DE69001797T2 - Aufnahmeverfahren und -apparat für einen chipähnlichen Teil. - Google Patents
Aufnahmeverfahren und -apparat für einen chipähnlichen Teil.Info
- Publication number
- DE69001797T2 DE69001797T2 DE90123560T DE69001797T DE69001797T2 DE 69001797 T2 DE69001797 T2 DE 69001797T2 DE 90123560 T DE90123560 T DE 90123560T DE 69001797 T DE69001797 T DE 69001797T DE 69001797 T2 DE69001797 T2 DE 69001797T2
- Authority
- DE
- Germany
- Prior art keywords
- chip
- recording method
- recording
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
- Y10S156/941—Means for delaminating semiconductive product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49822—Disassembling by applying force
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1319327A JPH03180049A (ja) | 1989-12-08 | 1989-12-08 | 半導体装置のピックアップ方法 |
JP2151278A JPH0442555A (ja) | 1990-06-08 | 1990-06-08 | チップ状部品のピックアップ装置とピックアップ方法 |
JP2151279A JPH0442556A (ja) | 1990-06-08 | 1990-06-08 | チップ状部品のピックアップ装置とピックアップ方法 |
JP2151280A JPH0442557A (ja) | 1990-06-08 | 1990-06-08 | チップ状部品のピックアップ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69001797D1 DE69001797D1 (de) | 1993-07-08 |
DE69001797T2 true DE69001797T2 (de) | 1994-01-27 |
Family
ID=27473076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE90123560T Expired - Fee Related DE69001797T2 (de) | 1989-12-08 | 1990-12-07 | Aufnahmeverfahren und -apparat für einen chipähnlichen Teil. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5098501A (de) |
EP (1) | EP0431637B1 (de) |
KR (1) | KR940010646B1 (de) |
AU (1) | AU634838B2 (de) |
CA (1) | CA2031776A1 (de) |
DE (1) | DE69001797T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016001602A1 (de) | 2016-02-11 | 2017-08-17 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Lösen auf einem Substral bereitgestellter elektronischer Bauteile mittels einer Strahlenquelle |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5269868A (en) * | 1989-10-12 | 1993-12-14 | Mitsubishi Denki Kabushiki Kaisha | Method for separating bonded substrates, in particular disassembling a liquid crystal display device |
EP0539973A3 (en) * | 1991-11-01 | 1995-07-12 | Furukawa Electric Co Ltd | A surface-protection method during etching |
US5435876A (en) * | 1993-03-29 | 1995-07-25 | Texas Instruments Incorporated | Grid array masking tape process |
US5482899A (en) * | 1994-03-21 | 1996-01-09 | Texas Instruments Incorporated | Leveling block for semiconductor demounter |
DE4410179C1 (de) * | 1994-03-24 | 1995-11-23 | Bosch Gmbh Robert | Verfahren zum Aufnehmen eines elektrischen Bauelements |
TW285721B (de) * | 1994-12-27 | 1996-09-11 | Siemens Ag | |
JPH0917752A (ja) * | 1995-06-28 | 1997-01-17 | Sony Corp | 偏平な被切削物の切断方法及びその装置 |
JP3518786B2 (ja) * | 1995-12-02 | 2004-04-12 | リンテック株式会社 | ダイシングテープ用光照射装置および光照射方法 |
FR2743447B1 (fr) * | 1996-01-08 | 1998-02-06 | Siemens Automotive Sa | Procede d'inversion de puces electroniques |
JP3441879B2 (ja) | 1996-03-29 | 2003-09-02 | 日本碍子株式会社 | チップ剥離装置 |
JP3442224B2 (ja) * | 1996-07-04 | 2003-09-02 | 松下電器産業株式会社 | フリップチップ実装設備のic廃棄装置 |
US5827394A (en) * | 1996-07-15 | 1998-10-27 | Vanguard International Semiconductor Corporation | Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing |
US6389688B1 (en) | 1997-06-18 | 2002-05-21 | Micro Robotics Systems, Inc. | Method and apparatus for chip placement |
DE19753448A1 (de) * | 1997-12-02 | 1999-06-17 | Bosch Gmbh Robert | Verfahren zur Bauteilaufnahme von einer Haftfolie |
DE19831033C2 (de) * | 1998-07-11 | 2002-06-13 | Dual M Tech Ag | Rüstsatzfreie Vorrichtung zum zielgerichteten Bewegen von elektronischen Bauteilen |
DE19840210A1 (de) | 1998-09-03 | 2000-03-09 | Fraunhofer Ges Forschung | Verfahren zur Handhabung einer Mehrzahl von Schaltungschips |
US6248201B1 (en) * | 1999-05-14 | 2001-06-19 | Lucent Technologies, Inc. | Apparatus and method for chip processing |
FR2798513B1 (fr) * | 1999-09-10 | 2002-03-22 | Gemplus Card Int | Procede pour le report de microplaquettes de circuit integre et dispositif utilise |
JP2001176892A (ja) * | 1999-12-15 | 2001-06-29 | Shinkawa Ltd | ダイボンディング方法及びその装置 |
EP1174910A3 (de) * | 2000-07-20 | 2010-01-06 | Applied Materials, Inc. | Verfahren und Vorrichtung zum Lösen eines Substrats von einer Halteplatte |
JP2002050670A (ja) | 2000-08-04 | 2002-02-15 | Toshiba Corp | ピックアップ装置及びピックアップ方法 |
JP4021614B2 (ja) * | 2000-12-11 | 2007-12-12 | 株式会社東芝 | 半導体素子のピックアップ用治具、半導体素子のピックアップ装置、半導体素子のピックアップ方法、半導体装置の製造方法及び半導体装置の製造装置 |
JP2002322436A (ja) * | 2001-04-25 | 2002-11-08 | Nitto Denko Corp | 被着物の加熱剥離方法及び被着物加熱剥離装置 |
US6589809B1 (en) * | 2001-07-16 | 2003-07-08 | Micron Technology, Inc. | Method for attaching semiconductor components to a substrate using local UV curing of dicing tape |
DE10158563C1 (de) * | 2001-11-29 | 2003-07-17 | Infineon Technologies Ag | Verfahren zur Herstellung eines Bauelementmoduls |
US6896760B1 (en) * | 2002-01-16 | 2005-05-24 | Micron Technology, Inc. | Fabrication of stacked microelectronic devices |
AU2003223079A1 (en) | 2002-05-24 | 2003-12-12 | Koninklijke Philips Electronics N.V. | Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this |
JP2004111601A (ja) * | 2002-09-18 | 2004-04-08 | Tokyo Seimitsu Co Ltd | ダイボンダ |
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
KR100480628B1 (ko) * | 2002-11-11 | 2005-03-31 | 삼성전자주식회사 | 에어 블로잉을 이용한 칩 픽업 방법 및 장치 |
US8026126B2 (en) * | 2002-11-27 | 2011-09-27 | Asm Assembly Automation Ltd | Apparatus and method for thin die detachment |
DE10258800A1 (de) * | 2002-12-16 | 2004-07-08 | Siemens Ag | Verfahren und Vorrichtung zum Aufbringen einer Klebstoffschicht auf flächige Bauelemente, Bestückvorrichtung zum Bestücken von flächigen Bauelementen |
DE10260235B4 (de) | 2002-12-20 | 2010-10-28 | Infineon Technologies Ag | Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht |
US6930387B2 (en) * | 2003-01-22 | 2005-08-16 | Lucent Technologies Inc. | Dicing tape and die ejection method |
JP4283596B2 (ja) * | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
US6843878B1 (en) * | 2003-09-30 | 2005-01-18 | Hitachi Global Storage Technologies Netherlands, B.V. | Method of automatically debonding, processing, and handling fragile slider rows |
JP4275522B2 (ja) * | 2003-12-26 | 2009-06-10 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
EP1587138B1 (de) * | 2004-04-13 | 2007-05-30 | Oerlikon Assembly Equipment AG, Steinhausen | Einrichtung für die Montage von Halbleiterchips und Verfahren zum Ablösen eines Halbleiterchips von einer Folie |
US20060005770A1 (en) * | 2004-07-09 | 2006-01-12 | Robin Tiner | Independently moving substrate supports |
JP2006108281A (ja) * | 2004-10-04 | 2006-04-20 | Matsushita Electric Ind Co Ltd | 電子部品ピックアップ方法および電子部品搭載方法ならびに電子部品搭載装置 |
JP4624813B2 (ja) | 2005-01-21 | 2011-02-02 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体製造装置 |
US8127820B1 (en) * | 2005-06-28 | 2012-03-06 | Anwell Technologies Limited | System for producing optical recording medium |
US7479202B1 (en) * | 2005-06-28 | 2009-01-20 | Anwell Precision Technology (Hk) Limited | Bubble-free techniques for bonding substrates |
US20070158024A1 (en) * | 2006-01-11 | 2007-07-12 | Symbol Technologies, Inc. | Methods and systems for removing multiple die(s) from a surface |
US20070235496A1 (en) * | 2006-04-07 | 2007-10-11 | Yoganandan Sundar A L N | Multi-orifice collet for a pick-and-place machine |
KR20070120319A (ko) * | 2006-06-19 | 2007-12-24 | 삼성전자주식회사 | 한 쌍의 이젝터들을 구비하는 반도체 칩의 탈착 장치 및이를 이용한 반도체 칩의 탈착 방법 |
KR100943799B1 (ko) * | 2006-09-12 | 2010-02-23 | 닛토덴코 가부시키가이샤 | 다이싱·다이본드 필름 |
US7858493B2 (en) * | 2007-02-23 | 2010-12-28 | Finisar Corporation | Cleaving edge-emitting lasers from a wafer cell |
JP4693805B2 (ja) * | 2007-03-16 | 2011-06-01 | 株式会社東芝 | 半導体装置の製造装置及び製造方法 |
JP5136552B2 (ja) * | 2007-06-13 | 2013-02-06 | 富士通株式会社 | キャリアテープから電子部品を取り出す方法 |
NL1034087C2 (nl) | 2007-07-03 | 2009-01-06 | Assembleon Bv | Werkwijze voor het opnemen van een component alsmede inrichting geschikt voor het uitvoeren van een dergelijke werkwijze. |
US7771560B2 (en) * | 2007-09-28 | 2010-08-10 | International Business Machines Corporation | Methods to prevent ECC (edge chipping and cracking) damage during die picking process |
JP2012109538A (ja) | 2010-10-29 | 2012-06-07 | Tokyo Ohka Kogyo Co Ltd | 積層体、およびその積層体の分離方法 |
JP5802106B2 (ja) * | 2010-11-15 | 2015-10-28 | 東京応化工業株式会社 | 積層体、および分離方法 |
DE102015100512A1 (de) * | 2015-01-14 | 2016-07-14 | Infineon Technologies Austria Ag | Versprödungsvorrichtung, Aufnahmesystem und Verfahren zum Aufnehmen von Chips |
WO2018139667A1 (ja) * | 2017-01-30 | 2018-08-02 | 株式会社新川 | ピックアップ装置およびピックアップ方法 |
CN109911612B (zh) * | 2019-04-23 | 2021-09-14 | 深圳市高士达科技有限公司 | 一种芯片拾取设备 |
KR102516448B1 (ko) * | 2021-07-22 | 2023-03-31 | 세메스 주식회사 | 다이 이젝팅 장치 및 이를 포함하는 다이 본딩 설비 |
CN116528502B (zh) * | 2023-07-05 | 2023-08-22 | 北京三重华星电子科技有限公司 | 贴片装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3973682A (en) * | 1974-12-20 | 1976-08-10 | International Business Machines Corporation | Pick up assembly for fragile devices |
DE3671577D1 (de) * | 1985-02-14 | 1990-06-28 | Bando Chemical Ind | Verfahren zum schneiden einer halbleiterscheibe in wuerfel. |
JPS6247146A (ja) * | 1985-08-27 | 1987-02-28 | Toshiba Corp | チツプ分離装置 |
JPS62128139A (ja) * | 1985-11-29 | 1987-06-10 | Toshiba Corp | 剥離装置 |
PH25206A (en) * | 1985-12-12 | 1991-03-27 | Lintec K K | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
JPS62232935A (ja) * | 1986-04-03 | 1987-10-13 | Mitsubishi Electric Corp | チツプ取り出し装置 |
JPS6392038A (ja) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Ind Co Ltd | チツプ供給方法 |
DE69009259T2 (de) * | 1989-02-02 | 1994-10-13 | Matsushita Electric Ind Co Ltd | Verfahren zum Zusammensetzen von Halbleiteranordnungen. |
-
1990
- 1990-12-07 DE DE90123560T patent/DE69001797T2/de not_active Expired - Fee Related
- 1990-12-07 AU AU67894/90A patent/AU634838B2/en not_active Ceased
- 1990-12-07 CA CA002031776A patent/CA2031776A1/en not_active Abandoned
- 1990-12-07 US US07/623,574 patent/US5098501A/en not_active Expired - Fee Related
- 1990-12-07 EP EP90123560A patent/EP0431637B1/de not_active Expired - Lifetime
- 1990-12-08 KR KR1019900020172A patent/KR940010646B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016001602A1 (de) | 2016-02-11 | 2017-08-17 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Lösen auf einem Substral bereitgestellter elektronischer Bauteile mittels einer Strahlenquelle |
Also Published As
Publication number | Publication date |
---|---|
AU6789490A (en) | 1991-06-13 |
KR910013503A (ko) | 1991-08-08 |
US5098501A (en) | 1992-03-24 |
EP0431637A1 (de) | 1991-06-12 |
AU634838B2 (en) | 1993-03-04 |
DE69001797D1 (de) | 1993-07-08 |
EP0431637B1 (de) | 1993-06-02 |
KR940010646B1 (ko) | 1994-10-24 |
CA2031776A1 (en) | 1991-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |