DE68905267D1 - Halbleiteranordnung von metallhoecker-typ und verfahren zu deren herstellung. - Google Patents

Halbleiteranordnung von metallhoecker-typ und verfahren zu deren herstellung.

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Publication number
DE68905267D1
DE68905267D1 DE8989116100T DE68905267T DE68905267D1 DE 68905267 D1 DE68905267 D1 DE 68905267D1 DE 8989116100 T DE8989116100 T DE 8989116100T DE 68905267 T DE68905267 T DE 68905267T DE 68905267 D1 DE68905267 D1 DE 68905267D1
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Germany
Prior art keywords
production
semiconductor arrangement
metal bumper
bumper type
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989116100T
Other languages
English (en)
Other versions
DE68905267T2 (de
Inventor
Makoto Intellectual Hideshima
Tetsujiro Intellectual Tsunoda
Shinjiro Intellectual P Kojima
Masaru Intellectual Prope Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE68905267D1 publication Critical patent/DE68905267D1/de
Publication of DE68905267T2 publication Critical patent/DE68905267T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/928—Front and rear surface processing
DE1989605267 1988-09-02 1989-08-31 Halbleiteranordnung von metallhoecker-typ und verfahren zu deren herstellung. Expired - Fee Related DE68905267T2 (de)

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JP63219726A JPH0267731A (ja) 1988-09-02 1988-09-02 はんだバンプ形半導体装置とその製造方法

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DE68905267T2 (de) 1993-09-09
US5143865A (en) 1992-09-01
KR0143086B1 (ko) 1998-07-01
JPH054809B2 (de) 1993-01-20
EP0357064A2 (de) 1990-03-07
KR900005585A (ko) 1990-04-14
EP0357064A3 (en) 1990-09-26
JPH0267731A (ja) 1990-03-07
EP0357064B1 (de) 1993-03-10

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