DE60334265D1 - Wafer-Heizvorrichtung mit einer elektrostatischen Anziehungsfunktion - Google Patents

Wafer-Heizvorrichtung mit einer elektrostatischen Anziehungsfunktion

Info

Publication number
DE60334265D1
DE60334265D1 DE60334265T DE60334265T DE60334265D1 DE 60334265 D1 DE60334265 D1 DE 60334265D1 DE 60334265 T DE60334265 T DE 60334265T DE 60334265 T DE60334265 T DE 60334265T DE 60334265 D1 DE60334265 D1 DE 60334265D1
Authority
DE
Germany
Prior art keywords
electrostatic attraction
wafer heater
attraction function
function
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60334265T
Other languages
English (en)
Inventor
Shoji Kano
Ryouji Iwai
Nobuo Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE60334265D1 publication Critical patent/DE60334265D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
DE60334265T 2002-06-20 2003-06-17 Wafer-Heizvorrichtung mit einer elektrostatischen Anziehungsfunktion Expired - Lifetime DE60334265D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002179475A JP3963788B2 (ja) 2002-06-20 2002-06-20 静電吸着機能を有する加熱装置

Publications (1)

Publication Number Publication Date
DE60334265D1 true DE60334265D1 (de) 2010-11-04

Family

ID=29717505

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60334265T Expired - Lifetime DE60334265D1 (de) 2002-06-20 2003-06-17 Wafer-Heizvorrichtung mit einer elektrostatischen Anziehungsfunktion

Country Status (5)

Country Link
US (1) US6917021B2 (de)
EP (1) EP1376660B1 (de)
JP (1) JP3963788B2 (de)
KR (1) KR101188185B1 (de)
DE (1) DE60334265D1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004068541A2 (en) * 2003-01-17 2004-08-12 General Electric Company Wafer handling apparatus
US7763833B2 (en) * 2004-03-12 2010-07-27 Goodrich Corp. Foil heating element for an electrothermal deicer
US7340933B2 (en) 2006-02-16 2008-03-11 Rohr, Inc. Stretch forming method for a sheet metal skin segment having compound curvatures
US7291815B2 (en) * 2006-02-24 2007-11-06 Goodrich Corporation Composite ice protection heater and method of producing same
US7923668B2 (en) 2006-02-24 2011-04-12 Rohr, Inc. Acoustic nacelle inlet lip having composite construction and an integral electric ice protection heater disposed therein
CN101466598B (zh) 2006-03-10 2013-02-27 豪富公司 飞机中使用的低密度雷击防护物
JP4654152B2 (ja) * 2006-04-13 2011-03-16 信越化学工業株式会社 加熱素子
KR101329630B1 (ko) 2006-04-13 2013-11-14 신에쓰 가가꾸 고교 가부시끼가이샤 가열소자
WO2007130979A2 (en) * 2006-05-02 2007-11-15 Rohr, Inc. Modification of reinforcing fiber tows used in composite materials by using nanoreinforcements
US7784283B2 (en) * 2006-05-03 2010-08-31 Rohr, Inc. Sound-absorbing exhaust nozzle center plug
JP2007317820A (ja) * 2006-05-25 2007-12-06 Shin Etsu Chem Co Ltd 静電吸着装置
US20080166563A1 (en) 2007-01-04 2008-07-10 Goodrich Corporation Electrothermal heater made from thermally conducting electrically insulating polymer material
US7837150B2 (en) * 2007-12-21 2010-11-23 Rohr, Inc. Ice protection system for a multi-segment aircraft component
JP4712836B2 (ja) * 2008-07-07 2011-06-29 信越化学工業株式会社 耐腐食性積層セラミックス部材
US8561934B2 (en) 2009-08-28 2013-10-22 Teresa M. Kruckenberg Lightning strike protection
JP5915026B2 (ja) * 2011-08-26 2016-05-11 住友大阪セメント株式会社 温度測定用板状体及びそれを備えた温度測定装置
JP5894401B2 (ja) * 2011-09-12 2016-03-30 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ポスト型セラミックスヒータおよびその製造方法
US9640514B1 (en) 2016-03-29 2017-05-02 Globalfoundries Inc. Wafer bonding using boron and nitrogen based bonding stack
WO2019078036A1 (ja) * 2017-10-18 2019-04-25 新日本テクノカーボン株式会社 サセプター
KR102177139B1 (ko) * 2019-05-17 2020-11-11 비씨엔씨 주식회사 저항 조절이 가능한 반도체 제조용 부품

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5267353A (en) 1975-12-01 1977-06-03 Hitachi Ltd Electrostatic chuck
JPS59124140A (ja) 1982-12-29 1984-07-18 Fujitsu Ltd 静電吸着装置
JP2779052B2 (ja) 1990-09-13 1998-07-23 信越化学工業株式会社 複層セラミックス・ヒーター
US5155652A (en) 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
JP3081279B2 (ja) 1991-06-03 2000-08-28 電気化学工業株式会社 ホットプレート
JP3155792B2 (ja) 1991-11-01 2001-04-16 電気化学工業株式会社 ホットプレート
JP2749759B2 (ja) * 1993-06-23 1998-05-13 信越化学工業株式会社 静電チャック付セラミックスヒーター
JPH07307377A (ja) * 1993-12-27 1995-11-21 Shin Etsu Chem Co Ltd 静電チャック付セラミックスヒーター
JP3835491B2 (ja) 1996-04-04 2006-10-18 信越化学工業株式会社 静電吸着機能を有するウエハ加熱装置
US5748436A (en) * 1996-10-02 1998-05-05 Advanced Ceramics Corporation Ceramic electrostatic chuck and method
JPH11157953A (ja) * 1997-12-02 1999-06-15 Nhk Spring Co Ltd セラミックスと金属との構造体及びそれを用いた静電チャック装置
JPH11260534A (ja) * 1998-01-09 1999-09-24 Ngk Insulators Ltd 加熱装置およびその製造方法
JPH11354260A (ja) * 1998-06-11 1999-12-24 Shin Etsu Chem Co Ltd 複層セラミックスヒータ
US6462928B1 (en) * 1999-05-07 2002-10-08 Applied Materials, Inc. Electrostatic chuck having improved electrical connector and method
US6490146B2 (en) * 1999-05-07 2002-12-03 Applied Materials Inc. Electrostatic chuck bonded to base with a bond layer and method
JP3813381B2 (ja) * 1999-06-25 2006-08-23 信越化学工業株式会社 複層セラミックスヒーター
JP3869160B2 (ja) * 1999-06-30 2007-01-17 信越化学工業株式会社 複層セラミックスヒータおよびその製造方法
US6140624A (en) * 1999-07-02 2000-10-31 Advanced Ceramics Corporation Pyrolytic boron nitride radiation heater
US6423615B1 (en) * 1999-09-22 2002-07-23 Intel Corporation Silicon wafers for CMOS and other integrated circuits
US6410172B1 (en) * 1999-11-23 2002-06-25 Advanced Ceramics Corporation Articles coated with aluminum nitride by chemical vapor deposition
JP4430769B2 (ja) * 1999-12-09 2010-03-10 信越化学工業株式会社 セラミックス加熱治具
US6678143B2 (en) * 2000-12-11 2004-01-13 General Electric Company Electrostatic chuck and method of manufacturing the same

Also Published As

Publication number Publication date
US20030234248A1 (en) 2003-12-25
EP1376660A3 (de) 2007-05-02
KR20030097657A (ko) 2003-12-31
EP1376660A2 (de) 2004-01-02
KR101188185B1 (ko) 2012-10-09
JP2004023024A (ja) 2004-01-22
EP1376660B1 (de) 2010-09-22
US6917021B2 (en) 2005-07-12
JP3963788B2 (ja) 2007-08-22

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