DE60336980D1 - Harzzusammensetzung - Google Patents

Harzzusammensetzung

Info

Publication number
DE60336980D1
DE60336980D1 DE60336980T DE60336980T DE60336980D1 DE 60336980 D1 DE60336980 D1 DE 60336980D1 DE 60336980 T DE60336980 T DE 60336980T DE 60336980 T DE60336980 T DE 60336980T DE 60336980 D1 DE60336980 D1 DE 60336980D1
Authority
DE
Germany
Prior art keywords
resin composition
resin
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60336980T
Other languages
English (en)
Inventor
Akihiko Fujiwara
Koichi Shibayama
Hidenobu Deguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Application granted granted Critical
Publication of DE60336980D1 publication Critical patent/DE60336980D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE60336980T 2002-02-06 2003-02-04 Harzzusammensetzung Expired - Lifetime DE60336980D1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002029783 2002-02-06
JP2002139090 2002-05-14
JP2002158210 2002-05-30
JP2002287005 2002-09-30
PCT/JP2003/001089 WO2003066740A1 (fr) 2002-02-06 2003-02-04 Composition de resine

Publications (1)

Publication Number Publication Date
DE60336980D1 true DE60336980D1 (de) 2011-06-16

Family

ID=27739272

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60336980T Expired - Lifetime DE60336980D1 (de) 2002-02-06 2003-02-04 Harzzusammensetzung

Country Status (9)

Country Link
US (1) US7754803B2 (de)
EP (1) EP1473328B1 (de)
KR (1) KR100704321B1 (de)
CN (1) CN100372892C (de)
AU (1) AU2003244465A1 (de)
CA (1) CA2474693A1 (de)
DE (1) DE60336980D1 (de)
TW (1) TWI303647B (de)
WO (1) WO2003066740A1 (de)

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CN1886448A (zh) * 2003-12-05 2006-12-27 住友电木株式会社 薄膜状布线基板的生产工序用带
US7709085B2 (en) 2003-12-08 2010-05-04 Sekisui Chemical Co., Ltd. Thermosetting resin composition, resin sheet and resin sheet for insulated substrate
CN1894342A (zh) * 2003-12-15 2007-01-10 积水化学工业株式会社 热塑性树脂组合物、基板用材料及基板用膜
SG119379A1 (en) * 2004-08-06 2006-02-28 Nippon Catalytic Chem Ind Resin composition method of its composition and cured formulation
US7888419B2 (en) * 2005-09-02 2011-02-15 Naturalnano, Inc. Polymeric composite including nanoparticle filler
JP4763496B2 (ja) * 2006-03-30 2011-08-31 株式会社巴川製紙所 薄膜およびそれを用いた薄膜積層体
US8163830B2 (en) * 2006-03-31 2012-04-24 Intel Corporation Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same
US8647744B2 (en) * 2006-04-05 2014-02-11 National Institute Of Advanced Industrial Science And Technology Graphite clay composite material, process for producing the same, gasket or packing comprising the composite material, and clay dispersion used for the composite material
EP2032630A2 (de) * 2006-06-26 2009-03-11 Sabic Innovative Plastics IP B.V. Zusammensetzungen und verfahren für polymerverbindungen
US7928155B2 (en) 2006-06-26 2011-04-19 Sabic Innovative Plastics Ip B.V. Compositions and methods for polymer composites
US8568867B2 (en) 2006-06-26 2013-10-29 Sabic Innovative Plastics Ip B.V. Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US7928154B2 (en) 2006-06-26 2011-04-19 Sabic Innovative Plastics Ip B.V. Methods of preparing polymer-organoclay composites and articles derived therefrom
US7915332B2 (en) 2006-06-26 2011-03-29 Sabic Innovative Plastics Ip B.V. Compositions and methods for polymer composites
US9161440B2 (en) 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US20070299188A1 (en) * 2006-06-26 2007-12-27 Chan Kwok P Compositions and methods for polymer composites
US20070299187A1 (en) * 2006-06-26 2007-12-27 Chan Kwok P Compositions and methods for polymer composites
WO2008002869A2 (en) * 2006-06-26 2008-01-03 Sabic Innovative Plastics Ip B.V. Compositions and methods for polymer composites
EP2032644A2 (de) * 2006-06-26 2009-03-11 Sabic Innovative Plastics IP B.V. Zusammensetzungen und verfahren für polymerverbindungen
US8545975B2 (en) 2006-06-26 2013-10-01 Sabic Innovative Plastics Ip B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US8124678B2 (en) 2006-11-27 2012-02-28 Naturalnano, Inc. Nanocomposite master batch composition and method of manufacture
US8648132B2 (en) * 2007-02-07 2014-02-11 Naturalnano, Inc. Nanocomposite method of manufacture
US20080249221A1 (en) * 2007-04-06 2008-10-09 Naturalnano Research, Inc. Polymeric adhesive including nanoparticle filler
JP2008266455A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法
US20080286547A1 (en) * 2007-05-18 2008-11-20 Hubbard Michael A Polypropylene films with enhanced moisture barrier properties, process for making and composition thereof
WO2009029310A1 (en) * 2007-05-23 2009-03-05 Naturalnano Research, Inc. Fire and flame retardant polymer composites
US20090092800A1 (en) * 2007-10-08 2009-04-09 Samsung Electronics Co., Ltd. Composition for preparing modified polyimide/clay nanocomposites and preparation method of modified polymide/clay nanocomposites using the same
JP2009161742A (ja) * 2007-12-14 2009-07-23 Sony Chemical & Information Device Corp 光半導体パッケージ封止樹脂材料
EP2237089A1 (de) * 2007-12-17 2010-10-06 Hitachi Chemical Company, Ltd. OPTISCHEr Wellenleiter UND VERFAHREN ZU IHRER HERSTELLUNG
US8479887B2 (en) * 2008-08-15 2013-07-09 Otis Elevator Company Cord and polymer jacket assembly having a flame retardant in the polymer jacket material
TWI383950B (zh) 2009-04-22 2013-02-01 Ind Tech Res Inst 奈米點狀材料的形成方法
CN102555323B (zh) * 2010-12-31 2015-01-21 财团法人工业技术研究院 具有导电膜层的基板组合及其制造方法
US9349932B2 (en) 2011-08-29 2016-05-24 Koninklijke Philips N.V. Flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer
SG11201404196XA (en) 2012-01-20 2014-09-26 Asahi Kasei E Materials Corp Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same
WO2014172903A1 (en) * 2013-04-26 2014-10-30 The Procter & Gamble Company A glossy container
JP6702956B2 (ja) * 2014-10-10 2020-06-03 サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ ポリエーテルイミドワニス組成物、その製造方法およびそれから製造される物品
KR102520360B1 (ko) 2014-11-18 2023-04-11 가부시끼가이샤 레조낙 반도체 장치 및 그 제조 방법, 및 가요성 수지층 형성용 수지 조성물
CN108323171A (zh) * 2015-11-24 2018-07-24 琳得科株式会社 电路构件连接用树脂片
US11161966B2 (en) 2016-01-18 2021-11-02 The Procter And Gamble Company Article with visual effects
JP6631834B2 (ja) * 2016-01-26 2020-01-15 パナソニックＩｐマネジメント株式会社 金属張積層板、樹脂付き金属部材、及び配線板
CN106398115A (zh) * 2016-08-27 2017-02-15 安徽天瞳智能科技有限公司 一种热稳定性好线路板基材用环氧树脂组合物
US10982060B2 (en) 2018-02-13 2021-04-20 International Business Machines Corporation Glass-free dielectric layers for printed circuit boards
CN108437593A (zh) * 2018-04-16 2018-08-24 常州中英科技股份有限公司 一种低成本的热塑型聚烯烃基覆铜板
JP6966783B2 (ja) * 2018-11-08 2021-11-17 北川工業株式会社 難燃性低硬度材

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JP3854931B2 (ja) 2002-02-06 2006-12-06 積水化学工業株式会社 樹脂組成物

Also Published As

Publication number Publication date
EP1473328B1 (de) 2011-05-04
KR20040077946A (ko) 2004-09-07
EP1473328A4 (de) 2006-07-05
US20050165151A1 (en) 2005-07-28
EP1473328A1 (de) 2004-11-03
CN1643070A (zh) 2005-07-20
US7754803B2 (en) 2010-07-13
WO2003066740A1 (fr) 2003-08-14
TWI303647B (en) 2008-12-01
TW200302852A (en) 2003-08-16
CA2474693A1 (en) 2003-08-14
CN100372892C (zh) 2008-03-05
KR100704321B1 (ko) 2007-04-10
AU2003244465A1 (en) 2003-09-02

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