DE60315813D1 - Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten - Google Patents

Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten

Info

Publication number
DE60315813D1
DE60315813D1 DE60315813T DE60315813T DE60315813D1 DE 60315813 D1 DE60315813 D1 DE 60315813D1 DE 60315813 T DE60315813 T DE 60315813T DE 60315813 T DE60315813 T DE 60315813T DE 60315813 D1 DE60315813 D1 DE 60315813D1
Authority
DE
Germany
Prior art keywords
interface
test devices
electronic housings
test apparatus
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60315813T
Other languages
English (en)
Other versions
DE60315813T2 (de
Inventor
John M Winter
Larre H Nelson
John C Bergeron
Lourie M Sarcione
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rika Denshi America Inc
Original Assignee
Rika Denshi America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rika Denshi America Inc filed Critical Rika Denshi America Inc
Publication of DE60315813D1 publication Critical patent/DE60315813D1/de
Application granted granted Critical
Publication of DE60315813T2 publication Critical patent/DE60315813T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
DE60315813T 2002-03-05 2003-03-05 Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten Expired - Fee Related DE60315813T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US36188202P 2002-03-05 2002-03-05
US361882P 2002-03-05
US41012102P 2002-09-13 2002-09-13
US410121P 2002-09-13
PCT/US2003/006734 WO2003076957A1 (en) 2002-03-05 2003-03-05 Apparatus for interfacing electronic packages and test equipment

Publications (2)

Publication Number Publication Date
DE60315813D1 true DE60315813D1 (de) 2007-10-04
DE60315813T2 DE60315813T2 (de) 2008-05-21

Family

ID=27807946

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60315813T Expired - Fee Related DE60315813T2 (de) 2002-03-05 2003-03-05 Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten

Country Status (9)

Country Link
US (2) US6992496B2 (de)
EP (1) EP1488245B1 (de)
JP (1) JP3899075B2 (de)
KR (1) KR20040087341A (de)
AT (1) ATE371196T1 (de)
AU (1) AU2003220023A1 (de)
DE (1) DE60315813T2 (de)
TW (1) TWI262314B (de)
WO (1) WO2003076957A1 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6946859B2 (en) * 2003-03-12 2005-09-20 Celerity Research, Inc. Probe structures using clamped substrates with compliant interconnectors
US6924654B2 (en) * 2003-03-12 2005-08-02 Celerity Research, Inc. Structures for testing circuits and methods for fabricating the structures
US20040177995A1 (en) * 2003-03-12 2004-09-16 Nexcleon, Inc. Structures for testing circuits and methods for fabricating the structures
US7321234B2 (en) * 2003-12-18 2008-01-22 Lecroy Corporation Resistive test probe tips and applications therefor
JP4695337B2 (ja) * 2004-02-04 2011-06-08 日本発條株式会社 導電性接触子および導電性接触子ユニット
WO2005106504A1 (ja) * 2004-04-27 2005-11-10 Kabushiki Kaisha Nihon Micronics 電気的接続装置
US20050253602A1 (en) * 2004-04-28 2005-11-17 Cram Daniel P Resilient contact probe apparatus, methods of using and making, and resilient contact probes
JP4657731B2 (ja) * 2005-01-07 2011-03-23 富士通株式会社 半導体試験用ソケット
US7307437B1 (en) * 2005-03-24 2007-12-11 Hewlett-Packard Development Company, L.P. Arrangement with conductive pad embedment
JP2006284274A (ja) * 2005-03-31 2006-10-19 Renesas Technology Corp 半導体装置の製造方法
US20060245150A1 (en) * 2005-04-29 2006-11-02 Tingbao Chen Interconnect Cartridge
US7154286B1 (en) * 2005-06-30 2006-12-26 Interconnect Devices, Inc. Dual tapered spring probe
US8102184B2 (en) * 2006-01-17 2012-01-24 Johnstech International Test contact system for testing integrated circuits with packages having an array of signal and power contacts
JP2007304008A (ja) * 2006-05-12 2007-11-22 Nidec-Read Corp 基板検査用接触子、基板検査用治具及び基板検査装置
JP4041831B2 (ja) * 2006-05-15 2008-02-06 日本電産リード株式会社 基板検査用治具及びこの治具における接続電極部の電極構造
US7479794B2 (en) * 2007-02-28 2009-01-20 Sv Probe Pte Ltd Spring loaded probe pin assembly
KR100791944B1 (ko) * 2007-08-21 2008-01-04 (주)기가레인 프로브 블록
US7862391B2 (en) 2007-09-18 2011-01-04 Delaware Capital Formation, Inc. Spring contact assembly
US7847191B2 (en) * 2007-11-06 2010-12-07 Xerox Corporation Electrical component, manufacturing system and method
WO2009098770A1 (ja) * 2008-02-07 2009-08-13 Advantest Corporation 品種交換ユニットおよび製造方法
US8105119B2 (en) * 2009-01-30 2012-01-31 Delaware Capital Formation, Inc. Flat plunger round barrel test probe
JP5657220B2 (ja) * 2009-02-04 2015-01-21 株式会社笠作エレクトロニクス プローブピン用ソケット及びプローブユニット
JP4660616B2 (ja) * 2009-08-31 2011-03-30 株式会社東芝 基板検査装置
US8085057B2 (en) * 2009-09-11 2011-12-27 Chun-Chieh Wu Probe device having first and second probe pins
JP2012098219A (ja) * 2010-11-04 2012-05-24 Yamaichi Electronics Co Ltd 半導体装置用ソケット
US20130271172A1 (en) * 2012-04-13 2013-10-17 Texas Instruments Incorporated Probe apparatus and method
US20130328549A1 (en) * 2012-06-07 2013-12-12 Chung Instrument Electronics Industrial Co., Ltd. Rotating mobile probe and probing rod using the same
US11067601B2 (en) * 2013-03-08 2021-07-20 Donald DeMille High accuracy electrical test interconnection device and method for electrical circuit board testing
CN203337694U (zh) * 2013-05-27 2013-12-11 深圳市策维科技有限公司 一种测试探针
JP6404104B2 (ja) * 2014-12-11 2018-10-10 株式会社エンプラス 電気部品用ソケット
KR20160087626A (ko) 2015-01-14 2016-07-22 부산외국어대학교 산학협력단 수중관측을 위한 탐사동력장치 및 이를 이용한 운항방법
JP6480798B2 (ja) * 2015-04-23 2019-03-13 株式会社ヨコオ ソケット
JP2016212040A (ja) * 2015-05-13 2016-12-15 富士通コンポーネント株式会社 コンタクト
CN105388412A (zh) * 2015-10-23 2016-03-09 京东方科技集团股份有限公司 用于pcba的测试装置
JP6604813B2 (ja) * 2015-10-27 2019-11-13 株式会社エンプラス 電気部品用ソケット
JP2017142080A (ja) * 2016-02-08 2017-08-17 日本電産リード株式会社 接触端子、検査治具、及び検査装置
JP6837283B2 (ja) * 2016-02-29 2021-03-03 株式会社ヨコオ ソケット
US20180083379A1 (en) * 2016-09-16 2018-03-22 Advanced Interconnections Corp. Hermaphroditic spacer connector
KR101772840B1 (ko) 2017-01-06 2017-08-30 부산외국어대학교 산학협력단 수중관측을 위한 탐사동력장치의 운항방법
DE102017209443A1 (de) * 2017-06-02 2018-12-06 Feinmetall Gmbh Kontaktmodul zur elektrischen Berührungskontaktierung eines Bauteils und Kontaktsystem
DE102017116936A1 (de) * 2017-07-26 2019-01-31 Ledvance Gmbh Verbindung eines elektrischen Leitelements mit einer Leiterplatte eines Leuchtmittels
US10141670B1 (en) * 2017-08-21 2018-11-27 Lam Research Corporation Substrate connector including a spring pin assembly for electrostatic chucks
US10348015B2 (en) * 2017-11-13 2019-07-09 Te Connectivity Corporation Socket connector for an electronic package
KR102214091B1 (ko) * 2020-03-20 2021-02-09 주식회사 메가터치 포고핀의 플런저 및 그 플런저를 구비한 포고핀
CN111600153B (zh) * 2020-05-28 2021-08-06 东莞立讯技术有限公司 端子结构和电连接器
JP2022079959A (ja) * 2020-11-17 2022-05-27 山一電機株式会社 検査用ソケット
KR102642002B1 (ko) * 2021-07-20 2024-02-27 김철군 더블 포고핀 및 이를 이용하는 테스트 소켓

Family Cites Families (134)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3416125A (en) 1966-10-20 1968-12-10 Ostby & Barton Co Co-axial connector
US3435168A (en) * 1968-03-28 1969-03-25 Pylon Co Inc Electrical contact
US3654583A (en) * 1970-06-22 1972-04-04 Berg Electronics Inc Circuit board eyelet
US3777303A (en) 1972-03-15 1973-12-04 Molex Inc Hole liner for printed circuit boards
DE7529437U (de) * 1974-09-23 1976-10-14 Thomas & Betts Corp., Elizabeth, N.J. (V.St.A.)
US4164704A (en) * 1976-11-01 1979-08-14 Metropolitan Circuits, Inc. Plural probe circuit card fixture using a vacuum collapsed membrane to hold the card against the probes
CA1078038A (en) * 1976-11-22 1980-05-20 Richard C. Holt Electrical interconnection boards with lead sockets mounted therein and method for making same
US4105970A (en) * 1976-12-27 1978-08-08 Teradyne, Inc. Test pin
US4132948A (en) * 1977-03-17 1979-01-02 Teradyne, Inc. Test fixture using stock printed circuit board having test pins mounted thereon
US4307928A (en) * 1979-08-17 1981-12-29 Petlock Jr William Bellows-type electrical test contact
US4438397A (en) * 1979-12-26 1984-03-20 Teradyne, Inc. Test pin
US4443756A (en) * 1980-11-25 1984-04-17 Lightbody James D Apparatus and method for testing circuit boards
US4397519A (en) * 1981-05-12 1983-08-09 Pylon Company, Inc. Electrical contact construction
US4510445A (en) * 1981-11-02 1985-04-09 Joseph Kvaternik Miniature circuit processing devices and matrix test heads for use therein
CH645730A5 (fr) 1982-01-08 1984-10-15 Technobal Sa Contact d'essai pour le test de circuits imprimes, et tete de contact amovible pour un tel contact d'essai.
US4508405A (en) * 1982-04-29 1985-04-02 Augat Inc. Electronic socket having spring probe contacts
USRE32540E (en) 1983-03-22 1987-11-10 Advanced Interconnections, Inc. Terminal positioning method and construction
US4551675A (en) * 1983-12-19 1985-11-05 Ncr Corporation Apparatus for testing printed circuit boards
DE3421799A1 (de) * 1984-06-12 1985-12-12 Feinmetall Gmbh, 7033 Herrenberg Kontaktelement fuer pruefadapter
US4734046A (en) * 1984-09-21 1988-03-29 International Business Machines Corporation Coaxial converter with resilient terminal
US4740746A (en) * 1984-11-13 1988-04-26 Tektronix, Inc. Controlled impedance microcircuit probe
US4620761A (en) * 1985-01-30 1986-11-04 Texas Instruments Incorporated High density chip socket
US4597622A (en) * 1985-03-25 1986-07-01 Qa Technology Company Electrical connector for electrical circuit test probe and connector
US4659987A (en) * 1985-03-25 1987-04-21 Qa Technology Company Electrical circuit test probe and connector
US4724383A (en) * 1985-05-03 1988-02-09 Testsystems, Inc. PC board test fixture
US4700132A (en) * 1985-05-06 1987-10-13 Motorola, Inc. Integrated circuit test site
US4653839A (en) * 1985-06-24 1987-03-31 Itt Corporation Connector with removable socket elements
US4782289A (en) * 1986-05-30 1988-11-01 Hilevel Technology, Inc. Positioning fixture for integrated circuit chip testing board
US4897043A (en) * 1986-06-23 1990-01-30 Feinmetall Gmbh Resilient contact pin
US4739259A (en) * 1986-08-01 1988-04-19 Tektronix, Inc. Telescoping pin probe
US4758780A (en) * 1986-12-08 1988-07-19 Ncr Corporation Circuit board test apparatus and method
US4797113A (en) * 1987-02-05 1989-01-10 Lambert Roger T Board to board flexible pin
DE3820795A1 (de) * 1988-06-20 1989-12-21 Ingun Pruefmittelbau Gmbh Gefederter kontaktstift zum pruefen von prueflingen
US4885533B1 (en) * 1988-09-09 1998-11-03 Qa Technology Co Inc Electrical circuit test probe having an elongate cylindrical retaining and sliding bearing region
US4913286A (en) * 1989-01-18 1990-04-03 Tate John O Socket terminal carrier assembly
US4904213A (en) * 1989-04-06 1990-02-27 Motorola, Inc. Low impedance electric connector
US4993136A (en) * 1989-06-19 1991-02-19 Hewlett-Packard Company Method of converting a vacuum test fixture on a board testing apparatus to a mechanical test fixture
US5045780A (en) * 1989-12-04 1991-09-03 Everett/Charles Contact Products, Inc. Electrical test probe contact tip
US5066909A (en) * 1990-01-30 1991-11-19 Hewlett-Packard Company Apparatus for testing an electronic circuit having an arbitrary output waveform
US5330448A (en) * 1990-03-08 1994-07-19 Cristina Chu Method and apparatus for medical fluid transfer
JPH0412483A (ja) * 1990-04-27 1992-01-17 Kel Corp Ｉｃソケット
US5174763A (en) 1990-06-11 1992-12-29 Itt Corporation Contact assembly
JPH0782028B2 (ja) * 1990-07-30 1995-09-06 日本発条株式会社 導電性接触子
US5559444A (en) * 1991-06-04 1996-09-24 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5154621A (en) * 1991-07-29 1992-10-13 Zierick Manufacturing Corporation Printed circuit board contact system
JP2821046B2 (ja) * 1991-09-05 1998-11-05 三菱電機エンジニアリング株式会社 半導体素子用特性検査装置
US5159265A (en) * 1991-09-19 1992-10-27 Motorola, Inc. Pivotable spring contact
US5175493A (en) 1991-10-11 1992-12-29 Interconnect Devices, Inc. Shielded electrical contact spring probe assembly
US5447442A (en) * 1992-01-27 1995-09-05 Everettt Charles Technologies, Inc. Compliant electrical connectors
US5225773A (en) * 1992-02-26 1993-07-06 Interconnect Devices, Inc. Switch probe
US5227718A (en) * 1992-03-10 1993-07-13 Virginia Panel Corporation Double-headed spring contact probe assembly
JPH05333095A (ja) * 1992-05-28 1993-12-17 Rohm Co Ltd 電子部品の測定装置
JP2532331B2 (ja) * 1992-11-09 1996-09-11 日本発条株式会社 導電性接触子
US5414369A (en) * 1992-11-09 1995-05-09 Nhk Spring Co., Ltd. Coil spring-pressed needle contact probe modules with offset needles
US5502397A (en) * 1992-11-12 1996-03-26 Advanced Micro Devices, Inc. Integrated circuit testing apparatus and method
US5461326A (en) * 1993-02-25 1995-10-24 Hughes Aircraft Company Self leveling and self tensioning membrane test probe
US5489854A (en) * 1993-04-01 1996-02-06 Analog Devices, Inc. IC chip test socket with double-ended spring biased contacts
US5518410A (en) * 1993-05-24 1996-05-21 Enplas Corporation Contact pin device for IC sockets
US5509814A (en) * 1993-06-01 1996-04-23 Itt Corporation Socket contact for mounting in a hole of a device
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
JP3442137B2 (ja) * 1993-12-17 2003-09-02 日本発条株式会社 導電性接触子ユニット
GB9400384D0 (en) * 1994-01-11 1994-03-09 Inmos Ltd Circuit connection in an electrical assembly
JP3262446B2 (ja) * 1994-03-02 2002-03-04 株式会社東芝 半導体パッケージ用ソケット
US5485096A (en) * 1994-04-05 1996-01-16 Aksu; Allen Printed circuit board tester having a test bed with spring probes and easily replaceable switch cards
CA2184996A1 (en) * 1994-04-29 1995-11-09 Thomas D. Coe Method and apparatus for hydro-forming thin-walled workpieces
US5713744A (en) * 1994-09-28 1998-02-03 The Whitaker Corporation Integrated circuit socket for ball grid array and land grid array lead styles
US5936421A (en) * 1994-10-11 1999-08-10 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
US5484306A (en) * 1994-10-20 1996-01-16 Interconnect Devices Inc. Quick-connect terminal and receptacle
US5625166A (en) * 1994-11-01 1997-04-29 Intel Corporation Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices with wire bond interconnect
US5942906A (en) * 1994-11-18 1999-08-24 Virginia Panel Corporation Interface system utilizing engagement mechanism
US5534787A (en) * 1994-12-09 1996-07-09 Vlsi Technology, Inc. High-frequency coaxial interface test fixture
US5611696A (en) * 1994-12-14 1997-03-18 International Business Machines Corporation High density and high current capacity pad-to-pad connector comprising of spring connector elements (SCE)
US5609489A (en) * 1994-12-21 1997-03-11 Hewlett-Packard Company Socket for contacting an electronic circuit during testing
CA2169003A1 (en) 1995-02-07 1996-08-08 David A. Johnson Apparatus for providing controlled impedance in an electrical contact
JP2648120B2 (ja) * 1995-02-08 1997-08-27 山一電機株式会社 表面接触形接続器
US5588847A (en) 1995-04-13 1996-12-31 Tate; John O. Chip carrier mounting system
TW441227B (en) * 1995-05-26 2001-06-16 E Tec Ag Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board
US5688127A (en) * 1995-07-24 1997-11-18 Vlsi Technology, Inc. Universal contactor system for testing ball grid array (BGA) devices on multiple handlers and method therefor
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
US5742481A (en) * 1995-10-04 1998-04-21 Advanced Interconnections Corporation Removable terminal support member for integrated circuit socket/adapter assemblies
US5641315A (en) * 1995-11-16 1997-06-24 Everett Charles Technologies, Inc. Telescoping spring probe
US5791914A (en) * 1995-11-21 1998-08-11 Loranger International Corporation Electrical socket with floating guide plate
KR100265489B1 (ko) * 1996-03-22 2000-09-15 요코다 마코도 전기부품용 소켓
JP3326095B2 (ja) * 1996-12-27 2002-09-17 日本発条株式会社 導電性接触子
CH693478A5 (fr) 1996-05-10 2003-08-15 E Tec Ag Socle de connexion de deux composants électriques.
JP3634074B2 (ja) 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
JP3414593B2 (ja) * 1996-06-28 2003-06-09 日本発条株式会社 導電性接触子
USD385889S (en) 1996-09-11 1997-11-04 C.R. Bard, Inc. Pump housing
US6181149B1 (en) * 1996-09-26 2001-01-30 Delaware Capital Formation, Inc. Grid array package test contactor
US5766021A (en) * 1996-10-01 1998-06-16 Augat Inc. BGA interconnectors
US5896037A (en) * 1996-10-10 1999-04-20 Methode Electronics, Inc. Interface test adapter for actively testing an integrated circuit chip package
US5801544A (en) * 1997-01-16 1998-09-01 Delaware Capital Formation, Inc. Spring probe and method for biasing
US5781023A (en) * 1997-01-31 1998-07-14 Delware Capital Formation, Inc. Hollow plunger test probe
US6204680B1 (en) 1997-04-15 2001-03-20 Delaware Capital Formation, Inc. Test socket
US6084421A (en) * 1997-04-15 2000-07-04 Delaware Capital Formation, Inc. Test socket
US6028437A (en) * 1997-05-19 2000-02-22 Si Diamond Technology, Inc. Probe head assembly
US5877554A (en) * 1997-11-03 1999-03-02 Advanced Interconnections Corp. Converter socket terminal
US6271672B1 (en) * 1997-11-17 2001-08-07 Delaware Capital Formation, Inc. Biased BGA contactor probe tip
US6053777A (en) * 1998-01-05 2000-04-25 Rika Electronics International, Inc. Coaxial contact assembly apparatus
US6208155B1 (en) * 1998-01-27 2001-03-27 Cerprobe Corporation Probe tip and method for making electrical contact with a solder ball contact of an integrated circuit device
US5987848A (en) * 1998-02-06 1999-11-23 Ethicon, Inc. Needle transfer arrangement in a machine for the automated packaging of needles and attached sutures
JP3700903B2 (ja) * 1998-02-25 2005-09-28 株式会社エンプラス 電気部品用ソケット
US6104205A (en) * 1998-02-26 2000-08-15 Interconnect Devices, Inc. Probe with tab retainer
US6267603B1 (en) * 1998-04-01 2001-07-31 Molex Incorporated Burn-in test socket
US5917703A (en) * 1998-04-17 1999-06-29 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
JPH11329648A (ja) 1998-05-19 1999-11-30 Molex Inc Ｉｃデバイスソケット
US6208158B1 (en) * 1998-06-03 2001-03-27 Schein Research, Inc. Zero static force assembly for wireless test fixtures
US6020635A (en) * 1998-07-07 2000-02-01 Advanced Interconnections Corporation Converter socket terminal
US6359452B1 (en) * 1998-07-22 2002-03-19 Nortel Networks Limited Method and apparatus for testing an electronic assembly
US6175243B1 (en) 1998-08-12 2001-01-16 Aql Manufacturing Services, Inc. Apparatus and method for assembling test fixtures
US6127835A (en) * 1998-08-12 2000-10-03 Aql Manufacturing Services, Inc. Apparatus and method for assembling test fixtures
US6229322B1 (en) * 1998-08-21 2001-05-08 Micron Technology, Inc. Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus
DE19983759B4 (de) 1998-11-25 2004-06-03 Rika Electronics International Inc., Attleboro Elektrisches Kontaktsystem
US6097609A (en) * 1998-12-30 2000-08-01 Intel Corporation Direct BGA socket
US6396293B1 (en) * 1999-02-18 2002-05-28 Delaware Capital Formation, Inc. Self-closing spring probe
US6462567B1 (en) * 1999-02-18 2002-10-08 Delaware Capital Formation, Inc. Self-retained spring probe
US6377059B2 (en) * 1999-02-19 2002-04-23 Delaware Capital Formation, Inc. Crown shaped contact barrel configuration for spring probe
IL128997A (en) * 1999-03-15 2002-12-01 Aprion Digital Ltd Install electrical connection
US6297654B1 (en) * 1999-07-14 2001-10-02 Cerprobe Corporation Test socket and method for testing an IC device in a dead bug orientation
US6193524B1 (en) 1999-08-20 2001-02-27 Tekon Electronics Corp. Connector with high-densely arranged terminals for connecting to working element and printed circuit board through LGA type connection
US6352437B1 (en) * 1999-10-20 2002-03-05 John O. Tate Solder ball terminal
WO2001037381A1 (en) * 1999-11-17 2001-05-25 Advantest Corporation Ic socket and ic tester
US6213787B1 (en) 1999-12-16 2001-04-10 Advanced Interconnections Corporation Socket/adapter system
US6256202B1 (en) * 2000-02-18 2001-07-03 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
US6570399B2 (en) * 2000-05-18 2003-05-27 Qa Technology Company, Inc. Test probe and separable mating connector assembly
US6341963B1 (en) * 2000-07-06 2002-01-29 Advanced Micro Devices, Inc. System level test socket
JP2004504703A (ja) * 2000-07-13 2004-02-12 リカ　エレクトロニクス　インターナショナル　インコーポレイテッド 試験機器に特に有用な接点器具
US6424166B1 (en) * 2000-07-14 2002-07-23 David W. Henry Probe and test socket assembly
US6512389B1 (en) * 2000-11-17 2003-01-28 Aql Manufacturing Services, Inc. Apparatus for use in an electronic component test interface having multiple printed circuit boards
US6299459B1 (en) * 2001-02-02 2001-10-09 Agilent Technologies, Inc. compressible conductive interface
JP3443687B2 (ja) * 2001-02-19 2003-09-08 株式会社エンプラス 電気部品用ソケット
WO2003027689A1 (en) * 2001-09-24 2003-04-03 Rika Electronics International Electrical test probes and methods of making the same
US6685492B2 (en) * 2001-12-27 2004-02-03 Rika Electronics International, Inc. Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition
US6696850B1 (en) * 2002-10-02 2004-02-24 Interconnect Devices, Inc. Contact probe with off-centered back-drilled aperture

Also Published As

Publication number Publication date
EP1488245A4 (de) 2005-08-17
AU2003220023A1 (en) 2003-09-22
US20050146341A1 (en) 2005-07-07
US7362114B2 (en) 2008-04-22
EP1488245A1 (de) 2004-12-22
ATE371196T1 (de) 2007-09-15
WO2003076957A1 (en) 2003-09-18
TWI262314B (en) 2006-09-21
KR20040087341A (ko) 2004-10-13
US6992496B2 (en) 2006-01-31
TW200305028A (en) 2003-10-16
US20030218472A1 (en) 2003-11-27
DE60315813T2 (de) 2008-05-21
EP1488245B1 (de) 2007-08-22
JP2005519307A (ja) 2005-06-30
JP3899075B2 (ja) 2007-03-28

Similar Documents

Publication Publication Date Title
DE60315813D1 (de) Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten
TW200730834A (en) Electronic component test device and method for installing performance board of the electronic component test device
MY134764A (en) Electronic device testing apparatus
MY129902A (en) Method and apparatus for the management of forces in a wireless fixture
MY146719A (en) Probe assembly, method of producing it and electrical connecting apparatus
WO2003100445A3 (en) Probe for testing a device under test
TW200801531A (en) Prober for electronic device testing on large area substrates
DE50014496D1 (de) Elektronikteil, insbesondere für eine mit ventilen ausgestattete steuereinrichtung
SG126025A1 (en) Method and apparatus for a twisting fixture probe for probing test access point structures
TW200734665A (en) Electronic component testing apparatus and electronic component testing method
EP1637893A4 (de) Verfahren und vorrichtung zum testen elektrischer eigenschaften eines zu prüfenden objekts
TW200508615A (en) Electronic component test apparatus
TW200514485A (en) Adapter method and apparatus for interfacing a tester with a device under test
ATE456058T1 (de) Verfahren und vorrichtung zum prüfen von sockeln in der schaltung
DE502005001434D1 (de) Anordnung mit einem elektromotor und einer hauptleiterplatte und montageverfahren
TW200601401A (en) Dut interface of semiconductor test apparatus
TW200710411A (en) Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing
ATE296448T1 (de) Prüfsockel
TW200721338A (en) Probe apparatus and system
MY122960A (en) Method and apparatus for testing electronic devices
TW200613738A (en) Method and apparatus for a twisting fixture probe for probing test access point structures
TW358885B (en) Apparatus and method for testing non-componented printed circuit boards
SG129234A1 (en) Adapter method and apparatus for interfacing a tester with a device under test
MY149802A (en) Device and method for testing electronic components
TW200624818A (en) Probe device having micro-pins inserted into interface board

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee