いた応用システム
JP3467858B2 (ja) 1993-11-02 2003-11-17 ソニー株式会社 光電変換素子
US5446299A (en) * 1994-04-29 1995-08-29 International Business Machines Corporation Semiconductor random access memory cell on silicon-on-insulator with dual control gates
JP4278721B2 (ja) 1994-09-30 2009-06-17 テキサス インスツルメンツ インコーポレイテツド 高い逆降伏電圧を有するツェナーダイオード
JPH08222648A (ja) 1995-02-14 1996-08-30 Canon Inc 記憶装置
US5572472A (en) 1995-04-14 1996-11-05 Delco Electronics Corporation Integrated zener-zap nonvolatile memory cell with programming and pretest capability
NO952545D0 (no) 1995-06-23 1995-06-23 Opticon As Fremgangsmåte til skriving av data i et optisk minne
US5691935A (en) 1995-07-13 1997-11-25 Douglass; Barry G. Memory element and method of operation thereof
US5849403A (en) 1995-09-13 1998-12-15 Kabushiki Kaisha Toshiba Organic thin film device
DE69515876T2 (de) 1995-11-06 2000-08-17 St Microelectronics Srl Leistungsbauelement in MOS-Technologie mit niedrigem Ausgangswiderstand und geringer Kapazität und dessen Herstellungsverfahren
KR100275853B1 (ko) * 1996-03-08 2001-02-01 가나이 쓰도무 반도체장치 및 그 제조방법
US5761115A (en) 1996-05-30 1998-06-02 Axon Technologies Corporation Programmable metallization cell structure and method of making same
US5734605A (en) 1996-09-10 1998-03-31 Motorola, Inc. Multi-layer magnetic tunneling junction memory cells
DE19640239A1 (de) 1996-09-30 1998-04-02 Siemens Ag Speicherzelle mit Polymerkondensator
JP3349638B2 (ja) 1996-11-15 2002-11-25 シャープ株式会社 表示装置を駆動する方法および回路
KR100604960B1 (ko) 1997-03-28 2006-07-26 가부시키가이샤 히타치세이사쿠쇼 불휘발성 반도체 기억장치 및 그 제조방법 및 반도체 장치 및 그 제조방법
NO972803D0 (no) 1997-06-17 1997-06-17 Opticom As Elektrisk adresserbar logisk innretning, fremgangsmåte til elektrisk adressering av samme og anvendelse av innretning og fremgangsmåte
IL121312A (en) 1997-07-14 2001-09-13 Technion Res & Dev Foundation Microelectronic components, their manufacture and electronic networks containing them
JP3569112B2 (ja) * 1997-07-17 2004-09-22 株式会社東芝 半導体集積回路およびその製造方法
NO304956B1 (no) 1997-07-22 1999-03-08 Opticom As Elektrodeanordning uten og med et funksjonselement, samt en elektrodeinnretning dannet av elektrodeanordninger med funksjonselement og anvendelser derav
US6969866B1 (en) * 1997-10-01 2005-11-29 Ovonyx, Inc. Electrically programmable memory element with improved contacts
SG77608A1 (en) 1997-10-03 2001-01-16 Inst Data Storage Improvements relating to optical memories using electron trapping material
US6346741B1 (en) * 1997-11-20 2002-02-12 Advanced Technology Materials, Inc. Compositions and structures for chemical mechanical polishing of FeRAM capacitors and method of fabricating FeRAM capacitors using same
KR100371102B1 (ko) 1997-12-04 2003-02-06 엑손 테크놀로지스 코포레이션 프로그램형 표면하 군집 금속화 구조체 및 그 제조 방법
US6693318B1 (en) * 1997-12-18 2004-02-17 Infineon Technologies North America Reduced diffusion of a mobile specie from a metal oxide ceramic
US6350643B1 (en) * 1997-12-18 2002-02-26 Advanced Technology Materials, Inc. Reduced degradation of metal oxide ceramic due to diffusion of a mobile specie therefrom
NO306529B1 (no) 1998-01-16 1999-11-15 Opticom As Transistor
AU739848B2 (en) 1998-01-28 2001-10-18 Thin Film Electronics Asa A method for generation of electrical conducting or semiconducting structures in three dimensions and methods for erasure of the same structures
US6064589A (en) * 1998-02-02 2000-05-16 Walker; Darryl G. Double gate DRAM memory cell
JPH11312393A (ja) 1998-02-19 1999-11-09 Sanyo Electric Co Ltd 半導体メモリ装置の書き込み回路
US6093614A (en) * 1998-03-04 2000-07-25 Siemens Aktiengesellschaft Memory cell structure and fabrication
US6509601B1 (en) * 1998-07-31 2003-01-21 Samsung Electronics Co., Ltd. Semiconductor memory device having capacitor protection layer and method for manufacturing the same
US6487106B1 (en) 1999-01-12 2002-11-26 Arizona Board Of Regents Programmable microelectronic devices and method of forming and programming same
US6635914B2 (en) 2000-09-08 2003-10-21 Axon Technologies Corp. Microelectronic programmable device and methods of forming and programming the same
JP4658329B2 (ja) 1999-02-12 2011-03-23 ボード オブ トラスティーズ,オブ ミシガン ステイト ユニバーシティ 帯電粒子を収容するナノカプセル、その用法及び形成法
US6459095B1 (en) 1999-03-29 2002-10-01 Hewlett-Packard Company Chemically synthesized and assembled electronics devices
US6128214A (en) 1999-03-29 2000-10-03 Hewlett-Packard Molecular wire crossbar memory
FR2792761B1 (fr) 1999-04-21 2003-05-23 St Microelectronics Sa Dispositif de programmation d'une memoire non volatile electriquement programmable
US6047953A (en) 1999-04-27 2000-04-11 Jacob, Jr.; Eugene W. Diaphragm compression restrainer
US7042755B1 (en) * 1999-07-01 2006-05-09 The Regents Of The University Of California High density non-volatile memory device
JP4491870B2 (ja) 1999-10-27 2010-06-30 ソニー株式会社 不揮発性メモリの駆動方法
US6384427B1 (en) 1999-10-29 2002-05-07 Semiconductor Energy Laboratory Co., Ltd. Electronic device
DE19959904C2 (de) 1999-12-11 2002-03-14 Edward William Schlag Verfahren und Vorrichtung zum Steuern eines elektrischen Stromes durch Biomoleküle
US6272038B1 (en) * 2000-01-14 2001-08-07 North Carolina State University High-density non-volatile memory devices incorporating thiol-derivatized porphyrin trimers
US7194085B2 (en) 2000-03-22 2007-03-20 Semiconductor Energy Laboratory Co., Ltd. Electronic device
NO315728B1 (no) 2000-03-22 2003-10-13 Thin Film Electronics Asa Multidimensjonal adresseringsarkitektur for elektroniske innretninger
US6449184B2 (en) 2000-06-19 2002-09-10 Matsushita Electric Industrial Co., Ltd. Method for driving semiconductor memory
US6403397B1 (en) 2000-06-28 2002-06-11 Agere Systems Guardian Corp. Process for fabricating organic semiconductor device involving selective patterning
US7025277B2 (en) 2000-09-25 2006-04-11 The Trustees Of Princeton University Smart card composed of organic processing elements
NO20005980L (no) * 2000-11-27 2002-05-28 Thin Film Electronics Ab Ferroelektrisk minnekrets og fremgangsmåte ved dens fremstilling
US6569705B2 (en) * 2000-12-21 2003-05-27 Intel Corporation Metal structure for a phase-change memory device
JP4667594B2 (ja) 2000-12-25 2011-04-13 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
JP2002230982A (ja) 2001-02-01 2002-08-16 Mitsubishi Electric Corp 不揮発性半導体記憶装置
US6407953B1 (en) * 2001-02-02 2002-06-18 Matrix Semiconductor, Inc. Memory array organization and related test method particularly well suited for integrated circuits having write-once memory arrays
US6919633B2 (en) 2001-03-07 2005-07-19 Hewlett-Packard Development Company, L.P. Multi-section foldable memory device
EP1388179A1 (de) 2001-05-07 2004-02-11 Advanced Micro Devices, Inc. Schaltelement mit speichereffekt
JP4886160B2 (ja) 2001-05-07 2012-02-29 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド セルフアセンブリによるポリマーフィルムを用いた記憶装置およびその製造方法
US6627944B2 (en) 2001-05-07 2003-09-30 Advanced Micro Devices, Inc. Floating gate memory device using composite molecular material
US6844608B2 (en) 2001-05-07 2005-01-18 Advanced Micro Devices, Inc. Reversible field-programmable electric interconnects
WO2002091385A1 (en) 2001-05-07 2002-11-14 Advanced Micro Devices, Inc. Molecular memory cell
US6781868B2 (en) 2001-05-07 2004-08-24 Advanced Micro Devices, Inc. Molecular memory device
US6436762B1 (en) * 2001-05-14 2002-08-20 Taiwan Semiconductor Manufactoring Company Method for improving bit line to capacitor electrical failures on DRAM circuits using a wet etch-back to improve the bit-line-to-capacitor overlay margins
US6656763B1 (en) * 2003-03-10 2003-12-02 Advanced Micro Devices, Inc. Spin on polymers for organic memory devices

Also Published As

Publication number Publication date
US6855977B2 (en) 2005-02-15
KR100900080B1 (ko) 2009-06-01
JP2004527130A (ja) 2004-09-02
US20020163828A1 (en) 2002-11-07
WO2002091384A1 (en) 2002-11-14
CN1513184A (zh) 2004-07-14
JP4886160B2 (ja) 2012-02-29
KR20040000453A (ko) 2004-01-03
EP1397809A1 (de) 2004-03-17
DE60220912T2 (de) 2008-02-28
US7295461B1 (en) 2007-11-13
EP1397809B1 (de) 2007-06-27
CN100403450C (zh) 2008-07-16

Similar Documents

Publication Publication Date Title
DE60220912D1 (de) Speichervorrichtung mit einem sich selbst einbauenden polymer und verfahren zur herstellung derselben
DE60211972D1 (de) Vorrichtung mit einem klappbaren Teil und Verfahren zu deren Herstellung
ATE553200T1 (de) Verfahren und mittel zur veränderung der fasereigenschaften in faserproduzierenden pflanzen
DE60132554D1 (de) STATORBLECHKöRPER UND VERFAHREN ZUR HERSTELLUNG DESSELBEN
DE60209104D1 (de) Selbstdichtender reifen und verfahren zu dessen herstellung
DE602004003476D1 (de) Kondensator, halbleiterbauelement mit einem kondensator und verfahren zur herstellung derselben
DE60027721D1 (de) Bodenbelag, giessform und verfahren zur herstellung derselben
DE69819015D1 (de) Norbonenpolymer und verfahren zur herstellung
DE60129589D1 (de) Wabenfilter und verfahren zur herstellung desselben
DE60004220D1 (de) Polymerisierte modifizierte teilchen und verfahren zu derren herstellung
DE502004011667D1 (de) Steuergeräteeinheit und verfahren zur herstellung derselben
DE60309938D1 (de) Verfahren zur herstellung eines düngemittels und das düngemittel
DE602004027079D1 (de) Gleiskette, gleiskettenvorrichtung und verfahren zur herstellung der gleiskette
ATE520780T1 (de) Pflanzen mit veränderten wachstumseigenschaften und verfahren zur deren herstellung
DE60333958D1 (de) Polyetherpolymer und Verfahren zur Herstellung desselben
DE60108062D1 (de) Propylenpolymere und verfahren zur ihrer herstellung
DE60124428T8 (de) Lüftungsvorrichtung und verfahren zu dessen herstellung
DE60213444D1 (de) Fluorpolymerlaminate und verfahren zur herstellung derselben
ATE477776T1 (de) Geformte absorbierende auflagen und verfahren zur dessen herstellung
DE60135786D1 (de) Flexibles harzpellet und verfahren zu seiner herstellung
AT8384U3 (de) Kunststoffbehälter und verfahren zu seiner herstellung
DE602005018419D1 (de) Wasserabsorbierende Harzzusammensetzung und Verfahren zur Herstellung derselben
DE602004028894D1 (de) Sensor und Verfahren zur Herstellung desselben
DE50008255D1 (de) Verfahren und vorrichtung zur herstellung von formkörpern
DE50310265D1 (de) Hydrophile siloxancopolymere und verfahren zu deren herstellung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition