DE69001797T2 - Aufnahmeverfahren und -apparat für einen chipähnlichen Teil. - Google Patents

Aufnahmeverfahren und -apparat für einen chipähnlichen Teil.

Info

Publication number
DE69001797T2
DE69001797T2 DE90123560T DE69001797T DE69001797T2 DE 69001797 T2 DE69001797 T2 DE 69001797T2 DE 90123560 T DE90123560 T DE 90123560T DE 69001797 T DE69001797 T DE 69001797T DE 69001797 T2 DE69001797 T2 DE 69001797T2
Authority
DE
Germany
Prior art keywords
chip
recording method
recording
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE90123560T
Other languages
English (en)
Other versions
DE69001797D1 (de
Inventor
Masanori Nishiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1319327A external-priority patent/JPH03180049A/ja
Priority claimed from JP2151278A external-priority patent/JPH0442555A/ja
Priority claimed from JP2151279A external-priority patent/JPH0442556A/ja
Priority claimed from JP2151280A external-priority patent/JPH0442557A/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69001797D1 publication Critical patent/DE69001797D1/de
Publication of DE69001797T2 publication Critical patent/DE69001797T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/021Loading or unloading of containers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941Means for delaminating semiconductive product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19Delaminating means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49815Disassembling
    • Y10T29/49822Disassembling by applying force
DE90123560T 1989-12-08 1990-12-07 Aufnahmeverfahren und -apparat für einen chipähnlichen Teil. Expired - Fee Related DE69001797T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1319327A JPH03180049A (ja) 1989-12-08 1989-12-08 半導体装置のピックアップ方法
JP2151278A JPH0442555A (ja) 1990-06-08 1990-06-08 チップ状部品のピックアップ装置とピックアップ方法
JP2151279A JPH0442556A (ja) 1990-06-08 1990-06-08 チップ状部品のピックアップ装置とピックアップ方法
JP2151280A JPH0442557A (ja) 1990-06-08 1990-06-08 チップ状部品のピックアップ装置

Publications (2)

Publication Number Publication Date
DE69001797D1 DE69001797D1 (de) 1993-07-08
DE69001797T2 true DE69001797T2 (de) 1994-01-27

Family

ID=27473076

Family Applications (1)

Application Number Title Priority Date Filing Date
DE90123560T Expired - Fee Related DE69001797T2 (de) 1989-12-08 1990-12-07 Aufnahmeverfahren und -apparat für einen chipähnlichen Teil.

Country Status (6)

Country Link
US (1) US5098501A (de)
EP (1) EP0431637B1 (de)
KR (1) KR940010646B1 (de)
AU (1) AU634838B2 (de)
CA (1) CA2031776A1 (de)
DE (1) DE69001797T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016001602A1 (de) 2016-02-11 2017-08-17 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Lösen auf einem Substral bereitgestellter elektronischer Bauteile mittels einer Strahlenquelle

Families Citing this family (60)

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US5269868A (en) * 1989-10-12 1993-12-14 Mitsubishi Denki Kabushiki Kaisha Method for separating bonded substrates, in particular disassembling a liquid crystal display device
EP0539973A3 (en) * 1991-11-01 1995-07-12 Furukawa Electric Co Ltd A surface-protection method during etching
US5435876A (en) * 1993-03-29 1995-07-25 Texas Instruments Incorporated Grid array masking tape process
US5482899A (en) * 1994-03-21 1996-01-09 Texas Instruments Incorporated Leveling block for semiconductor demounter
DE4410179C1 (de) * 1994-03-24 1995-11-23 Bosch Gmbh Robert Verfahren zum Aufnehmen eines elektrischen Bauelements
TW285721B (de) * 1994-12-27 1996-09-11 Siemens Ag
JPH0917752A (ja) * 1995-06-28 1997-01-17 Sony Corp 偏平な被切削物の切断方法及びその装置
JP3518786B2 (ja) * 1995-12-02 2004-04-12 リンテック株式会社 ダイシングテープ用光照射装置および光照射方法
FR2743447B1 (fr) * 1996-01-08 1998-02-06 Siemens Automotive Sa Procede d'inversion de puces electroniques
JP3441879B2 (ja) 1996-03-29 2003-09-02 日本碍子株式会社 チップ剥離装置
JP3442224B2 (ja) * 1996-07-04 2003-09-02 松下電器産業株式会社 フリップチップ実装設備のic廃棄装置
US5827394A (en) * 1996-07-15 1998-10-27 Vanguard International Semiconductor Corporation Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing
US6389688B1 (en) 1997-06-18 2002-05-21 Micro Robotics Systems, Inc. Method and apparatus for chip placement
DE19753448A1 (de) * 1997-12-02 1999-06-17 Bosch Gmbh Robert Verfahren zur Bauteilaufnahme von einer Haftfolie
DE19831033C2 (de) * 1998-07-11 2002-06-13 Dual M Tech Ag Rüstsatzfreie Vorrichtung zum zielgerichteten Bewegen von elektronischen Bauteilen
DE19840210A1 (de) 1998-09-03 2000-03-09 Fraunhofer Ges Forschung Verfahren zur Handhabung einer Mehrzahl von Schaltungschips
US6248201B1 (en) * 1999-05-14 2001-06-19 Lucent Technologies, Inc. Apparatus and method for chip processing
FR2798513B1 (fr) * 1999-09-10 2002-03-22 Gemplus Card Int Procede pour le report de microplaquettes de circuit integre et dispositif utilise
JP2001176892A (ja) * 1999-12-15 2001-06-29 Shinkawa Ltd ダイボンディング方法及びその装置
EP1174910A3 (de) * 2000-07-20 2010-01-06 Applied Materials, Inc. Verfahren und Vorrichtung zum Lösen eines Substrats von einer Halteplatte
JP2002050670A (ja) 2000-08-04 2002-02-15 Toshiba Corp ピックアップ装置及びピックアップ方法
JP4021614B2 (ja) * 2000-12-11 2007-12-12 株式会社東芝 半導体素子のピックアップ用治具、半導体素子のピックアップ装置、半導体素子のピックアップ方法、半導体装置の製造方法及び半導体装置の製造装置
JP2002322436A (ja) * 2001-04-25 2002-11-08 Nitto Denko Corp 被着物の加熱剥離方法及び被着物加熱剥離装置
US6589809B1 (en) * 2001-07-16 2003-07-08 Micron Technology, Inc. Method for attaching semiconductor components to a substrate using local UV curing of dicing tape
DE10158563C1 (de) * 2001-11-29 2003-07-17 Infineon Technologies Ag Verfahren zur Herstellung eines Bauelementmoduls
US6896760B1 (en) * 2002-01-16 2005-05-24 Micron Technology, Inc. Fabrication of stacked microelectronic devices
AU2003223079A1 (en) 2002-05-24 2003-12-12 Koninklijke Philips Electronics N.V. Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this
JP2004111601A (ja) * 2002-09-18 2004-04-08 Tokyo Seimitsu Co Ltd ダイボンダ
JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
KR100480628B1 (ko) * 2002-11-11 2005-03-31 삼성전자주식회사 에어 블로잉을 이용한 칩 픽업 방법 및 장치
US8026126B2 (en) * 2002-11-27 2011-09-27 Asm Assembly Automation Ltd Apparatus and method for thin die detachment
DE10258800A1 (de) * 2002-12-16 2004-07-08 Siemens Ag Verfahren und Vorrichtung zum Aufbringen einer Klebstoffschicht auf flächige Bauelemente, Bestückvorrichtung zum Bestücken von flächigen Bauelementen
DE10260235B4 (de) 2002-12-20 2010-10-28 Infineon Technologies Ag Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht
US6930387B2 (en) * 2003-01-22 2005-08-16 Lucent Technologies Inc. Dicing tape and die ejection method
JP4283596B2 (ja) * 2003-05-29 2009-06-24 日東電工株式会社 チップ状ワークの固定方法
US6843878B1 (en) * 2003-09-30 2005-01-18 Hitachi Global Storage Technologies Netherlands, B.V. Method of automatically debonding, processing, and handling fragile slider rows
JP4275522B2 (ja) * 2003-12-26 2009-06-10 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
EP1587138B1 (de) * 2004-04-13 2007-05-30 Oerlikon Assembly Equipment AG, Steinhausen Einrichtung für die Montage von Halbleiterchips und Verfahren zum Ablösen eines Halbleiterchips von einer Folie
US20060005770A1 (en) * 2004-07-09 2006-01-12 Robin Tiner Independently moving substrate supports
JP2006108281A (ja) * 2004-10-04 2006-04-20 Matsushita Electric Ind Co Ltd 電子部品ピックアップ方法および電子部品搭載方法ならびに電子部品搭載装置
JP4624813B2 (ja) 2005-01-21 2011-02-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
US8127820B1 (en) * 2005-06-28 2012-03-06 Anwell Technologies Limited System for producing optical recording medium
US7479202B1 (en) * 2005-06-28 2009-01-20 Anwell Precision Technology (Hk) Limited Bubble-free techniques for bonding substrates
US20070158024A1 (en) * 2006-01-11 2007-07-12 Symbol Technologies, Inc. Methods and systems for removing multiple die(s) from a surface
US20070235496A1 (en) * 2006-04-07 2007-10-11 Yoganandan Sundar A L N Multi-orifice collet for a pick-and-place machine
KR20070120319A (ko) * 2006-06-19 2007-12-24 삼성전자주식회사 한 쌍의 이젝터들을 구비하는 반도체 칩의 탈착 장치 및이를 이용한 반도체 칩의 탈착 방법
KR100943799B1 (ko) * 2006-09-12 2010-02-23 닛토덴코 가부시키가이샤 다이싱·다이본드 필름
US7858493B2 (en) * 2007-02-23 2010-12-28 Finisar Corporation Cleaving edge-emitting lasers from a wafer cell
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
JP5136552B2 (ja) * 2007-06-13 2013-02-06 富士通株式会社 キャリアテープから電子部品を取り出す方法
NL1034087C2 (nl) 2007-07-03 2009-01-06 Assembleon Bv Werkwijze voor het opnemen van een component alsmede inrichting geschikt voor het uitvoeren van een dergelijke werkwijze.
US7771560B2 (en) * 2007-09-28 2010-08-10 International Business Machines Corporation Methods to prevent ECC (edge chipping and cracking) damage during die picking process
JP2012109538A (ja) 2010-10-29 2012-06-07 Tokyo Ohka Kogyo Co Ltd 積層体、およびその積層体の分離方法
JP5802106B2 (ja) * 2010-11-15 2015-10-28 東京応化工業株式会社 積層体、および分離方法
DE102015100512A1 (de) * 2015-01-14 2016-07-14 Infineon Technologies Austria Ag Versprödungsvorrichtung, Aufnahmesystem und Verfahren zum Aufnehmen von Chips
WO2018139667A1 (ja) * 2017-01-30 2018-08-02 株式会社新川 ピックアップ装置およびピックアップ方法
CN109911612B (zh) * 2019-04-23 2021-09-14 深圳市高士达科技有限公司 一种芯片拾取设备
KR102516448B1 (ko) * 2021-07-22 2023-03-31 세메스 주식회사 다이 이젝팅 장치 및 이를 포함하는 다이 본딩 설비
CN116528502B (zh) * 2023-07-05 2023-08-22 北京三重华星电子科技有限公司 贴片装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016001602A1 (de) 2016-02-11 2017-08-17 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Lösen auf einem Substral bereitgestellter elektronischer Bauteile mittels einer Strahlenquelle

Also Published As

Publication number Publication date
AU6789490A (en) 1991-06-13
KR910013503A (ko) 1991-08-08
US5098501A (en) 1992-03-24
EP0431637A1 (de) 1991-06-12
AU634838B2 (en) 1993-03-04
DE69001797D1 (de) 1993-07-08
EP0431637B1 (de) 1993-06-02
KR940010646B1 (ko) 1994-10-24
CA2031776A1 (en) 1991-06-09

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8339 Ceased/non-payment of the annual fee