DE68911456T2 - Vorrichtung zum mechanischen Planpolieren. - Google Patents

Vorrichtung zum mechanischen Planpolieren.

Info

Publication number
DE68911456T2
DE68911456T2 DE68911456T DE68911456T DE68911456T2 DE 68911456 T2 DE68911456 T2 DE 68911456T2 DE 68911456 T DE68911456 T DE 68911456T DE 68911456 T DE68911456 T DE 68911456T DE 68911456 T2 DE68911456 T2 DE 68911456T2
Authority
DE
Germany
Prior art keywords
surface polishing
mechanical surface
mechanical
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68911456T
Other languages
English (en)
Other versions
DE68911456D1 (de
Inventor
Michael Albert Leach
Brian John Machesney
James Konrad Paulsen
Daniel John Venditti
Christopher Robert Whitaker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68911456D1 publication Critical patent/DE68911456D1/de
Application granted granted Critical
Publication of DE68911456T2 publication Critical patent/DE68911456T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
DE68911456T 1988-10-04 1989-08-09 Vorrichtung zum mechanischen Planpolieren. Expired - Fee Related DE68911456T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/253,028 US4934102A (en) 1988-10-04 1988-10-04 System for mechanical planarization

Publications (2)

Publication Number Publication Date
DE68911456D1 DE68911456D1 (de) 1994-01-27
DE68911456T2 true DE68911456T2 (de) 1994-06-23

Family

ID=22958538

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68911456T Expired - Fee Related DE68911456T2 (de) 1988-10-04 1989-08-09 Vorrichtung zum mechanischen Planpolieren.

Country Status (4)

Country Link
US (1) US4934102A (de)
EP (1) EP0362516B1 (de)
JP (1) JPH08359B2 (de)
DE (1) DE68911456T2 (de)

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5234867A (en) * 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
US5487697A (en) * 1993-02-09 1996-01-30 Rodel, Inc. Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5733175A (en) 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
ES2137459T3 (es) * 1994-08-09 1999-12-16 Ontrak Systems Inc Pulido lineal y metodo para la planarizacion de pastillas semiconductoras.
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
JP3566417B2 (ja) * 1994-10-31 2004-09-15 株式会社荏原製作所 ポリッシング装置
JPH08335562A (ja) * 1995-01-20 1996-12-17 Seiko Instr Inc 半導体装置およびその製造方法
DE69635534T2 (de) * 1995-02-15 2009-09-17 Texas Instruments Inc., Dallas Verbesserungen bei der oder in Bezug auf die Halbleiterverarbeitung
KR100227924B1 (ko) * 1995-07-28 1999-11-01 가이데 히사오 반도체 웨이퍼 제조방법, 그 방법에 사용되는 연삭방법 및 이에 사용되는 장치
DE19534080A1 (de) * 1995-09-14 1997-03-20 Wacker Siltronic Halbleitermat Verfahren zur Erzeugung einer stapelfehlerinduzierenden Beschädigung auf der Rückseite von Halbleiterscheiben
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
US5928062A (en) * 1997-04-30 1999-07-27 International Business Machines Corporation Vertical polishing device and method
US5897425A (en) * 1997-04-30 1999-04-27 International Business Machines Corporation Vertical polishing tool and method
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller
US6228231B1 (en) 1997-05-29 2001-05-08 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6071388A (en) * 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6056869A (en) * 1998-06-04 2000-05-02 International Business Machines Corporation Wafer edge deplater for chemical mechanical polishing of substrates
US5944588A (en) * 1998-06-25 1999-08-31 International Business Machines Corporation Chemical mechanical polisher
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
EP1052062A1 (de) * 1999-05-03 2000-11-15 Applied Materials, Inc. Vorbehandlung eines fixierten Schleifmittels
US6083082A (en) * 1999-08-30 2000-07-04 Lam Research Corporation Spindle assembly for force controlled polishing
US6347977B1 (en) * 1999-09-13 2002-02-19 Lam Research Corporation Method and system for chemical mechanical polishing
US6431959B1 (en) 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US6537144B1 (en) 2000-02-17 2003-03-25 Applied Materials, Inc. Method and apparatus for enhanced CMP using metals having reductive properties
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7678245B2 (en) * 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US6402591B1 (en) 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6261959B1 (en) 2000-03-31 2001-07-17 Lam Research Corporation Method and apparatus for chemically-mechanically polishing semiconductor wafers
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6428394B1 (en) 2000-03-31 2002-08-06 Lam Research Corporation Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6495464B1 (en) * 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
US6500056B1 (en) 2000-06-30 2002-12-31 Lam Research Corporation Linear reciprocating disposable belt polishing method and apparatus
US6896776B2 (en) 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US6875091B2 (en) 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6613200B2 (en) 2001-01-26 2003-09-02 Applied Materials, Inc. Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
US20060169597A1 (en) * 2001-03-14 2006-08-03 Applied Materials, Inc. Method and composition for polishing a substrate
US6811680B2 (en) * 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US7160432B2 (en) * 2001-03-14 2007-01-09 Applied Materials, Inc. Method and composition for polishing a substrate
US6899804B2 (en) * 2001-12-21 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
US7582564B2 (en) * 2001-03-14 2009-09-01 Applied Materials, Inc. Process and composition for conductive material removal by electrochemical mechanical polishing
US7232514B2 (en) * 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
US7128825B2 (en) 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US7323416B2 (en) * 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
US6592742B2 (en) 2001-07-13 2003-07-15 Applied Materials Inc. Electrochemically assisted chemical polish
US6863794B2 (en) * 2001-09-21 2005-03-08 Applied Materials, Inc. Method and apparatus for forming metal layers
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
US6645052B2 (en) 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
US20070295611A1 (en) * 2001-12-21 2007-12-27 Liu Feng Q Method and composition for polishing a substrate
US6837983B2 (en) 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US20040072445A1 (en) * 2002-07-11 2004-04-15 Applied Materials, Inc. Effective method to improve surface finish in electrochemically assisted CMP
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7842169B2 (en) * 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
US7390429B2 (en) * 2003-06-06 2008-06-24 Applied Materials, Inc. Method and composition for electrochemical mechanical polishing processing
US7025660B2 (en) * 2003-08-15 2006-04-11 Lam Research Corporation Assembly and method for generating a hydrodynamic air bearing
US20050092620A1 (en) * 2003-10-01 2005-05-05 Applied Materials, Inc. Methods and apparatus for polishing a substrate
US20050121141A1 (en) * 2003-11-13 2005-06-09 Manens Antoine P. Real time process control for a polishing process
US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7390744B2 (en) * 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US20060021974A1 (en) * 2004-01-29 2006-02-02 Applied Materials, Inc. Method and composition for polishing a substrate
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20060249394A1 (en) * 2005-05-05 2006-11-09 Applied Materials, Inc. Process and composition for electrochemical mechanical polishing
US20060249395A1 (en) * 2005-05-05 2006-11-09 Applied Material, Inc. Process and composition for electrochemical mechanical polishing
TW200720494A (en) * 2005-11-01 2007-06-01 Applied Materials Inc Ball contact cover for copper loss reduction and spike reduction
US20070151866A1 (en) * 2006-01-05 2007-07-05 Applied Materials, Inc. Substrate polishing with surface pretreatment
US20070254485A1 (en) * 2006-04-28 2007-11-01 Daxin Mao Abrasive composition for electrochemical mechanical polishing
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
CN109500669B (zh) * 2018-12-10 2020-05-05 皖西学院 一种可调式轴承加工固定打磨装置
CN110370096B (zh) * 2019-08-14 2021-04-13 珠海镇东有限公司 一种高精对磨刷板机的磨板方法
CN114574927A (zh) * 2022-03-07 2022-06-03 安徽中嘉环保建材科技有限公司 一种铝模板表面处理工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1899463A (en) * 1930-03-26 1933-02-28 Simonds Saw & Steel Co Method of and apparatus for grinding and polishing materials
US2536444A (en) * 1949-03-08 1951-01-02 Alfred E Hamilton Grinding and polishing apparatus
JPS54151984U (de) * 1978-04-14 1979-10-22
JPS604346Y2 (ja) * 1981-07-27 1985-02-07 古河電気工業株式会社 電気ケ−ブル製造装置
US4671018A (en) * 1985-11-15 1987-06-09 Ekhoff Donald L Rigid disk finishing apparatus

Also Published As

Publication number Publication date
JPH02139172A (ja) 1990-05-29
EP0362516B1 (de) 1993-12-15
US4934102A (en) 1990-06-19
EP0362516A3 (de) 1991-01-09
EP0362516A2 (de) 1990-04-11
JPH08359B2 (ja) 1996-01-10
DE68911456D1 (de) 1994-01-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee