DE60305295D1 - Methode zur herstellung von rfid etiketten - Google Patents

Methode zur herstellung von rfid etiketten

Info

Publication number
DE60305295D1
DE60305295D1 DE60305295T DE60305295T DE60305295D1 DE 60305295 D1 DE60305295 D1 DE 60305295D1 DE 60305295 T DE60305295 T DE 60305295T DE 60305295 T DE60305295 T DE 60305295T DE 60305295 D1 DE60305295 D1 DE 60305295D1
Authority
DE
Germany
Prior art keywords
sections
rfid
transport member
antenna
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60305295T
Other languages
English (en)
Other versions
DE60305295T2 (de
DE60305295T3 (de
Inventor
Alan Green
Rene Benoit
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avery Dennison Corp
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26983984&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60305295(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Publication of DE60305295D1 publication Critical patent/DE60305295D1/de
Publication of DE60305295T2 publication Critical patent/DE60305295T2/de
Application granted granted Critical
Publication of DE60305295T3 publication Critical patent/DE60305295T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
    • B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
    • B31D1/02—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
    • B31D1/021—Making adhesive labels having a multilayered structure, e.g. provided on carrier webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
    • B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
    • B31D1/02—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
    • B31D1/027—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags involving, marking, printing or coding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
    • B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
    • B31D1/02—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
    • B31D1/028—Applying RFID chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/06—Embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/14—Printing or colouring
    • B32B38/145—Printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1074—Separate cutting of separate sheets or webs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y10T156/1077—Applying plural cut laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1097—Lamina is running length web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE60305295.9T 2002-01-18 2003-01-17 Methode zur herstellung von rfid etiketten Expired - Lifetime DE60305295T3 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US323490 1999-06-01
US35060602P 2002-01-18 2002-01-18
US350606P 2002-01-18
US10/323,490 US6951596B2 (en) 2002-01-18 2002-12-18 RFID label technique
PCT/US2003/001513 WO2003105063A2 (en) 2002-01-18 2003-01-17 Cross-reference
EP03748885.5A EP1470528B2 (de) 2002-01-18 2003-01-17 Methode zur herstellung von rfid etiketten

Publications (3)

Publication Number Publication Date
DE60305295D1 true DE60305295D1 (de) 2006-06-22
DE60305295T2 DE60305295T2 (de) 2007-01-18
DE60305295T3 DE60305295T3 (de) 2017-03-02

Family

ID=26983984

Family Applications (3)

Application Number Title Priority Date Filing Date
DE60305295.9T Expired - Lifetime DE60305295T3 (de) 2002-01-18 2003-01-17 Methode zur herstellung von rfid etiketten
DE20321502U Expired - Lifetime DE20321502U1 (de) 2002-01-18 2003-01-17 RFID-(Radio Frequenz Identification - Hochfrequenzidentifikations)-Tags und -Etiketten
DE03748885T Pending DE03748885T1 (de) 2002-01-18 2003-01-17 Verfahren zur herstellung von rfid etiketten

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE20321502U Expired - Lifetime DE20321502U1 (de) 2002-01-18 2003-01-17 RFID-(Radio Frequenz Identification - Hochfrequenzidentifikations)-Tags und -Etiketten
DE03748885T Pending DE03748885T1 (de) 2002-01-18 2003-01-17 Verfahren zur herstellung von rfid etiketten

Country Status (13)

Country Link
US (5) US6951596B2 (de)
EP (3) EP1470528B2 (de)
JP (2) JP4860918B2 (de)
KR (1) KR100967856B1 (de)
CN (2) CN100342395C (de)
AT (1) ATE326734T2 (de)
AU (1) AU2003267938B2 (de)
BR (1) BRPI0306992B8 (de)
CA (4) CA2816324C (de)
DE (3) DE60305295T3 (de)
ES (3) ES2270072T5 (de)
MX (1) MXPA04006913A (de)
WO (1) WO2003105063A2 (de)

Families Citing this family (294)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US7927688B2 (en) * 1999-03-19 2011-04-19 Standard Register Company Security information and graphic image fusion
US6544634B1 (en) * 1999-03-19 2003-04-08 Pinnacle Products Group, Ltd. Graphic image fusion
US7369048B2 (en) * 1999-03-19 2008-05-06 Fusion Graphics, Inc. RFID systems and graphic image fusion
US7501954B1 (en) * 2000-10-11 2009-03-10 Avante International Technology, Inc. Dual circuit RF identification tags
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
FR2823310B1 (fr) * 2001-04-05 2004-05-14 Arjo Wiggins Sa Document autocollant incorporant un dispositif d'identification radiofrequence
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US7903043B2 (en) * 2003-12-22 2011-03-08 Cardiac Pacemakers, Inc. Radio frequency antenna in a header of an implantable medical device
US7218527B1 (en) * 2001-08-17 2007-05-15 Alien Technology Corporation Apparatuses and methods for forming smart labels
US7729776B2 (en) 2001-12-19 2010-06-01 Cardiac Pacemakers, Inc. Implantable medical device with two or more telemetry systems
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US6985773B2 (en) 2002-02-07 2006-01-10 Cardiac Pacemakers, Inc. Methods and apparatuses for implantable medical device telemetry power management
US6740131B2 (en) * 2002-04-03 2004-05-25 3M Innovative Properties Company Apparatus for automatically fabricating fuel cell
US6937153B2 (en) * 2002-06-28 2005-08-30 Appleton Papers Inc. Thermal imaging paper laminate
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US7102524B2 (en) * 2002-08-02 2006-09-05 Symbol Technologies, Inc. Die frame apparatus and method of transferring dies therewith
US7135979B2 (en) * 2002-11-14 2006-11-14 Brady Worldwide, Inc. In-mold radio frequency identification device label
US7221900B2 (en) * 2002-11-21 2007-05-22 Kimberly-Clark Worldwide, Inc. Jamming device against RFID smart tag systems
ES2438529T3 (es) * 2002-12-02 2014-01-17 Avery Dennison Corporation Procedimiento para etiquetar tejidos y etiqueta de transferencia por calor muy adecuada para su utilización en dicho procedimiento
US7004400B2 (en) * 2002-12-11 2006-02-28 Atlantic Zeiser Gmbh Device for and method of processing integrated circuits
KR100686494B1 (ko) * 2002-12-30 2007-02-23 엘지.필립스 엘시디 주식회사 금속막 증착을 위한 스퍼터와 스퍼터를 이용한 액정 표시장치의 제조법
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
JP3739752B2 (ja) 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
US7225992B2 (en) * 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
EP1603757B1 (de) * 2003-03-12 2014-12-10 Bundesdruckerei GmbH Verfahren zur herstellung einer buchdeckeneinlage und eines buchartigen wertdokumentes sowie eine buchdeckeneinlage und ein buchartiges wertdokument
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7242996B2 (en) * 2003-03-25 2007-07-10 Id Solutions, Inc. Attachment of RFID modules to antennas
US7501984B2 (en) * 2003-11-04 2009-03-10 Avery Dennison Corporation RFID tag using a surface insensitive antenna structure
US7652636B2 (en) 2003-04-10 2010-01-26 Avery Dennison Corporation RFID devices having self-compensating antennas and conductive shields
US7694883B2 (en) * 2003-05-01 2010-04-13 Brother Kogyo Kabushiki Kaisha RFID label, method for producing the RFID label, device for producing the RFID label, sheet member (tag sheet) used for the RFID label, and cartridge attached to the device for producing the RFID label
FI20030833A0 (fi) * 2003-06-04 2003-06-04 Rafsec Oy Älytarra ja menetelmä älytarran valmistamiseksi
US7276388B2 (en) * 2003-06-12 2007-10-02 Symbol Technologies, Inc. Method, system, and apparatus for authenticating devices during assembly
DE102004007458A1 (de) * 2004-02-13 2005-09-01 Man Roland Druckmaschinen Ag Verfahren zur Herstellung von RFID Etiketten
DE10336025B4 (de) * 2003-08-01 2006-05-24 Mühlbauer Ag Vorrichtung und Verfahren zum Aufbringen von Transponder oder Transponderteilen auf eine kontinuierlich durchlaufende Substratbahn
US7370808B2 (en) * 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
AU2005206800A1 (en) * 2004-01-12 2005-08-04 Symbol Technologies, Inc. Radio frequency identification tag inlay sortation and assembly
CN100476869C (zh) * 2004-01-15 2009-04-08 日立化成工业株式会社 电子装置的制造方法
JP2005216077A (ja) * 2004-01-30 2005-08-11 Bridgestone Corp Ｒｆｉｄ組込バーコードラベル、及び、タイヤとその管理方法
US7405656B2 (en) * 2004-01-30 2008-07-29 United Parcel Service Of America, Inc. Device and method for encapsulation and mounting of RFID devices
EP1560155B1 (de) 2004-01-31 2009-03-18 Atlantic ZeiserGmbH Verfahren zur Herstellung von kontaklosen Chip-Karten
US7755484B2 (en) * 2004-02-12 2010-07-13 Avery Dennison Corporation RFID tag and method of manufacturing the same
US7384496B2 (en) 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
US7158037B2 (en) * 2004-03-22 2007-01-02 Avery Dennison Corporation Low cost method of producing radio frequency identification tags with straps without antenna patterning
JP2005306470A (ja) * 2004-03-25 2005-11-04 Tatsuo Sasazaki シート状成形材
DE102004015994B9 (de) * 2004-04-01 2006-09-07 Mühlbauer Ag Vorrichtung zur Vereinzelung und Positionierung von Modulbrücken
US7227470B2 (en) 2004-04-06 2007-06-05 Lasersoft Americas Limited Partnership RFID label application system
WO2005099817A1 (en) 2004-04-07 2005-10-27 Cardiac Pacemakers, Inc. Rf wake-up of implantable medical device
US20050224590A1 (en) * 2004-04-13 2005-10-13 John Melngailis Method and system for fabricating integrated circuit chips with unique identification numbers
FR2868987B1 (fr) * 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Ｉｃタグ付シートの製造方法、ｉｃタグ付シートの製造装置、ｉｃタグ付シート、ｉｃチップの固定方法、ｉｃチップの固定装置、およびｉｃタグ
US20050282355A1 (en) * 2004-06-18 2005-12-22 Edwards David N High density bonding of electrical devices
TWI288885B (en) * 2004-06-24 2007-10-21 Checkpoint Systems Inc Die attach area cut-on-fly method and apparatus
US7284704B2 (en) * 2004-06-28 2007-10-23 International Barcode Corporation Combined electromagnetic and optical communication system
US7549591B2 (en) * 2004-06-28 2009-06-23 International Barcode Corporation Combined multi-frequency electromagnetic and optical communication system
US20060012387A1 (en) * 2004-06-29 2006-01-19 Symbol Technologies, Inc. Systems and methods for testing radio frequency identification tags
US7274297B2 (en) 2004-07-01 2007-09-25 Intermec Ip Corp. RFID tag and method of manufacture
US7593984B2 (en) * 2004-07-30 2009-09-22 Swift Creek Systems, Llc System and method for harmonizing changes in user activities, device capabilities and presence information
US7229018B2 (en) * 2004-08-03 2007-06-12 Kurz Arthur A Manufacture of RFID tags and intermediate products therefor
WO2006016594A1 (ja) * 2004-08-12 2006-02-16 Brother Kogyo Kabushiki Kaisha 無線タグ情報書き込み装置
CA2576772A1 (en) * 2004-08-17 2006-03-02 Symbol Technologies, Inc. Singulation of radio frequency identification (rfid) tags for testing and/or programming
US7109867B2 (en) * 2004-09-09 2006-09-19 Avery Dennison Corporation RFID tags with EAS deactivation ability
US7501955B2 (en) * 2004-09-13 2009-03-10 Avery Dennison Corporation RFID device with content insensitivity and position insensitivity
AU2004323369A1 (en) * 2004-09-17 2006-03-23 Siang Beng Chng System and method for batch conversion of RFID tag to RFID label
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
JP4743583B2 (ja) * 2004-09-29 2011-08-10 大日本印刷株式会社 Ｉｃタグ付シート
US20060065738A1 (en) * 2004-09-30 2006-03-30 Versic Ronald J Rfid device and method of manufacture
US7221277B2 (en) * 2004-10-05 2007-05-22 Tracking Technologies, Inc. Radio frequency identification tag and method of making the same
US7055756B2 (en) * 2004-10-25 2006-06-06 Lexmark International, Inc. Deposition fabrication using inkjet technology
US7452748B1 (en) 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US20060108056A1 (en) * 2004-11-24 2006-05-25 The Boeing Company Method and apparatus for foreign object detection in a composite layer fabrication process
US7170415B2 (en) * 2004-12-01 2007-01-30 Avery Dennison Corporation RFID tags with modifiable operating parameters
EP1833290A4 (de) * 2004-12-03 2009-11-11 Hallys Corp Verfahren und geräte zur herstellung elektronischer komponenten
WO2006059732A1 (ja) * 2004-12-03 2006-06-08 Hallys Corporation インターポーザ接合装置
DE602005021823D1 (de) * 2004-12-22 2010-07-22 Texas Instruments Deutschland Verfahren und vorrichtung zum kontaktlosen prüfen von rfid-schlaufen
US20060137813A1 (en) * 2004-12-29 2006-06-29 Robrecht Michael J Registered lamination of webs using laser cutting
US7506813B2 (en) * 2005-01-06 2009-03-24 Quad/Graphics, Inc. Resonator use in the print field
US20060151615A1 (en) * 2005-01-12 2006-07-13 Taiwan Name Plate Co., Ltd. Radio identifiable mark
FR2881252A1 (fr) * 2005-01-24 2006-07-28 Ask Sa Dispositif d'idenfication radiofrequence resistant aux milieux et son procede de fabrication
FR2881251B1 (fr) * 2005-01-24 2007-04-13 Ask Sa Livret d'identite a dispositif d'identification radiofrequence resistant aux milieux humides
JP4640940B2 (ja) * 2005-01-27 2011-03-02 大日本印刷株式会社 インレット形成体、ロール状インレット形成体、非接触データキャリア及び非接触データキャリア形成体
DE102005016930A1 (de) * 2005-03-09 2006-09-21 Mühlbauer Ag Verfahren zum elektrischen und mechanischem Verbinden von Chipanschlussflächen mit Antennenanschlussflächen und Transponder
US7456506B2 (en) * 2005-03-14 2008-11-25 Rcd Technology Inc. Radio frequency identification (RFID) tag lamination process using liner
US20060205113A1 (en) * 2005-03-14 2006-09-14 Rcd Technology Corp. Radio frequency identification (RFID) tag lamination process
EP1864266A2 (de) * 2005-03-29 2007-12-12 Symbol Technologies, Inc. Intelligente hochfrequenzidentifikationselemente (rfid)
US20060223225A1 (en) * 2005-03-29 2006-10-05 Symbol Technologies, Inc. Method, system, and apparatus for transfer of integrated circuit dies using an attractive force
US20060225273A1 (en) * 2005-03-29 2006-10-12 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
DE602006016425D1 (de) 2005-04-06 2010-10-07 Hallys Corp Vorrichtung zur herstellung elektronischer komponenten
WO2006112447A1 (ja) * 2005-04-18 2006-10-26 Hallys Corporation 電子部品及び、この電子部品の製造方法
US7776654B2 (en) * 2005-04-18 2010-08-17 Hitachi Chemical Co., Ltd. Method of producing electronic apparatus
US7280044B2 (en) * 2005-04-25 2007-10-09 Xerox Corporation RFID activated paperclip tag
EP1880349B1 (de) * 2005-04-25 2011-09-07 Tamarack Products, Inc. Verfahren und vorrichtung zur herstellung von rfid-etiketten
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US20060238989A1 (en) * 2005-04-25 2006-10-26 Delaware Capital Formation, Inc. Bonding and protective method and apparatus for RFID strap
US7749350B2 (en) * 2005-04-27 2010-07-06 Avery Dennison Retail Information Services Webs and methods of making same
US7842156B2 (en) * 2005-04-27 2010-11-30 Avery Dennison Corporation Webs and methods of making same
US7301458B2 (en) 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
JP2006347609A (ja) * 2005-06-17 2006-12-28 Renesas Technology Corp 電子部品搬送用キャリアの製造方法
US7651032B2 (en) * 2005-06-22 2010-01-26 Smurfit-Stone Container Enterprises, Inc. Methods and systems for in-line RFID transponder assembly
DE102006026105B4 (de) * 2005-06-28 2011-07-07 Mühlbauer AG, 93426 Verfahren und Vorrichtung zur Herstellung von selbstklebenden RFID-Transpondern
WO2007002995A1 (en) * 2005-07-04 2007-01-11 Griffith University Fabrication of electronic components in plastic
DE102005033196A1 (de) * 2005-07-13 2007-01-25 Arccure Technologies Gmbh Verfahren und Anordnung zur Herstellung von RFID-Tags
US7436305B2 (en) * 2005-07-19 2008-10-14 Checkpoint Systems, Inc. RFID tags for pallets and cartons and system for attaching same
WO2007030768A2 (en) * 2005-09-09 2007-03-15 Delaware Capital Formation, Inc. Strap/inlay insertion method and apparatus
US7576656B2 (en) * 2005-09-15 2009-08-18 Alien Technology Corporation Apparatuses and methods for high speed bonding
WO2007034517A1 (en) * 2005-09-22 2007-03-29 Serfina S.R.L. Laminated film material with radiofrequency tag
DE102005045549A1 (de) * 2005-09-23 2007-04-05 Vorwerk & Co. Interholding Gmbh Verfahren zum Bestücken eines Teppichs mit elekronischen Bauteilen, Vorrichtung hierzu, sowie Teppich mit elektronischen Bauteilen
WO2007043602A1 (en) 2005-10-14 2007-04-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and communication system using the semiconductor device
US7224278B2 (en) * 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
US20070102486A1 (en) * 2005-10-24 2007-05-10 Checkpoint Systems, Inc. Wire embedded bridge
US7646305B2 (en) * 2005-10-25 2010-01-12 Checkpoint Systems, Inc. Capacitor strap
US20070096917A1 (en) * 2005-11-02 2007-05-03 San-Lien Yang Label of radio frequency identification by thermal transfer printing antenna
US20070096882A1 (en) * 2005-11-02 2007-05-03 Symbol Technologies, Inc. Sensor based selection of radio frequency identification tags
US20070107186A1 (en) * 2005-11-04 2007-05-17 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
US7569932B2 (en) * 2005-11-18 2009-08-04 Checkpoint Systems, Inc. Rotary chip attach
US7375636B1 (en) 2005-12-05 2008-05-20 Lawrence Joseph Martin Apparatus and method for real time functional testing of RFID tags
US20070131781A1 (en) * 2005-12-08 2007-06-14 Ncr Corporation Radio frequency device
US20070131016A1 (en) * 2005-12-13 2007-06-14 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US20070139057A1 (en) * 2005-12-15 2007-06-21 Symbol Technologies, Inc. System and method for radio frequency identification tag direct connection test
US8067253B2 (en) * 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
US7555826B2 (en) * 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US7504952B2 (en) * 2005-12-28 2009-03-17 Sandlinks Ltd. Wide band RFID system with tag on flexible label
US20070159341A1 (en) * 2006-01-09 2007-07-12 Yuen Foong Yu Paper Mfg. Co., Ltd. Packaging structure for radio frequency identification devices
US20070158024A1 (en) * 2006-01-11 2007-07-12 Symbol Technologies, Inc. Methods and systems for removing multiple die(s) from a surface
US20070159337A1 (en) * 2006-01-12 2007-07-12 Sdgi Holdings, Inc. Modular RFID tag
US20070163704A1 (en) * 2006-01-18 2007-07-19 Upm Rafsec Oy Method for manufacturing a label comprising a transponder
US8786510B2 (en) * 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
DE102006008948B3 (de) * 2006-02-23 2007-10-04 Mühlbauer Ag Verfahren zum Aufbringen und elektrischen Kontaktieren von elektronischen Bauteilen auf eine Substratbahn
EP1837810B1 (de) * 2006-03-24 2013-09-04 Brother Kogyo Kabushiki Kaisha RFID-Etikett mit erhöhter Lesbarkeit gedruckter Bilder
DE102006014437B4 (de) * 2006-03-27 2010-03-11 Mühlbauer Ag Verfahren und Vorrichtung zur Herstellung von RFID-Smart-Labels oder Smart-Label-Inlays
US7828217B2 (en) * 2006-03-27 2010-11-09 Muhlbauer Ag Method and device for producing RFID smart labels or smart label inlays
WO2007110264A1 (de) * 2006-03-27 2007-10-04 Mühlbauer Ag Verfahren und vorrichtung zur herstellung von rfid-smart-labels oder smart-label-inlays
US7646304B2 (en) * 2006-04-10 2010-01-12 Checkpoint Systems, Inc. Transfer tape strap process
US20070244657A1 (en) * 2006-04-11 2007-10-18 Drago Randall A Methods and systems for testing radio frequency identification (RFID) tags having multiple antennas
US20070240304A1 (en) * 2006-04-12 2007-10-18 Eisenhardt Randolph W RFID article with interleaf
WO2007125215A2 (fr) * 2006-04-28 2007-11-08 Ask S.A. Support de dispositif d'identification radiofrequence et son procede de fabrication
FR2900484B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
FR2900485B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
US8010219B2 (en) * 2006-05-05 2011-08-30 Tc License, Ltd. Computer automated test and processing system of RFID tags
US7562811B2 (en) * 2007-01-18 2009-07-21 Varcode Ltd. System and method for improved quality management in a product logistic chain
WO2007132053A1 (en) 2006-05-12 2007-11-22 Confidex Oy A method for manufacturing products comprising transponders
US7727809B2 (en) * 2006-05-31 2010-06-01 Semiconductor Energy Laboratory Co., Ltd. Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device
JP5108381B2 (ja) * 2006-05-31 2012-12-26 株式会社半導体エネルギー研究所 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置
US8017441B2 (en) * 2006-06-02 2011-09-13 Hiachi, Ltd. Method for manufacturing IC tag inlet
EP2070022B1 (de) * 2006-06-09 2009-12-23 Arjobex America Laminierungsvorrichtung mit lückenhafter struktur zum tragen eines elektronischen elements, wie z. b. eines etiketts für einen rfid-tag
JP4910690B2 (ja) * 2006-06-12 2012-04-04 ブラザー工業株式会社 タグテープロール
US7901533B2 (en) * 2006-06-30 2011-03-08 Tamarack Products, Inc. Method of making an RFID article
US9342777B2 (en) 2006-07-06 2016-05-17 Ricoh Company, Ltd. Programmatic control of RFID tags
US20080122119A1 (en) * 2006-08-31 2008-05-29 Avery Dennison Corporation Method and apparatus for creating rfid devices using masking techniques
US20080122623A1 (en) * 2006-09-13 2008-05-29 Hause Curtis B System and method for tracing data storage devices
US20080061979A1 (en) * 2006-09-13 2008-03-13 Hause Curtis B Traceable RFID enable data storage device
US20080065676A1 (en) * 2006-09-13 2008-03-13 Hause Curtis B System and method for tracing data storage devices
US7887755B2 (en) * 2006-09-20 2011-02-15 Binforma Group Limited Liability Company Packaging closures integrated with disposable RFID devices
JP4835991B2 (ja) * 2006-09-27 2011-12-14 ブラザー工業株式会社 ラベル用テープロール、ラベル作成用カートリッジ、ラベル作成装置、無線タグラベル
WO2008044663A1 (fr) * 2006-10-10 2008-04-17 Tatsuo Sasazaki Procédé de fabrication d'orifice d'amenée de grande taille, bande équipée d'orifice d'amenée, procédé de fabrication de celle-ci et appareil de fabrication.
AT504243B1 (de) * 2006-10-11 2011-02-15 Evva Sicherheitstechnologie Verfahren zur herstellung eines identifikationsträgers oder elektronischen schlüssels für elektronisch betätigbare schlösser
US7823269B2 (en) * 2006-10-17 2010-11-02 Tagsys Sas Method for manufacturing an auxiliary antenna
US20080100329A1 (en) * 2006-10-31 2008-05-01 Symbol Technologies, Inc. System and method for multi-up inline testing of radio frequency identification (RFID) inlays
DE102006052517A1 (de) * 2006-11-06 2008-05-08 Bielomatik Leuze Gmbh + Co.Kg Chipmodul für ein RFID-System
US10224902B2 (en) 2006-11-18 2019-03-05 Rfmicron, Inc. Roll-to-roll production of RFID tags
US7884719B2 (en) * 2006-11-21 2011-02-08 Rcd Technology Inc. Radio frequency identification (RFID) tag lamination process
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
CN101563765B (zh) * 2006-11-24 2013-09-25 弗兰霍菲尔运输应用研究公司 电子的、尤其是微电子的功能团及其生产方法
DE102006061798A1 (de) * 2006-12-21 2008-06-26 Simons, Gisela Verfahren zur Anbringung von Kennzeichen auf Substratoberflächen mit Hilfe eines Transferverfahrens
JP4933915B2 (ja) * 2007-02-14 2012-05-16 セイコーインスツル株式会社 シート材の製造装置およびシート材の製造方法
US20080198022A1 (en) * 2007-02-21 2008-08-21 Imation Corp. Inkjet printable RFID label and method of printing an inkjet printable RFID label
CA2678556C (en) * 2007-02-23 2012-01-31 Newpage Wisconsin System Inc. Multifunctional paper identification label
US20080204238A1 (en) * 2007-02-28 2008-08-28 Symbol Technologies, Inc. Method to RFID enable electronic devices
US8282754B2 (en) 2007-04-05 2012-10-09 Avery Dennison Corporation Pressure sensitive shrink label
CA2683427C (en) 2007-04-05 2016-10-11 Avery Dennison Corporation Pressure sensitive shrink label
US7953433B2 (en) 2007-04-24 2011-05-31 Imation Corp. Data storage device and data storage device tracing system
WO2008135962A2 (en) 2007-05-06 2008-11-13 Varcode Ltd. A system and method for quality management utilizing barcode indicators
US20080289753A1 (en) * 2007-05-23 2008-11-27 Bauer Richard K Method of making composite webs of record members and record members made thereby
US7546676B2 (en) * 2007-05-31 2009-06-16 Symbol Technologies, Inc. Method for manufacturing micro-strip antenna element
US8330579B2 (en) 2007-07-05 2012-12-11 Baxter International Inc. Radio-frequency auto-identification system for dialysis systems
US20090033495A1 (en) 2007-08-03 2009-02-05 Akash Abraham Moldable radio frequency identification device
US8062445B2 (en) * 2007-08-06 2011-11-22 Avery Dennison Corporation Method of making RFID devices
US8235825B2 (en) * 2007-08-14 2012-08-07 John B. French Smart card holder for automated gaming system and gaming cards
US8221244B2 (en) 2007-08-14 2012-07-17 John B. French Table with sensors and smart card holder for automated gaming system and gaming cards
DE102007041751B4 (de) * 2007-09-04 2018-04-19 Bielomatik Leuze Gmbh + Co. Kg Verfahren und Vorrrichtung zur Herstellung eines RFID-Etiketts
DE102007041752A1 (de) * 2007-09-04 2009-03-05 Bielomatik Leuze Gmbh + Co Kg Chipmodul für ein RFID-System
CN101896947B (zh) * 2007-10-10 2016-05-11 薄膜电子有限公司 包括印刷集成电路的无线器件及其制作和使用方法
FR2922342B1 (fr) * 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
CN100537211C (zh) * 2007-10-13 2009-09-09 蔡小如 一种智能卡标签的制作工艺
EP2218042B1 (de) 2007-11-14 2020-01-01 Varcode Ltd. System und verfahren für qualitätsmanagement anhand von strichcodeindikatoren
US8011577B2 (en) 2007-12-24 2011-09-06 Dynamics Inc. Payment cards and devices with gift card, global integration, and magnetic stripe reader communication functionality
US8016963B2 (en) * 2007-12-27 2011-09-13 Lasx Industries, Inc. Precision lamination of multilayered structures
US8115636B2 (en) * 2008-01-22 2012-02-14 Avery Dennison Corporation RFID tag with a reduced read range
US8068031B2 (en) * 2008-02-08 2011-11-29 Avery Dennison Corporation RFID devices and methods for overlapped objects
US9000925B2 (en) * 2008-02-19 2015-04-07 Avery Dennison Corporation RFID tag with a releasable coupler
US8016194B2 (en) 2008-03-06 2011-09-13 Imation Corp. Mobile data storage device reader having both radiofrequency and barcode scanners
FI124138B (fi) * 2008-04-21 2014-03-31 Smartrac Ip Bv Menetelmä rullattavan rainan valmistamiseksi ja rullattava raina
DE112008003875T5 (de) * 2008-05-22 2011-06-30 Hewlett-Packard Development Company, L.P., Tex. Multimodale Sicherheitsabschreckungen und Verfahren zum Herstellen derselben
US11704526B2 (en) 2008-06-10 2023-07-18 Varcode Ltd. Barcoded indicators for quality management
US8389080B2 (en) * 2008-07-16 2013-03-05 Ws Packaging Group, Inc. Label-wrapped foam cups with patterned adhesive
IT1397536B1 (it) 2008-09-25 2013-01-16 Smart Res Societa Per Azioni Dispositivo di identificazione a radiofrequenza
EP2366271B1 (de) 2008-11-25 2019-03-20 Thin Film Electronics ASA Gedruckte antennen, druckverfahren für antenne und vorrichtung mit der gedruckten antenne
FR2940486B1 (fr) * 2008-12-22 2011-02-11 Commissariat Energie Atomique Procede de fabrication d'un assemblage de puces a moyens d'emission-reception radiofrequence reliees mecaniquement au moyen d'un ruban et assemblage
KR101042680B1 (ko) * 2009-02-10 2011-06-20 엔티피 주식회사 알에프 카드의 인레이 안테나 제조방법
DE102009003550A1 (de) * 2009-02-27 2010-09-09 Reis Gmbh & Co. Kg Maschinenfabrik Verfahren und Vorrichtung zum Bekleben eines Rands eines flächigen Objekts
FR2944121B1 (fr) * 2009-04-03 2016-06-24 Paragon Identification Carte d'identification de radio frequence(rfid) semi-rigide, le procede de fabrication et la machine permettant sa fabrication
US20100301005A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Circuit on a Substrate
US20100301006A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Component on a Substrate
TWI399698B (zh) * 2009-07-15 2013-06-21 Univ Southern Taiwan Tech 金屬箔無線射頻辨識標籤之製程及其成形機
US20110068457A1 (en) * 2009-09-21 2011-03-24 Xiaotian Zhang Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
IT1397134B1 (it) * 2009-12-28 2013-01-04 Sterne Internat S P A Filiera produttiva del settore tessile.
PL2528830T3 (pl) 2010-01-28 2014-08-29 Avery Dennison Corp Pasowy układ aplikatora etykiet
ES2386614T3 (es) 2010-02-06 2012-08-23 Textilma Ag Dispositivo de montaje para aplicar un módulo de chip RFID sobre un sustrato, especialmente una etiqueta
US8701271B2 (en) * 2010-04-14 2014-04-22 Avery Dennison Corporation Method of assembly of articles
DE102010015659A1 (de) 2010-04-20 2011-10-20 Giesecke & Devrient Gmbh Transferverfahren zur Herstellung von Leiterstrukturen mittels Nanotinten
EP2580057B1 (de) 2010-06-14 2019-05-22 Avery Dennison Corporation Verfahren zur herstellung eines rfid systems
CH703425A1 (de) * 2010-07-05 2012-01-13 Woodwelding Ag Verfahren und vorrichtung zum befestigen eines im wesentlichen flachen gegenstandes an einer objektoberfläche aus einem porösen oder faserigen material.
US8991709B2 (en) 2010-08-30 2015-03-31 Tagstar Systems Gmbh Tamper-proof RFID label
US10083634B2 (en) 2010-11-15 2018-09-25 Taylor Communications, Inc. In-mold labeled article and method
DE102010053655A1 (de) * 2010-12-07 2012-06-14 Heidelberger Druckmaschinen Ag Spotkaschierung mit Folie
CN102157395B (zh) * 2011-04-22 2012-02-15 永道无线射频标签(扬州)有限公司 电子标签卷收卷工艺及其装置
TWI509526B (zh) * 2011-04-22 2015-11-21 China Steel Corp RFID tag
US9569714B2 (en) * 2011-04-26 2017-02-14 Avery Dennison Retail Information Services, Llc System and method for automated RFID quality control
FI125720B (fi) 2011-05-19 2016-01-29 Tecnomar Oy Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
DE102011104170A1 (de) * 2011-06-14 2012-12-20 Schreiner Group Gmbh & Co. Kg Transponderetikett und Herstellungsverfahren für ein Transponderetikett
CN103781867A (zh) 2011-07-05 2014-05-07 艾利丹尼森公司 用于饮料标签的耐清洗粘合剂
ES2405004B1 (es) * 2011-07-07 2014-09-03 Enrique Jose BELDA FERRE Procedimiento de insercion de tags de rfid en la cara interna de bobinas de papel impreso
CN103797498B (zh) * 2011-09-12 2016-10-12 日立化成株式会社 Rfid标签以及自动识别系统
DE102011114635A1 (de) * 2011-10-04 2013-04-04 Smartrac Ip B.V. Chipkarte und Verfahren zur Herstellung einer Chipkarte
US20130092739A1 (en) * 2011-10-13 2013-04-18 Supreme Technic Package Co., Ltd. Simple multifuncational identification labels and their manufacturing method
DE102012205768B4 (de) * 2012-04-10 2019-02-21 Smartrac Ip B.V. Transponderlage und Verfahren zu deren Herstellung
CN104412451A (zh) * 2012-05-11 2015-03-11 尤尼皮克塞尔显示器有限公司 用于制造高分辨率导电图案的墨合成物
BR112015007837B1 (pt) 2012-10-09 2021-10-05 Avery Dennison Corporation Adesivo sensível à pressão para cura local e método de ligação
US8807422B2 (en) 2012-10-22 2014-08-19 Varcode Ltd. Tamper-proof quality management barcode indicators
US20140234577A1 (en) * 2013-02-15 2014-08-21 Identive Group, Inc. Plastic Card Prelaminate and Plastic Card Including a Phone Sticker
GB2515724B (en) * 2013-04-10 2017-09-20 Moo Print Ltd Improvements Relating to Business Cards
WO2014197573A1 (en) 2013-06-05 2014-12-11 Haemonetics Corporation Frangible rfid tag and method of producing same
CN104228299B (zh) * 2013-06-17 2015-12-02 成都宏明双新科技股份有限公司 一种贴膜工件生产工艺
EP3572346B1 (de) * 2013-06-18 2022-08-03 Haemonetics Corporation Rfid-etikett und verfahren zur sicherung davon an einem objekt
US20150010725A1 (en) * 2013-07-03 2015-01-08 Identive Group, Inc Label Roll Including an Electronic Element
DE102013016856A1 (de) * 2013-10-10 2015-04-16 Klöckner Pentaplast Gmbh Polymerfolie mit RFID-Tags
US10169698B1 (en) 2013-10-30 2019-01-01 Automated Assembly Corporation RF transponder on adhesive transfer tape
US9897292B1 (en) 2013-10-30 2018-02-20 Automated Assembly Corporation Solid-state lighting elements on adhesive transfer tape
US10402713B1 (en) 2013-10-30 2019-09-03 Automated Assembly Corporation RF transponder on adhesive transfer tape
US9379289B1 (en) 2013-10-30 2016-06-28 Automated Assembly Corporation LEDs on adhesive transfer tape
US10399317B2 (en) 2014-05-19 2019-09-03 Avery Dennison Retail Information Services, Llc Composite image heat transfer with scannable mark
CN104228343B (zh) * 2014-09-09 2015-12-09 华中科技大学 一种适用于rfid标签制备的卡片式喷印机
AU2015324067B2 (en) 2014-09-29 2019-09-12 Avery Dennison Corporation Tire tracking RFID label
ES2625450T3 (es) * 2014-10-22 2017-07-19 Textilma Ag Sistema de procesamiento de velo y procedimiento para procesar un velo base
JP6567078B2 (ja) 2015-01-12 2019-08-28 ドルビー ラボラトリーズ ライセンシング コーポレイション 画素タイル構造およびレイアウト
CN104577321B (zh) * 2015-01-22 2017-04-12 深圳市骄冠科技实业有限公司 一种冲切铝箔rfid射频天线制作方法
AU2016215123B2 (en) * 2015-02-05 2018-08-09 Avery Dennison Corporation Label assemblies for adverse environments
JP6649472B2 (ja) 2015-05-18 2020-02-19 バーコード リミティド 活性化可能な品質表示ラベルのための熱変色性インク証印
KR102437089B1 (ko) * 2015-06-11 2022-08-25 삼성에스디아이 주식회사 라벨 필름을 갖는 이차 전지, 이차 전지의 제조 방법 및 이차 전지용 라벨 필름의 제조 방법
USD880460S1 (en) * 2015-06-12 2020-04-07 Avery Dennison Retail Information Services, Llc Antenna
EP3313588A1 (de) 2015-06-24 2018-05-02 Koninklijke Philips N.V. Wandlertransferstapel
EP3320315B1 (de) 2015-07-07 2020-03-04 Varcode Ltd. Elektronischer qualitätsindikator
JP6069446B1 (ja) 2015-09-28 2017-02-01 日本写真印刷株式会社 導電回路付成形品の製造方法および導電回路付プリフォーム
WO2017055917A1 (en) 2015-10-01 2017-04-06 Star Systems International, Ltd. Switchable radio-frequency identification tag device
US11138487B2 (en) * 2016-03-18 2021-10-05 Sato Holdings Kabushiki Kaisha Method for manufacturing RFID inlet and antenna pattern
WO2017219233A1 (en) 2016-06-21 2017-12-28 3M Innovative Properties Company Self-supporting antenna
EP3300467B1 (de) * 2016-09-26 2023-04-05 IMEC vzw Verfahren zur herstellung formbeständiger nichtflacher vorrichtungen
US10685273B2 (en) 2016-10-07 2020-06-16 Avery Dennison Retail Information Services, Llc Vibratory feeder systems for RFID elements
WO2018118767A1 (en) 2016-12-22 2018-06-28 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth) acrylate oligomers
CN106944363A (zh) * 2017-03-08 2017-07-14 苏州飞人自动化设备有限公司 基于模切冲型的自动剔废补标方法及设备
US10534988B2 (en) * 2017-08-18 2020-01-14 Avery Dennison Retail Information Services Llc Durable RFID printed fabric labels
US10716715B2 (en) 2017-08-29 2020-07-21 Hill-Rom Services, Inc. RFID tag inlay for incontinence detection pad
SE542007C2 (en) 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
EP3718052B1 (de) * 2017-12-01 2023-04-26 Avery Dennison Retail Information Services LLC Flexible gewebeanhänger mit öffnungen in einem substrat
DE102017129625B3 (de) 2017-12-12 2019-05-23 Mühlbauer Gmbh & Co. Kg Verfahren und Vorrichtung zur Bestückung einer Antennenstruktur mit einem elektronischen Bauelement
CN108182465A (zh) * 2017-12-28 2018-06-19 华东师范大学 一种具有湿度传感特性的纸衬底rfid柔性电子标签的制备方法
WO2019133500A1 (en) * 2017-12-28 2019-07-04 Avery Dennison Retail Information Services, Llc System and method for rfid enabling, tagging, and tracking items needing to be preserved in a cryogenic state
CN108556057A (zh) * 2018-04-01 2018-09-21 广州橸赛精密机械有限公司 一种应用于rfid标签复合模切生产中的增加材料形变能力的方法
US10398873B1 (en) 2018-07-20 2019-09-03 Automated Assembly Corporation Rolled substrate cable
WO2020044077A1 (en) * 2018-08-29 2020-03-05 Vetex Nv Marking element comprising an electronic device
US11664577B2 (en) * 2018-10-16 2023-05-30 Avery Dennison Retail Information Services Llc System and method for radio frequency identification tag reuse
CN113228053A (zh) 2018-10-30 2021-08-06 艾利丹尼森零售信息服务有限公司 超声波焊接标签系统及方法
US11301742B2 (en) 2019-05-17 2022-04-12 Sato Holdings Corporation Smart patch
RU193925U1 (ru) * 2019-06-14 2019-11-21 Иван Сергеевич Демидов Листовой материал с радиочастотной идентификацией
JP2022537854A (ja) 2019-06-14 2022-08-31 セルゲイビッチ デミドフ、イワン Ｒｆｉｄシート材料
EP4022511B1 (de) 2019-08-28 2023-07-26 Avery Dennison Retail Information Services LLC Drehungsunempfindliche rfid-vorrichtungen und verfahren zu deren herstellung
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US10970613B1 (en) 2019-09-18 2021-04-06 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
CN115884878A (zh) * 2020-06-29 2023-03-31 艾利丹尼森零售信息服务有限公司 使用被配置用于在具有至少一个无线通信设备的基材上进行打印的打印机系统进行的自动图像配准
RU2770295C1 (ru) * 2020-10-20 2022-04-15 Общество с ограниченной ответственностью «Альфа-Силтэк» Устройство для RFID маркировки пластмассовых пломбировочных устройств
CN214150953U (zh) * 2020-12-29 2021-09-07 广州市普理司科技有限公司 一种电子标签的检测设备
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
EP4083864A1 (de) * 2021-04-26 2022-11-02 Fase S.r.l. Sicherheitsfolie mit rfid-sicherheitselement
FI130466B (en) * 2021-05-04 2023-09-19 Teknologian Tutkimuskeskus Vtt Oy IMPROVED ROLL-TO-ROLL PROCESS METHOD
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article
AT526576A2 (de) * 2022-10-07 2024-04-15 Variuscard Produktions Und Handels Gmbh Druckerzeugnis mit zumindest einer Briefmarke, sowie Verfahren zur Herstellung des Druckerzeugnisses

Family Cites Families (256)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1050111B (de) * 1955-12-01 1959-02-05
US3444732A (en) * 1967-06-06 1969-05-20 Albert L Robbins Method and apparatus for determining optimum bonding parameters for thermoplastic material
US3708860A (en) 1971-03-04 1973-01-09 Eastman Kodak Co Method and apparatus for chopping a plurality of articles and depositing the articles in complementary article receptors
US3724737A (en) 1971-10-06 1973-04-03 E Bodnar Spreader for slit web material
US3826701A (en) * 1972-10-31 1974-07-30 Us Army Controllable heat sealing process for optimum seal strength
US3891157A (en) 1973-06-04 1975-06-24 Beloit Corp Slitting mechanism for winder
US3925139A (en) * 1974-01-10 1975-12-09 Package Machinery Co Seal monitoring apparatus
US3989575A (en) 1975-04-16 1976-11-02 Oliver Machinery Company Split labeling apparatus
US4242663A (en) 1979-02-01 1980-12-30 Lockheed Electronics Corporation Electronic identification system
DE3265601D1 (en) 1981-07-02 1985-09-26 Agfa Gevaert Nv Method and apparatus for conveying and spreading material
DE3203943A1 (de) 1982-02-05 1983-08-25 Karl 7631 Meißenheim Gallus Verfahren zum schneiden von fotosatz-filmen o.dgl. sowie vorrichtung zur durchfuehrung des verfahrens
US4523969A (en) * 1984-01-09 1985-06-18 Paper Converting Machine Company Method and apparatus for manufacturing a product having elastic means disposed in a direction transverse to product movement
DE3536625A1 (de) * 1985-10-15 1987-04-16 Gruenau Gmbh Chem Fab Brandschutzmaterial
FR2599501B1 (fr) 1986-05-29 1988-09-23 Lhomme Sa Appareil pour tester la resistance au clivage de tubes en carton
US4910499A (en) 1986-09-29 1990-03-20 Monarch Marking Systems, Inc. Tag and method of making same
US4717438A (en) 1986-09-29 1988-01-05 Monarch Marking Systems, Inc. Method of making tags
US4898323A (en) 1987-06-17 1990-02-06 Avery International Corporation Mailer for laser printer
DE3810598A1 (de) * 1988-03-29 1989-10-12 Bayer Ag Metallfasern enthaltende verbundstoffe sowie deren verwendung zur herstellung von formteilen zur abschirmung von elektromagnetischer strahlung
JP2628392B2 (ja) * 1990-01-16 1997-07-09 新明和工業株式会社 Ｉｃパッケージのハンドリング方法
JPH0821790B2 (ja) 1990-02-15 1996-03-04 松下電器産業株式会社 ロータリーヘッド式電子部品実装装置
JPH04124977A (ja) 1990-09-17 1992-04-24 Victor Co Of Japan Ltd 画質改善装置
JP3100716B2 (ja) 1991-01-04 2000-10-23 シーエスアイアール 識別装置
US6045652A (en) 1992-06-17 2000-04-04 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5613228A (en) 1992-07-06 1997-03-18 Micron Technology, Inc. Gain adjustment method in two-way communication systems
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US5557280A (en) 1992-08-26 1996-09-17 British Technology Group Limited Synchronized electronic identification system
US5660787A (en) 1992-10-09 1997-08-26 Illinois Tool Works Inc. Method for producing oriented plastic strap
US5264061A (en) 1992-10-22 1993-11-23 Motorola, Inc. Method of forming a three-dimensional printed circuit assembly
US5324153A (en) 1992-10-27 1994-06-28 Moore Business Forms, Inc. Process for manufacture of sheets with separable self-adhesive labels
NZ250219A (en) 1992-11-18 1997-05-26 Csir Identification of multiple transponders
US5983363A (en) 1992-11-20 1999-11-09 Micron Communications, Inc. In-sheet transceiver testing
ZA941671B (en) 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
US5409788A (en) 1993-05-03 1995-04-25 Eveready Battery Company, Inc. Method for securing a tester device to a battery and the battery so produced
US5389458A (en) 1993-05-03 1995-02-14 Eveready Battery Company, Inc. Battery with tester label and method for producing it
US5393618A (en) 1993-05-03 1995-02-28 Eveready Battery Company, Inc. Battery with tester label and method for producing it
US5585193A (en) 1993-07-16 1996-12-17 Avery Dennison Corporation Machine-direction oriented label films and die-cut labels prepared therefrom
JP3316093B2 (ja) * 1993-08-10 2002-08-19 富士写真フイルム株式会社 感光性積層材料およびその製造方法
US5437960A (en) 1993-08-10 1995-08-01 Fuji Photo Film Co., Ltd. Process for laminating photosensitive layer
US5564888A (en) 1993-09-27 1996-10-15 Doan; Carl V. Pick and place machine
US5407513A (en) * 1993-10-14 1995-04-18 The Procter & Gamble Company Apparatus and process for cyclically accelerating and decelerating a strip of material
US5728599A (en) 1993-10-28 1998-03-17 Lsi Logic Corporation Printable superconductive leadframes for semiconductor device assembly
US5904545A (en) 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5824186A (en) 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5545291A (en) 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
EP0665705B1 (de) 1993-12-30 2009-08-19 Kabushiki Kaisha Miyake Verbundfolie mit schaltungsförmiger Metallfolie oder dergleichen und Verfahren zur Herstellung
GB2289664B (en) 1994-05-27 1998-04-29 Instance Ltd David J Labels and manufacture thereof
US5441796A (en) 1994-06-10 1995-08-15 Tamarack Products, Inc. Label-equipped ply with readable liner and method
US5707475A (en) 1994-06-10 1998-01-13 Tamarack Products, Inc. Method of making label-equipped ply with liner having readable indicia
DE4424429A1 (de) 1994-07-12 1996-01-18 Bielomatik Leuze & Co Einrichtung zur Bearbeitung von Lagenmaterial
DE4431604A1 (de) 1994-09-05 1996-03-07 Siemens Ag Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5682143A (en) 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
US5550547A (en) 1994-09-12 1996-08-27 International Business Machines Corporation Multiple item radio frequency tag identification protocol
JPH0896800A (ja) 1994-09-21 1996-04-12 Mitsubishi Chem Corp リチウムイオン二次電池の電極板の製造方法
DE4437721A1 (de) 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
US6496382B1 (en) 1995-05-19 2002-12-17 Kasten Chase Applied Research Limited Radio frequency identification tag
US5622652A (en) 1995-06-07 1997-04-22 Img Group Limited Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid
DE69609380T2 (de) 1995-06-09 2001-02-15 Tamarack Products Inc Verfahren zum Handhaben dünner Bänder und Folien
TW381236B (en) * 1995-07-07 2000-02-01 Docusystem Inc Integrated circuit chip card and the method and system for the manufacture same
US5939984A (en) 1997-12-31 1999-08-17 Intermec Ip Corp. Combination radio frequency transponder (RF Tag) and magnetic electronic article surveillance (EAS) material
US7002475B2 (en) * 1997-12-31 2006-02-21 Intermec Ip Corp. Combination radio frequency identification transponder (RFID tag) and magnetic electronic article surveillance (EAS) tag
US5612513A (en) 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
US6371375B1 (en) 1995-09-25 2002-04-16 Intermec Ip Corp. Method and apparatus for associating data with a wireless memory device
US6040773A (en) 1995-10-11 2000-03-21 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6218942B1 (en) 1995-10-11 2001-04-17 Motorola, Inc. Radio frequency identification tag exciter/reader
US6252508B1 (en) 1995-10-11 2001-06-26 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US5824379A (en) 1995-12-11 1998-10-20 Monarch Marking Systems, Inc. Composite label web
US6145901A (en) 1996-03-11 2000-11-14 Rich; Donald S. Pick and place head construction
US6215401B1 (en) 1996-03-25 2001-04-10 Intermec Ip Corp. Non-laminated coating for radio frequency transponder (RF tag)
US6027027A (en) 1996-05-31 2000-02-22 Lucent Technologies Inc. Luggage tag assembly
US6082660A (en) 1996-06-14 2000-07-04 Beloit Technologies, Inc. Separating device for winding devices for material webs, longitudinally divided into several partial webs
AUPO055296A0 (en) 1996-06-19 1996-07-11 Integrated Silicon Design Pty Ltd Enhanced range transponder system
DE19634473C2 (de) * 1996-07-11 2003-06-26 David Finn Verfahren zur Herstellung einer Chipkarte
US6466131B1 (en) 1996-07-30 2002-10-15 Micron Technology, Inc. Radio frequency data communications device with adjustable receiver sensitivity and method
WO1998040930A1 (en) 1997-03-10 1998-09-17 Precision Dynamics Corporation Reactively coupled elements in circuits on flexible substrates
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
DE19719271A1 (de) * 1997-05-07 1998-11-12 Melzer Maschinenbau Gmbh Verfahren zum Herstellen von Kunststoffkarten
US5963177A (en) 1997-05-16 1999-10-05 Micron Communications, Inc. Methods of enhancing electronmagnetic radiation properties of encapsulated circuit, and related devices
US5972152A (en) 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
DE19722327A1 (de) 1997-05-28 1998-12-03 Arsoma Druckmaschinen Gmbh Verfahren zur Herstellung eines mehrlagigen Etiketts und Vorrichtung zur Durchführung des Verfahrens
US6154263A (en) 1997-07-25 2000-11-28 Eveready Battery Company, Inc. Liquid crystal display and battery label including a liquid crystal display
US6081243A (en) 1997-09-09 2000-06-27 Micron Technology, Inc. Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices
JPH11177027A (ja) 1997-09-15 1999-07-02 Microchip Technol Inc 集積回路半導体チップ及び誘導性コイルを含む片面パッケージ並びにその製造方法
US5982284A (en) 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
US6177859B1 (en) 1997-10-21 2001-01-23 Micron Technology, Inc. Radio frequency communication apparatus and methods of forming a radio frequency communication apparatus
US6164551A (en) 1997-10-29 2000-12-26 Meto International Gmbh Radio frequency identification transponder having non-encapsulated IC chip
US5890429A (en) 1997-12-10 1999-04-06 Mcdonnell Douglas Corporation Method of making and bonding a screen printed ink film carrier to an electronic device
US6104291A (en) 1998-01-09 2000-08-15 Intermec Ip Corp. Method and apparatus for testing RFID tags
US6019865A (en) 1998-01-21 2000-02-01 Moore U.S.A. Inc. Method of forming labels containing transponders
US6356535B1 (en) * 1998-02-04 2002-03-12 Micron Technology, Inc. Communication systems and methods of communicating
DE19805031C2 (de) * 1998-02-09 2002-06-13 Peter Kammer Verfahren und Vorrichtung zum Herstellen von Chipkarten
US6395373B2 (en) 1998-02-11 2002-05-28 Avery Dennison Corporation Label/tag with embedded signaling device and method and apparatus for making and using
US6094138A (en) 1998-02-27 2000-07-25 Motorola, Inc. Integrated circuit assembly and method of assembly
FR2775533B1 (fr) * 1998-02-27 2003-02-14 Gemplus Sca Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
US6501157B1 (en) 1998-04-15 2002-12-31 Micron Technology, Inc. Substrate for accepting wire bonded or flip-chip components
US6157300A (en) 1998-04-16 2000-12-05 Motorola, Inc. Flexible tag agitator
US6282407B1 (en) 1998-04-16 2001-08-28 Motorola, Inc. Active electrostatic transceiver and communicating system
US6107921A (en) 1998-04-16 2000-08-22 Motorola, Inc. Conveyor bed with openings for capacitive coupled readers
US6121878A (en) 1998-05-01 2000-09-19 Intermec Ip Corp. System for controlling assets
JP3890741B2 (ja) * 1998-05-01 2007-03-07 コニカミノルタホールディングス株式会社 電子カードの製造装置及びその製造方法
US6127024A (en) 1998-05-21 2000-10-03 Morgan Adhesives Company Single ply battery label including varnish with patterned edges
US5966903A (en) * 1998-05-27 1999-10-19 Lucent Technologies Inc. High speed flip-chip dispensing
US6412086B1 (en) 1998-06-01 2002-06-25 Intermec Ip Corp. Radio frequency identification transponder integrated circuit having a serially loaded test mode register
US6154137A (en) 1998-06-08 2000-11-28 3M Innovative Properties Company Identification tag with enhanced security
US6130613A (en) 1998-06-09 2000-10-10 Motorola, Inc. Radio frequency indentification stamp and radio frequency indentification mailing label
US6107920A (en) 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6018299A (en) 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6091332A (en) 1998-06-09 2000-07-18 Motorola, Inc. Radio frequency identification tag having printed circuit interconnections
US6246327B1 (en) 1998-06-09 2001-06-12 Motorola, Inc. Radio frequency identification tag circuit chip having printed interconnection pads
JPH11353448A (ja) * 1998-06-11 1999-12-24 Konica Corp Ｉｃカードの製造方法及びｉｃカードの製造装置
US6262292B1 (en) 1998-06-30 2001-07-17 Showa Denko K.K. Method for producing cyanophenyl derivatives
JP2000057287A (ja) * 1998-08-10 2000-02-25 Sony Corp 非接触式データキャリア
US6394330B1 (en) 1998-08-13 2002-05-28 3M Innovative Properties Company Method for slitting and processing a web into plural use supply forms
DE19840210A1 (de) 1998-09-03 2000-03-09 Fraunhofer Ges Forschung Verfahren zur Handhabung einer Mehrzahl von Schaltungschips
DE19840226B4 (de) * 1998-09-03 2006-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Aufbringen eines Schaltungschips auf einen Träger
GB2341166B (en) 1998-09-04 2001-04-18 Denny Bros Printing Adhesive labels and maunfacture thereof
US6189208B1 (en) 1998-09-11 2001-02-20 Polymer Flip Chip Corp. Flip chip mounting technique
US6147605A (en) 1998-09-11 2000-11-14 Motorola, Inc. Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag
DE69938929D1 (de) 1998-09-11 2008-07-31 Motorola Inc Rfid-etikettenvorrichtung und verfahren
KR100629923B1 (ko) 1998-09-30 2006-09-29 돗빤호무즈가부시기가이샤 도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체
WO2000021031A1 (en) 1998-10-06 2000-04-13 Intermec Ip Corp. Rfid tag having dipole over ground plane antenna
JP3089407B2 (ja) 1998-10-09 2000-09-18 工業技術院長 太陽電池薄膜の作製方法
US6366260B1 (en) 1998-11-02 2002-04-02 Intermec Ip Corp. RFID tag employing hollowed monopole antenna
US6236223B1 (en) 1998-11-09 2001-05-22 Intermec Ip Corp. Method and apparatus for wireless radio frequency testing of RFID integrated circuits
US6352073B1 (en) * 1998-11-12 2002-03-05 Kabushiki Kaisha Toshiba Semiconductor manufacturing equipment
EP1004285A1 (de) 1998-11-23 2000-05-31 The Procter & Gamble Company Verfahren zum Auftragen von separaten Bahnteilen auf eine Aufnahmebahn
US6163260A (en) 1998-12-10 2000-12-19 Intermec Ip Corp. Linerless label tracking system
US6516182B1 (en) * 1998-12-21 2003-02-04 Microchip Technology Incorporated High gain input stage for a radio frequency identification (RFID) transponder and method therefor
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
DE59900131D1 (de) 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
US6164137A (en) 1999-02-03 2000-12-26 Mcdermott Technology, Inc. Electromagnetic acoustic transducer (EMAT) inspection of tubes for surface defects
EP1157421A1 (de) 1999-02-05 2001-11-28 Alien Technology Corporation Verfahren und vorrichtungen zum herstellen von baugruppen
US6274508B1 (en) 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6380729B1 (en) 1999-02-16 2002-04-30 Alien Technology Corporation Testing integrated circuit dice
US6291896B1 (en) 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die
US6043746A (en) 1999-02-17 2000-03-28 Microchip Technology Incorporated Radio frequency identification (RFID) security tag for merchandise and method therefor
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6316278B1 (en) 1999-03-16 2001-11-13 Alien Technology Corporation Methods for fabricating a multiple modular assembly
TW457605B (en) * 1999-03-24 2001-10-01 Morgan Adhesives Co Circuit chip connector and method of connecting a circuit chip
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
JP2000277885A (ja) 1999-03-25 2000-10-06 Berg Technol Inc 電気コネクタおよびその製造方法
US6278413B1 (en) 1999-03-29 2001-08-21 Intermec Ip Corporation Antenna structure for wireless communications device, such as RFID tag
US6280544B1 (en) 1999-04-21 2001-08-28 Intermec Ip Corp. RF tag application system
US6645327B2 (en) 1999-04-21 2003-11-11 Intermec Ip Corp. RF tag application system
US6246326B1 (en) 1999-05-05 2001-06-12 Intermec Ip Corp. Performance optimized smart label printer
US6137422A (en) 1999-05-21 2000-10-24 Micron Technology, Inc. Communications system and method with D/A converter
JP3928682B2 (ja) * 1999-06-22 2007-06-13 オムロン株式会社 配線基板同士の接合体、配線基板同士の接合方法、データキャリアの製造方法、及び電子部品モジュールの実装装置
JP2001035989A (ja) 1999-07-16 2001-02-09 Toppan Forms Co Ltd Ｉｃチップを有するアンテナ回路体の形成方法
US6466130B2 (en) 1999-07-29 2002-10-15 Micron Technology, Inc. Wireless communication devices, wireless communication systems, communication methods, methods of forming radio frequency identification devices, methods of testing wireless communication operations, radio frequency identification devices, and methods of forming radio frequency identification devices
US6140146A (en) 1999-08-03 2000-10-31 Intermec Ip Corp. Automated RFID transponder manufacturing on flexible tape substrates
US6492717B1 (en) * 1999-08-03 2002-12-10 Motorola, Inc. Smart card module and method of assembling the same
US6243014B1 (en) 1999-08-27 2001-06-05 Micron Technology, Inc. Electrical apparatuses, termite sensing apparatuses, and methods of forming electrical apparatuses
US6313748B1 (en) 1999-08-27 2001-11-06 Micron Technology, Inc. Electrical apparatuses, termite sensing apparatuses, methods of forming electrical apparatuses, and methods of sensing termites
US6147662A (en) 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6577758B1 (en) * 1999-09-24 2003-06-10 Cognex Technology And Investment Corporation Image position detection technique in which input parameters can be easily determined
US6259369B1 (en) 1999-09-30 2001-07-10 Moore North America, Inc. Low cost long distance RFID reading
US6557758B1 (en) 1999-10-01 2003-05-06 Moore North America, Inc. Direct to package printing system with RFID write/read capability
DE19958328A1 (de) * 1999-10-08 2001-07-12 Flexchip Ag Verfahren zum Herstellen einer elektrischen Verbindung zwischen Chip-Kontaktelemente-Einheiten und externen Kontaktanschlüssen
US6518885B1 (en) 1999-10-14 2003-02-11 Intermec Ip Corp. Ultra-thin outline package for integrated circuit
US6479395B1 (en) 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6271793B1 (en) 1999-11-05 2001-08-07 International Business Machines Corporation Radio frequency (RF) transponder (Tag) with composite antenna
US6259408B1 (en) 1999-11-19 2001-07-10 Intermec Ip Corp. RFID transponders with paste antennas and flip-chip attachment
FR2801707B1 (fr) 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
US6838989B1 (en) * 1999-12-22 2005-01-04 Intermec Ip Corp. RFID transponder having active backscatter amplifier for re-transmitting a received signal
FI112288B (fi) 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
US6320556B1 (en) 2000-01-19 2001-11-20 Moore North America, Inc. RFID foil or film antennas
US6281795B1 (en) 2000-02-08 2001-08-28 Moore North America, Inc. RFID or EAS label mount with double sided tape
US6720865B1 (en) * 2000-02-11 2004-04-13 Marconi Intellectual Property (Us) Resilient member with wireless communication device
US6451154B1 (en) 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
JP3729491B2 (ja) 2000-02-22 2005-12-21 東レエンジニアリング株式会社 非接触ｉｄカード類及びその製造方法
FR2806029A1 (fr) 2000-03-09 2001-09-14 Christian Antoine Fournier Procede de fabrication d'objets portables
JP2001257222A (ja) * 2000-03-09 2001-09-21 Hitachi Ltd 半導体実装装置およびその製造方法
JP3830125B2 (ja) * 2000-03-14 2006-10-04 株式会社東芝 半導体装置の製造方法及び半導体装置
DE10012967A1 (de) 2000-03-16 2001-09-20 Andreas Plettner Transponder
TW569424B (en) 2000-03-17 2004-01-01 Matsushita Electric Ind Co Ltd Module with embedded electric elements and the manufacturing method thereof
US7190319B2 (en) * 2001-10-29 2007-03-13 Forster Ian J Wave antenna wireless communication device and method
EP1269412A1 (de) 2000-03-28 2003-01-02 Lucatron AG Rfid-label mit einem element zur einstellung der resonanzfrequenz
DE10017431C2 (de) * 2000-04-07 2002-05-23 Melzer Maschinenbau Gmbh Verfahren und Vorrichtung zum Herstellen von Datenträgern mit integriertem Transponder
FI111881B (fi) 2000-06-06 2003-09-30 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
FI20001344A (fi) * 2000-06-06 2001-12-07 Rafsec Oy Menetelmä ja laitteisto älytarrasyöttörainan valmistamiseksi
US6410112B1 (en) 2000-06-09 2002-06-25 Intermec Ip Corporation Multi-part pressure sensitive label and method for manufacture
US6812048B1 (en) * 2000-07-31 2004-11-02 Eaglestone Partners I, Llc Method for manufacturing a wafer-interposer assembly
US6384727B1 (en) 2000-08-02 2002-05-07 Motorola, Inc. Capacitively powered radio frequency identification device
US6696952B2 (en) * 2000-08-04 2004-02-24 Hei, Inc. Structures and assembly methods for radio-frequency-identification modules
FI113809B (fi) 2000-11-01 2004-06-15 Rafsec Oy Menetelmä älytarran valmistamiseksi sekä älytarra
FI113851B (fi) * 2000-11-20 2004-06-30 Rafsec Oy Menetelmä piisirulle integroidun piirin kiinnittämiseksi älytarraan ja menetelmä piikiekon esikäsittelemiseksi
US20020149107A1 (en) 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US6424263B1 (en) 2000-12-01 2002-07-23 Microchip Technology Incorporated Radio frequency identification tag on a single layer substrate
FI112121B (fi) * 2000-12-11 2003-10-31 Rafsec Oy Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
JP2002290131A (ja) * 2000-12-18 2002-10-04 Mitsubishi Materials Corp トランスポンダ用アンテナ
JP2002204067A (ja) * 2000-12-28 2002-07-19 Matsushita Electric Ind Co Ltd 回路基板モジュールの製造方法
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6549064B2 (en) 2001-02-12 2003-04-15 Matrics, Inc. Efficient charge pump apparatus
US7159298B2 (en) 2001-03-15 2007-01-09 Daniel Lieberman Method for the formation of RF antennas by demetallizing
JP2002298104A (ja) 2001-03-30 2002-10-11 New Japan Radio Co Ltd Ｒｆｉｄラベルの製造方法
JP2002298107A (ja) 2001-03-30 2002-10-11 Toppan Forms Co Ltd 非接触型ｉｃメディアおよびその製造方法
FI111039B (fi) 2001-04-06 2003-05-15 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
US6772663B2 (en) 2001-04-20 2004-08-10 Tamarack Products, Inc. Apparatus and method for rotary pressure cutting
US6779246B2 (en) * 2001-04-23 2004-08-24 Appleton Papers Inc. Method and system for forming RF reflective pathways
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
US6518502B2 (en) * 2001-05-10 2003-02-11 Lamina Ceramics, In Ceramic multilayer circuit boards mounted on a patterned metal support substrate
WO2002095673A1 (en) 2001-05-17 2002-11-28 Koninklijke Philips Electronics N.V. Lead-frame configuration for chips
JP2004520722A (ja) 2001-05-17 2004-07-08 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 基体及び当該基体に付属するチップを有する製品
US7124956B2 (en) 2001-05-17 2006-10-24 Koninklijke Philips Electronics N.V. Product comprising product sub-parts connected to each other by a crimp connection
US6914566B2 (en) 2001-05-17 2005-07-05 Cypress Semiconductor Corp. Ball grid array antenna
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
FI112550B (fi) † 2001-05-31 2003-12-15 Rafsec Oy Älytarra ja älytarraraina
FR2826154B1 (fr) 2001-06-14 2004-07-23 A S K Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux
JP2003006594A (ja) 2001-06-22 2003-01-10 Toppan Forms Co Ltd 両面テープを用いたｒｆ−ｉｄメディアの形成方法
EP1405258A1 (de) 2001-07-12 2004-04-07 Sokymat S.A. Leiterrahmenantenne
US20030036249A1 (en) * 2001-08-06 2003-02-20 Bauer Donald G. Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices
JP2003059337A (ja) 2001-08-09 2003-02-28 Kyocera Corp 導電性ペースト及びそれを用いたチップ型電子部品
US6549176B2 (en) 2001-08-15 2003-04-15 Moore North America, Inc. RFID tag having integral electrical bridge and method of assembling the same
GB2379335B (en) * 2001-08-29 2005-09-07 Sunonwealth Electr Mach Ind Co Supporting structure for a rotor
KR20040037127A (ko) * 2001-09-28 2004-05-04 미쓰비시 마테리알 가부시키가이샤 안테나 코일 및 그것을 이용한 ｒｆｉｄ 용 태그,트랜스폰더용 안테나
EP1302974A3 (de) 2001-10-11 2004-04-07 Westvaco Corporation, Alfred H Nissan Technical Center Chip- Ausrichtungs- und Positionierungsvorrichtung für eine integrierte Schaltung, MEMS, optische Bauteile oder andere Vorrichtungen
EP1446766B1 (de) * 2001-10-29 2010-06-09 Mineral Lassen LLC Einrichtung und verfahren zur drahtlosen kommunikation mit wellenantenne
US6630910B2 (en) * 2001-10-29 2003-10-07 Marconi Communications Inc. Wave antenna wireless communication device and method
US7214569B2 (en) 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US20030151028A1 (en) 2002-02-14 2003-08-14 Lawrence Daniel P. Conductive flexographic and gravure ink
KR20040083527A (ko) 2002-02-19 2004-10-02 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 트랜스폰더 및 이의 제조 방법
KR20030076274A (ko) * 2002-03-18 2003-09-26 도레 엔지니아린구 가부시키가이샤 비접촉 아이디 카드류 및 그 제조방법
JP2003283120A (ja) 2002-03-25 2003-10-03 Toppan Forms Co Ltd 導電接続部同士の接続方法
JP2003281936A (ja) 2002-03-25 2003-10-03 Toppan Forms Co Ltd 導電性インクおよびそれを用いたｒｆ−ｉｄメディア
JP2003283121A (ja) 2002-03-25 2003-10-03 Toppan Forms Co Ltd 導電接続部同士の接続方法
US7565108B2 (en) 2002-03-26 2009-07-21 Nokia Corporation Radio frequency identification (RF-ID) based discovery for short range radio communication with reader device having transponder functionality
JP3839337B2 (ja) 2002-03-27 2006-11-01 トッパン・フォームズ株式会社 非接触型ｉｃメディアおよびその製造方法
US6851617B2 (en) * 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
US6866799B2 (en) 2002-05-09 2005-03-15 Anuvu, Inc. Water-soluble electrically conductive composition, modifications, and applications thereof
FR2841089B1 (fr) 2002-06-14 2004-07-30 Sequoias Procede de fabrication industrielle, en ligne, d'antennes pour transpondeurs rfid
JP4054226B2 (ja) 2002-07-03 2008-02-27 東レエンジニアリング株式会社 非接触ｉｄカード類及びその製造方法
US7262074B2 (en) * 2002-07-08 2007-08-28 Micron Technology, Inc. Methods of fabricating underfilled, encapsulated semiconductor die assemblies
US6665193B1 (en) 2002-07-09 2003-12-16 Amerasia International Technology, Inc. Electronic circuit construction, as for a wireless RF tag
US20040061655A1 (en) * 2002-08-07 2004-04-01 Forster Ian J. Environmentally sensitive multi-frequency antenna
US7233498B2 (en) * 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US20040072385A1 (en) * 2002-10-15 2004-04-15 Bauer Donald G. Chip alignment and placement apparatus for integrated circuit, mems, photonic or other devices
SG106662A1 (en) 2002-11-15 2004-10-29 Smartag S Pte Ltd Rfid tag for an object having metallic portions, tag coupler and method thereof
US20040102870A1 (en) * 2002-11-26 2004-05-27 Andersen Scott Paul RFID enabled paper rolls and system and method for tracking inventory
JP2004180217A (ja) 2002-11-29 2004-06-24 Toppan Printing Co Ltd 無線タグ及び無線タグ用アンテナの形成方法
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
JP2004220304A (ja) 2003-01-15 2004-08-05 Toppan Printing Co Ltd 無線タグ用アンテナの形成方法および無線タグ
US6888754B2 (en) * 2003-01-31 2005-05-03 Taiwan Semiconductor Manufacturing Company Nonvolatile semiconductor memory array with byte-program, byte-erase, and byte-read capabilities
DE10309800B3 (de) 2003-03-05 2004-08-05 Martin Scattergood Baugruppe für eine RFID-Transponderkarte und RFID-Transponderkarte
EP1604330A1 (de) 2003-03-19 2005-12-14 MBBS Holding SA Elektronisches label zur identifikation von behältern und behälter und mündungsoberseite mit einem solchen label
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US6982190B2 (en) 2003-03-25 2006-01-03 Id Solutions, Inc. Chip attachment in an RFID tag
US7242996B2 (en) 2003-03-25 2007-07-10 Id Solutions, Inc. Attachment of RFID modules to antennas
US7034403B2 (en) 2003-04-10 2006-04-25 3M Innovative Properties Company Durable electronic assembly with conductive adhesive
WO2004100098A1 (en) 2003-05-01 2004-11-18 Meadwestvaco Corporation Apparatus for and method of writing an electronic product identification code (epic)
EP1665459A4 (de) 2003-05-01 2006-11-22 Meadwestvaco Corp Vorrichtung und verfahren zur bereitstellung eines antennenintegralen symmetrierübertragers
JP4300869B2 (ja) 2003-05-06 2009-07-22 ブラザー工業株式会社 無線タグリーダー／ライター
US7245227B2 (en) * 2003-06-25 2007-07-17 Intermec Ip Corp. Method and apparatus for preparing media
WO2005006248A1 (en) 2003-07-09 2005-01-20 Stanley Clarence Mccann Tag for radio frequency identification system
WO2005022556A2 (en) * 2003-09-02 2005-03-10 Integral Technologies, Inc. Very low resistance electrical interfaces to conductive loaded resin-based materials
US7251882B2 (en) * 2004-09-03 2007-08-07 Eastman Kodak Company Method for assembling micro-components to binding sites
US9930391B1 (en) 2014-09-11 2018-03-27 Harmonic, Inc. Network personal video recorder utilizing personal digital storage

Also Published As

Publication number Publication date
US20050252605A1 (en) 2005-11-17
US8246773B2 (en) 2012-08-21
CA2473729C (en) 2015-12-08
US20060213609A1 (en) 2006-09-28
KR100967856B1 (ko) 2010-07-05
CN100342395C (zh) 2007-10-10
JP4860918B2 (ja) 2012-01-25
CA2816180A1 (en) 2003-12-18
EP1470528A2 (de) 2004-10-27
US20030136503A1 (en) 2003-07-24
DE03748885T1 (de) 2005-09-29
US20120297609A1 (en) 2012-11-29
BRPI0306992A2 (pt) 2016-07-12
EP2306372A1 (de) 2011-04-06
WO2003105063A3 (en) 2004-07-29
US6951596B2 (en) 2005-10-04
JP2005520266A (ja) 2005-07-07
DE60305295T2 (de) 2007-01-18
JP2009048662A (ja) 2009-03-05
ES2551274T3 (es) 2015-11-17
ES2270072T5 (es) 2017-04-25
EP1693792B1 (de) 2015-08-12
CA2816180C (en) 2019-05-07
KR20040075095A (ko) 2004-08-26
CN101159036B (zh) 2010-11-10
CA2816158A1 (en) 2003-12-18
US7361251B2 (en) 2008-04-22
US7368032B2 (en) 2008-05-06
US20080142154A1 (en) 2008-06-19
ES2270072T3 (es) 2007-04-01
CA2816324A1 (en) 2003-12-18
US9495632B2 (en) 2016-11-15
DE60305295T3 (de) 2017-03-02
AU2003267938A1 (en) 2003-12-22
CN101159036A (zh) 2008-04-09
WO2003105063A2 (en) 2003-12-18
DE20321502U1 (de) 2007-10-25
ES2588207T3 (es) 2016-10-31
EP1693792A1 (de) 2006-08-23
BRPI0306992B1 (pt) 2017-08-29
BRPI0306992B8 (pt) 2022-08-23
MXPA04006913A (es) 2004-10-15
EP2306372B1 (de) 2016-08-10
EP1470528B2 (de) 2016-10-05
CA2816158C (en) 2016-09-13
CA2816324C (en) 2017-05-23
CN1628321A (zh) 2005-06-15
EP1470528B1 (de) 2006-05-17
AU2003267938B2 (en) 2008-04-24
ATE326734T2 (de) 2006-06-15
CA2473729A1 (en) 2003-12-18

Similar Documents

Publication Publication Date Title
DE60305295D1 (de) Methode zur herstellung von rfid etiketten
WO2007033294A3 (en) Methods of monitoring items or material from manufacturing processes
ATE401623T1 (de) Uhf identifikations-etikett
WO2001076949A3 (de) Verfahren und vorrichtung zum herstellen von datenträgern mit integriertem transponder
WO2005073937A3 (en) A modular radio frequency identification tagging method
ITMI20020632A1 (it) Processo per la preparazione di estratti di pomodoro ad elevato contenuto di licopene
WO2006050331A3 (en) Distributed antenna system using overhead power lines
WO2005013496A3 (en) Apparatus for and method of using a diversity antenna
HK1098557A1 (en) Radio frequency identification (rfid) system
WO2005081182A3 (en) Rfid tag and method of manufacturing the same
ATE415000T1 (de) Sicherheitsetikett mit einer dreidimensionellen antennengruppe aus flachgrundmaterial und herstellungsverfahren dafür
WO2007067790A3 (en) Bowling ball having an rfid tag
TW200709508A (en) Radio frequency identification tag and manufacturing method thereof
WO2007035609A3 (en) Radio frequency identification system
AU4082599A (en) Systems and methods for wirelessly projecting power using in-phase current loopsand for identifying radio frequency identification tags that are simultaneously interrogated
DE602004012098D1 (de) Etikett mit einem Transponder und System mit einem Transponder
WO2007047277A3 (en) Omnidirectional rfid antenna
WO2007143527A3 (en) Rfid tags and antennas and methods of their manufacture
ATE481690T1 (de) Rfid-kennzeichnung und verfahren zur herstellung einer rfid-kennzeichnung
ATE361255T1 (de) Fördersystem, insbesondere eine flughafen- gepäckförderanlage, für behälter
WO2004102735A3 (en) Apparatus for and method of using a close-proximity antenna
WO2009044661A1 (ja) Ｒｆｉｄタグの検知方法，ｒｆｉｄタグ検知システム
FR2841089B1 (fr) Procede de fabrication industrielle, en ligne, d'antennes pour transpondeurs rfid
ATE381080T1 (de) System zum regulieren und verwalten von festmachvorgängen in einem seegebiet
ATE386595T1 (de) Vorrichtung zur produktklassifizierung

Legal Events

Date Code Title Description
8363 Opposition against the patent