DE68911495T2 - Zusammensetzung für eine Schaltungsverbindung, Verbindungsverfahren mit dieser Zusamensetzung und verbundene Struktur für Halbleiterchips. - Google Patents

Zusammensetzung für eine Schaltungsverbindung, Verbindungsverfahren mit dieser Zusamensetzung und verbundene Struktur für Halbleiterchips.

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Publication number
DE68911495T2
DE68911495T2 DE89312607T DE68911495T DE68911495T2 DE 68911495 T2 DE68911495 T2 DE 68911495T2 DE 89312607 T DE89312607 T DE 89312607T DE 68911495 T DE68911495 T DE 68911495T DE 68911495 T2 DE68911495 T2 DE 68911495T2
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Germany
Prior art keywords
composition
semiconductor chips
connected structure
connection
connection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE89312607T
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English (en)
Other versions
DE68911495D1 (de
Inventor
Isao Tsukagoshi
Yutaka Yamaguchi
Atsuo Nakajima
Yasushi Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
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Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE68911495D1 publication Critical patent/DE68911495D1/de
Publication of DE68911495T2 publication Critical patent/DE68911495T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
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    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
DE89312607T 1988-12-05 1989-12-04 Zusammensetzung für eine Schaltungsverbindung, Verbindungsverfahren mit dieser Zusamensetzung und verbundene Struktur für Halbleiterchips. Expired - Lifetime DE68911495T2 (de)

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US5120665A (en) 1992-06-09
KR900010986A (ko) 1990-07-11
JPH0329207A (ja) 1991-02-07
US5001542A (en) 1991-03-19
DE68911495D1 (de) 1994-01-27
EP0372880A3 (en) 1990-08-16
JP2586154B2 (ja) 1997-02-26
EP0372880A2 (de) 1990-06-13
KR930002935B1 (ko) 1993-04-15

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