DE68926509T2 - Verbindungsvorrichtung hoher dichte und hoher signalintegrität - Google Patents

Verbindungsvorrichtung hoher dichte und hoher signalintegrität

Info

Publication number
DE68926509T2
DE68926509T2 DE68926509T DE68926509T DE68926509T2 DE 68926509 T2 DE68926509 T2 DE 68926509T2 DE 68926509 T DE68926509 T DE 68926509T DE 68926509 T DE68926509 T DE 68926509T DE 68926509 T2 DE68926509 T2 DE 68926509T2
Authority
DE
Germany
Prior art keywords
connecting device
signal integrity
high density
high signal
density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68926509T
Other languages
English (en)
Other versions
DE68926509D1 (de
Inventor
John Krumme
Michael Perry
Gary Yasumura
Gerald Selvin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beta Phase Inc
Original Assignee
Beta Phase Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/255,500 external-priority patent/US4881908A/en
Application filed by Beta Phase Inc filed Critical Beta Phase Inc
Application granted granted Critical
Publication of DE68926509D1 publication Critical patent/DE68926509D1/de
Publication of DE68926509T2 publication Critical patent/DE68926509T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/01Connections using shape memory materials, e.g. shape memory metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/82Coupling devices connected with low or zero insertion force
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/82Coupling devices connected with low or zero insertion force
    • H01R12/83Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • H05K1/0281Reinforcement details thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/365Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
DE68926509T 1988-10-11 1989-10-11 Verbindungsvorrichtung hoher dichte und hoher signalintegrität Expired - Fee Related DE68926509T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US07/255,500 US4881908A (en) 1988-10-11 1988-10-11 High density and high signal integrity connector
US07/388,832 US4911643A (en) 1988-10-11 1989-08-03 High density and high signal integrity connector
US07/418,532 US5015193A (en) 1988-10-11 1989-10-10 High density and high signal integrity connector
PCT/US1989/004532 WO1990004270A1 (en) 1988-10-11 1989-10-11 High density and high signal integrity connector

Publications (2)

Publication Number Publication Date
DE68926509D1 DE68926509D1 (de) 1996-06-20
DE68926509T2 true DE68926509T2 (de) 1996-10-02

Family

ID=26944736

Family Applications (2)

Application Number Title Priority Date Filing Date
DE68929198T Expired - Fee Related DE68929198T2 (de) 1988-10-11 1989-10-11 Hochleistungsverbinder
DE68926509T Expired - Fee Related DE68926509T2 (de) 1988-10-11 1989-10-11 Verbindungsvorrichtung hoher dichte und hoher signalintegrität

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE68929198T Expired - Fee Related DE68929198T2 (de) 1988-10-11 1989-10-11 Hochleistungsverbinder

Country Status (6)

Country Link
US (2) US4911643A (de)
EP (2) EP0438504B1 (de)
JP (1) JP2848464B2 (de)
CA (1) CA2000382C (de)
DE (2) DE68929198T2 (de)
WO (1) WO1990004270A1 (de)

Families Citing this family (118)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5038201A (en) * 1988-11-08 1991-08-06 Westinghouse Electric Corp. Wafer scale integrated circuit apparatus
US5044980A (en) * 1990-01-16 1991-09-03 Beta Phase, Inc. High density and multiple insertion connector
US5159751A (en) * 1990-02-05 1992-11-03 Motorola, Inc. Method of manufacturing electronic module assembly
US5156553A (en) * 1990-05-29 1992-10-20 Kel Corporation Connector assembly for film circuitry
US5040997A (en) * 1990-06-08 1991-08-20 The Foxboro Company Flex circuit connector assembly and method for manufacturing the same
NL9001347A (nl) * 1990-06-14 1992-01-02 Burndy Electra Nv Contactsamenstel.
US5364277A (en) * 1990-09-11 1994-11-15 Hughes Aircraft Company Three-dimensional electroformed circuitry
US5102343A (en) * 1991-02-22 1992-04-07 International Business Machines Corporation Fluid pressure actuated electrical connector
US5507651A (en) * 1991-04-22 1996-04-16 Kel Corporation Connector assembly for film circuitry
SE468535B (sv) * 1991-06-14 1993-02-01 Ericsson Telefon Ab L M Anordning foer kontaktering av skaermade ledningar
US5133667A (en) * 1991-06-20 1992-07-28 Digital Equipment Corporation Flexible circuit connector
US5161986A (en) * 1991-10-15 1992-11-10 Ceridian Corporation Low inductance circuit apparatus with controlled impedance cross-unders and connector for connecting to backpanels
US5549479A (en) * 1991-11-18 1996-08-27 Berg Technology, Inc. Zero insertion force connector system for a flexible circuit
US5240420A (en) * 1992-03-31 1993-08-31 Research Organization For Circuit Knowledge Self-aligning high-density printed circuit connector
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US6205654B1 (en) * 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5308257A (en) * 1993-02-01 1994-05-03 The Whitaker Corporation ZIF card edge connector utilizing flexible film circuitry
US5409384A (en) * 1993-04-08 1995-04-25 The Whitaker Corporation Low profile board-to-board electrical connector
US5499924A (en) * 1993-07-12 1996-03-19 Kel Comporation Butt joint connector assembly
WO1995004391A1 (en) * 1993-07-29 1995-02-09 Beta Phase, Inc. Connector device for electrically interconnecting printed circuit board like members
JPH07312469A (ja) * 1994-05-16 1995-11-28 Nippon Mektron Ltd 多層フレキシブル回路基板の屈曲部構造
US5505625A (en) * 1994-05-17 1996-04-09 Beta Phase, Inc. Connector assembly for electrically interconnecting two printed circuit board like members
US5564931A (en) * 1994-05-24 1996-10-15 The Whitaker Corporation. Card edge connector using flexible film circuitry
US5501612A (en) * 1994-06-17 1996-03-26 The Whitaker Corporation Low profile board-to-board electrical connector
US5697794A (en) * 1994-10-18 1997-12-16 Itt Corporation High density connector assembly
EP0708502B1 (de) * 1994-10-21 2000-03-22 Japan Aviation Electronics Industry, Limited Anordnung aus einem elektrischen Steckverbinder und einem flexiblen integrierten Schaltkreis mit einem elastischen Isolierstück
US5616050A (en) * 1995-01-19 1997-04-01 Ast Research Inc. Flexible circuit connector
JP2717380B2 (ja) * 1995-05-30 1998-02-18 日本航空電子工業株式会社 カード型電子装置接続用コネクタ
US6139364A (en) * 1995-09-08 2000-10-31 Motorola, Inc. Apparatus for coupling RF signals
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
US6077090A (en) * 1997-06-10 2000-06-20 International Business Machines Corporation Flexible circuit connector with floating alignment frame
EP0929915B1 (de) 1997-07-29 2006-03-29 Hybricon Corporation Übersprechen- und signalübertragung eigenschaften verbesserten verbinder
US5971806A (en) * 1997-11-26 1999-10-26 Berg Technology, Inc. Electrical connector for connecting conductor areas of a flexible circuit with associated conductor pads of a circuit board
US5984704A (en) * 1998-04-13 1999-11-16 Japan Aviation Electronics Industry, Ltd. Zif connector having means for keeping flexible contact sheet in tensile condition
CN1338924A (zh) * 1999-01-08 2002-03-06 艾米斯菲尔技术有限公司 聚合物输送剂和输送剂化合物
US6323060B1 (en) 1999-05-05 2001-11-27 Dense-Pac Microsystems, Inc. Stackable flex circuit IC package and method of making same
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US20030170092A1 (en) * 1999-12-22 2003-09-11 Chiodo Joseph David Releasable fasteners
US6262895B1 (en) 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier
WO2001082416A1 (en) * 2000-04-20 2001-11-01 Vladimir Nikolaevich Davidov Pressure actuated zero insertion force socket
US6368146B2 (en) 2000-08-23 2002-04-09 Russell Abbott Alignment mechanism for a high density electrical connector
JP2002175855A (ja) * 2000-12-08 2002-06-21 Japan Aviation Electronics Industry Ltd コネクタ
US20050056921A1 (en) * 2003-09-15 2005-03-17 Staktek Group L.P. Stacked module systems and methods
US20050009234A1 (en) * 2001-10-26 2005-01-13 Staktek Group, L.P. Stacked module systems and methods for CSP packages
US7026708B2 (en) * 2001-10-26 2006-04-11 Staktek Group L.P. Low profile chip scale stacking system and method
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US6940729B2 (en) * 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US7202555B2 (en) * 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US20040195666A1 (en) * 2001-10-26 2004-10-07 Julian Partridge Stacked module systems and methods
US6914324B2 (en) * 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US20030234443A1 (en) * 2001-10-26 2003-12-25 Staktek Group, L.P. Low profile stacking system and method
US7310458B2 (en) 2001-10-26 2007-12-18 Staktek Group L.P. Stacked module systems and methods
US20060255446A1 (en) * 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US7053478B2 (en) * 2001-10-26 2006-05-30 Staktek Group L.P. Pitch change and chip scale stacking system
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US6884120B1 (en) 2002-06-27 2005-04-26 Siliconpipe, Inc. Array connector with deflectable coupling structure for mating with other components
DE10236128A1 (de) * 2002-08-07 2004-02-26 Daimlerchrysler Ag Elektrische Kontaktierung zwischen einer Komponente und einem biegsamen Leitungssatz
US6833696B2 (en) * 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
US6841029B2 (en) * 2003-03-27 2005-01-11 Advanced Cardiovascular Systems, Inc. Surface modification of expanded ultra high molecular weight polyethylene (eUHMWPE) for improved bondability
US20040245615A1 (en) * 2003-06-03 2004-12-09 Staktek Group, L.P. Point to point memory expansion system and method
US7542304B2 (en) * 2003-09-15 2009-06-02 Entorian Technologies, Lp Memory expansion and integrated circuit stacking system and method
US20060033187A1 (en) * 2004-08-12 2006-02-16 Staktek Group, L.P. Rugged CSP module system and method
US20060043558A1 (en) * 2004-09-01 2006-03-02 Staktek Group L.P. Stacked integrated circuit cascade signaling system and method
US7606050B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US20060050492A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7289327B2 (en) * 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules
US7606040B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Memory module system and method
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7468893B2 (en) * 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7511968B2 (en) * 2004-09-03 2009-03-31 Entorian Technologies, Lp Buffered thin module system and method
US7760513B2 (en) * 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US7616452B2 (en) 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US7423885B2 (en) * 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US7579687B2 (en) 2004-09-03 2009-08-25 Entorian Technologies, Lp Circuit module turbulence enhancement systems and methods
US7606049B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US7542297B2 (en) 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7446410B2 (en) 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7522421B2 (en) * 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US20060055024A1 (en) * 2004-09-14 2006-03-16 Staktek Group, L.P. Adapted leaded integrated circuit module
US20060072297A1 (en) * 2004-10-01 2006-04-06 Staktek Group L.P. Circuit Module Access System and Method
US7520965B2 (en) * 2004-10-12 2009-04-21 Southwest Research Institute Magnetron sputtering apparatus and method for depositing a coating using same
US20060118936A1 (en) * 2004-12-03 2006-06-08 Staktek Group L.P. Circuit module component mounting system and method
US7309914B2 (en) * 2005-01-20 2007-12-18 Staktek Group L.P. Inverted CSP stacking system and method
US20060175693A1 (en) * 2005-02-04 2006-08-10 Staktek Group, L.P. Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit
JP2006228453A (ja) 2005-02-15 2006-08-31 Japan Aviation Electronics Industry Ltd コネクタ
US20060244114A1 (en) * 2005-04-28 2006-11-02 Staktek Group L.P. Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam
US20060250780A1 (en) * 2005-05-06 2006-11-09 Staktek Group L.P. System component interposer
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US7576995B2 (en) * 2005-11-04 2009-08-18 Entorian Technologies, Lp Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
US20070158821A1 (en) * 2006-01-11 2007-07-12 Leland Szewerenko Managed memory component
US7605454B2 (en) 2006-01-11 2009-10-20 Entorian Technologies, Lp Memory card and method for devising
US7508069B2 (en) 2006-01-11 2009-03-24 Entorian Technologies, Lp Managed memory component
US7304382B2 (en) 2006-01-11 2007-12-04 Staktek Group L.P. Managed memory component
US7608920B2 (en) * 2006-01-11 2009-10-27 Entorian Technologies, Lp Memory card and method for devising
US7508058B2 (en) * 2006-01-11 2009-03-24 Entorian Technologies, Lp Stacked integrated circuit module
US20070164416A1 (en) * 2006-01-17 2007-07-19 James Douglas Wehrly Managed memory component
US20070176615A1 (en) * 2006-01-27 2007-08-02 Xandex, Inc. Active probe contact array management
US7511969B2 (en) * 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7252520B1 (en) * 2006-04-25 2007-08-07 Tyco Electronics Corporation Flex film card edge connector and cable assembly
US20070262429A1 (en) * 2006-05-15 2007-11-15 Staktek Group, L.P. Perimeter stacking system and method
US7468553B2 (en) * 2006-10-20 2008-12-23 Entorian Technologies, Lp Stackable micropackages and stacked modules
US7417310B2 (en) 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction
CN101740916B (zh) * 2008-11-19 2012-04-18 富士康(昆山)电脑接插件有限公司 电连接器及其组件
EP2197254B1 (de) * 2008-12-09 2011-08-31 Siemens Aktiengesellschaft Elektronikmodul für ein Anlagenmodul
CN102474030A (zh) * 2009-06-29 2012-05-23 Human电子株式会社 板对板连接器
KR20130069076A (ko) * 2011-12-16 2013-06-26 삼성전기주식회사 터치패널용 기판과 fpcb의 연결구조
JP6016244B2 (ja) * 2013-06-11 2016-10-26 日本航空電子工業株式会社 コネクタ
JP6581408B2 (ja) * 2015-07-03 2019-09-25 矢崎総業株式会社 ジョイント接続構造
JP6521775B2 (ja) * 2015-07-13 2019-05-29 矢崎総業株式会社 ケーブル固定構造
DE102016122577A1 (de) * 2016-11-23 2018-05-24 Endress+Hauser SE+Co. KG Leiterplatte und Verfahren zur Herstellung der Leiterplatte
US10056660B2 (en) * 2016-12-02 2018-08-21 International Business Machines Corporation Flexible electronic circuits including shape memory materials

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3319216A (en) * 1965-03-25 1967-05-09 Fischer & Porter Co Connector for flat cables
DE1802130A1 (de) * 1968-10-09 1970-04-23 Siemens Ag Vielfachstecker
US3569901A (en) * 1968-10-25 1971-03-09 Trw Inc Thermal-mating bimetal rollpins
US3740839A (en) * 1971-06-29 1973-06-26 Raychem Corp Cryogenic connection method and means
US3913444A (en) * 1972-11-08 1975-10-21 Raychem Corp Thermally deformable fastening pin
JPS53288A (en) * 1976-06-23 1978-01-05 Nippon Synthetic Chem Ind Co Ltd:The Preparation of fiber sizing resin
US4080027A (en) * 1976-07-30 1978-03-21 Gte Sylvania Incorporated Electrical contact and connector
US4085990A (en) * 1977-03-25 1978-04-25 Gte Sylvania, Incorporated Longitudinally actuated zero force connector
US4116516A (en) * 1977-06-24 1978-09-26 Gte Sylvania Incorporated Multiple layered connector
JPS5453288A (en) * 1977-10-04 1979-04-26 Fujitsu Ltd Zero-force connector
DE3062533D1 (en) * 1979-09-07 1983-05-05 Amp Inc Connector for connecting conductors of a flat cable to conductors on a substrate
US4303294A (en) * 1980-03-17 1981-12-01 Amp Incorporated Compound spring contact
FR2508720A1 (fr) * 1981-06-26 1982-12-31 Thomson Csf Dispositif de connexion pour carte de circuit imprime
US4487465A (en) * 1981-12-07 1984-12-11 Raychem Corporation Heat recoverable connecting device
GB2120466A (en) * 1982-05-14 1983-11-30 Itt Printed circuit board connector
US4517625A (en) * 1983-11-09 1985-05-14 Lockheed Corporation Circuit board housing with zero insertion force connector
FR2554977B1 (fr) * 1983-11-10 1986-02-07 App Meca Prec Const Connecteur pour carte de circuit electrique, notamment du genre carte accreditive a circuit electrique incorpore
EP0151253B1 (de) * 1984-02-06 1990-09-12 International Business Machines Corporation Kontaktmechanismus
US4587596A (en) * 1984-04-09 1986-05-06 Amp Incorporated High density mother/daughter circuit board connector
US4621882A (en) * 1984-05-14 1986-11-11 Beta Phase, Inc. Thermally responsive electrical connector
US4629270A (en) * 1984-07-16 1986-12-16 Amp Incorporated Zero insertion force card edge connector with flexible film circuitry
US4643500A (en) * 1985-11-13 1987-02-17 Beta Phase, Inc. Shape memory actuators for multi-contact electrical connectors
EP0260132B1 (de) * 1986-09-10 1994-06-15 The Furukawa Electric Co., Ltd. Ein elektronischer Verbinder
JPS6372079A (ja) * 1986-09-12 1988-04-01 古河電気工業株式会社 電子コネクタ
US4846709A (en) * 1987-10-22 1989-07-11 The Furukawa Electric Co., Ltd Reinforced connection for a chemical connector and method of constructing therefor

Also Published As

Publication number Publication date
JP2848464B2 (ja) 1999-01-20
DE68929198D1 (de) 2000-05-31
US4911643A (en) 1990-03-27
CA2000382C (en) 2000-04-18
US5015193A (en) 1991-05-14
DE68926509D1 (de) 1996-06-20
EP0683549A2 (de) 1995-11-22
WO1990004270A1 (en) 1990-04-19
EP0438504A4 (en) 1992-08-05
EP0683549B1 (de) 2000-04-26
EP0438504B1 (de) 1996-05-15
DE68929198T2 (de) 2001-02-15
EP0683549A3 (de) 1996-06-12
EP0438504A1 (de) 1991-07-31
JPH04501338A (ja) 1992-03-05
CA2000382A1 (en) 1990-04-11

Similar Documents

Publication Publication Date Title
DE68926509T2 (de) Verbindungsvorrichtung hoher dichte und hoher signalintegrität
KR900007081A (ko) 프로우브 장치
DE68927781D1 (de) Geometrisches Modellierungsverfahren und -gerät
DE68927790D1 (de) Aufzeichnungsvorrichtung
DE68929055D1 (de) Ultraschall-Dichtemessgerät und Verfahren
DE68928033D1 (de) Stereosynthesizer und entsprechendes verfahren
DK48491A (da) Indgrebs- og beskadigelsesindikerende indretning
DE69029534D1 (de) Aufzeichnungseinrichtung und Aufzeichnungsmethode
DE68928725T2 (de) Anschlusspunkt und Schnittstellenvorrichtung
KR900011249A (ko) 신호전송방법 및 신호전송장치
DE68929258T2 (de) Mikrorechner und Prüfverfahren
DE3891397T1 (de) Setz- und aufzuchtgeraet
KR900008489A (ko) 기록 및 재생 장치
DK298289D0 (da) Bionedbrydelige formede produkter og fremgangsmaade til fremstilling deraf
PT8052Y (pt) Dispositivo de armazenagem e doseamento
KR900702051A (ko) 자체-보정 측정장치 및 방법
KR910004938U (ko) 기록 및 재생 장치
DK176389D0 (da) Sonder
KR900011302A (ko) 기록 회로 및 기록장치
DE68928587T2 (de) Informationseingabeverfahren und vorrichtung
PT8051U (pt) Dispositivo de armazenagem e doseamento
KR900010473U (ko) 전자식 수직 및 수평측정장치
KR900003654U (ko) 테스트 신호 발생 및 음성신호 기록 시스템
SE8802695D0 (sv) Lasanordning
ES1009725Y (es) Dispositivo de atencion y o de alarma

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee