DE60232091D1 - Vorrichtung zum kompensieren einer thermisch induzierten bewegung einer prüfkarte - Google Patents
Vorrichtung zum kompensieren einer thermisch induzierten bewegung einer prüfkarteInfo
- Publication number
- DE60232091D1 DE60232091D1 DE60232091T DE60232091T DE60232091D1 DE 60232091 D1 DE60232091 D1 DE 60232091D1 DE 60232091 T DE60232091 T DE 60232091T DE 60232091 T DE60232091 T DE 60232091T DE 60232091 D1 DE60232091 D1 DE 60232091D1
- Authority
- DE
- Germany
- Prior art keywords
- compensating
- test card
- thermally induced
- induced movement
- movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/44—Modifications of instruments for temperature compensation
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/003,012 US7071714B2 (en) | 2001-11-02 | 2001-11-02 | Method and system for compensating for thermally induced motion of probe cards |
US10/034,412 US7002363B2 (en) | 2001-11-02 | 2001-12-27 | Method and system for compensating thermally induced motion of probe cards |
US10/159,560 US6972578B2 (en) | 2001-11-02 | 2002-05-31 | Method and system for compensating thermally induced motion of probe cards |
PCT/US2002/035022 WO2003040734A2 (en) | 2001-11-02 | 2002-11-01 | Method and system for compensating thermally induced motion of probe cards |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60232091D1 true DE60232091D1 (de) | 2009-06-04 |
Family
ID=21703657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60232091T Expired - Lifetime DE60232091D1 (de) | 2001-11-02 | 2002-11-01 | Vorrichtung zum kompensieren einer thermisch induzierten bewegung einer prüfkarte |
Country Status (5)
Country | Link |
---|---|
US (4) | US7071714B2 (de) |
JP (1) | JP2008224688A (de) |
KR (2) | KR100986105B1 (de) |
DE (1) | DE60232091D1 (de) |
TW (1) | TWI292197B (de) |
Families Citing this family (99)
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JP4044645B2 (ja) | 1997-07-30 | 2008-02-06 | 株式会社日本マイクロニクス | プローブカード |
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-
2001
- 2001-11-02 US US10/003,012 patent/US7071714B2/en not_active Expired - Lifetime
- 2001-12-27 US US10/034,412 patent/US7002363B2/en not_active Expired - Fee Related
-
2002
- 2002-11-01 DE DE60232091T patent/DE60232091D1/de not_active Expired - Lifetime
- 2002-11-01 KR KR1020097015519A patent/KR100986105B1/ko not_active IP Right Cessation
- 2002-11-01 TW TW091132441A patent/TWI292197B/zh not_active IP Right Cessation
- 2002-11-01 KR KR1020097026157A patent/KR101015484B1/ko not_active IP Right Cessation
-
2006
- 2006-07-03 US US11/428,423 patent/US7312618B2/en not_active Expired - Fee Related
-
2007
- 2007-12-21 US US11/963,575 patent/US7642794B2/en not_active Expired - Fee Related
-
2008
- 2008-06-09 JP JP2008150928A patent/JP2008224688A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US20030085721A1 (en) | 2003-05-08 |
US20060238211A1 (en) | 2006-10-26 |
US7002363B2 (en) | 2006-02-21 |
TW200300278A (en) | 2003-05-16 |
KR20090086135A (ko) | 2009-08-10 |
KR100986105B1 (ko) | 2010-10-08 |
US20080094088A1 (en) | 2008-04-24 |
US7312618B2 (en) | 2007-12-25 |
US20030085724A1 (en) | 2003-05-08 |
US7642794B2 (en) | 2010-01-05 |
US7071714B2 (en) | 2006-07-04 |
KR20100003740A (ko) | 2010-01-11 |
TWI292197B (en) | 2008-01-01 |
JP2008224688A (ja) | 2008-09-25 |
KR101015484B1 (ko) | 2011-02-22 |
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