DE69018717D1 - Verfahren zur Herstellung eines Polyimidfilms. - Google Patents
Verfahren zur Herstellung eines Polyimidfilms.Info
- Publication number
- DE69018717D1 DE69018717D1 DE69018717T DE69018717T DE69018717D1 DE 69018717 D1 DE69018717 D1 DE 69018717D1 DE 69018717 T DE69018717 T DE 69018717T DE 69018717 T DE69018717 T DE 69018717T DE 69018717 D1 DE69018717 D1 DE 69018717D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- polyimide film
- polyimide
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
- B29C55/005—Shaping by stretching, e.g. drawing through a die; Apparatus therefor characterised by the choice of materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
- B29K2079/085—Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18246489 | 1989-07-17 | ||
JP18246289 | 1989-07-17 | ||
JP18246389 | 1989-07-17 | ||
JP25076689 | 1989-09-28 | ||
JP27150389 | 1989-10-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69018717D1 true DE69018717D1 (de) | 1995-05-24 |
DE69018717T2 DE69018717T2 (de) | 1995-08-17 |
Family
ID=27528829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1990618717 Expired - Fee Related DE69018717T2 (de) | 1989-07-17 | 1990-07-10 | Verfahren zur Herstellung eines Polyimidfilms. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5260407A (de) |
EP (1) | EP0409466B1 (de) |
JP (1) | JPH0778136B2 (de) |
KR (1) | KR930002990B1 (de) |
CA (1) | CA2021293A1 (de) |
DE (1) | DE69018717T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5288843A (en) * | 1987-05-20 | 1994-02-22 | Mitsui Toatsu Chemicals, Inc. | Polyimides, process for the preparation thereof and polyimide resin compositions |
JPH0794555B2 (ja) * | 1988-10-20 | 1995-10-11 | 三井東圧化学株式会社 | ポリイミドシートの製造方法 |
JPH03103444A (ja) * | 1989-09-16 | 1991-04-30 | Mitsui Toatsu Chem Inc | ポリイミド成形体の製造方法 |
JP4264214B2 (ja) * | 2000-04-20 | 2009-05-13 | 帝人株式会社 | ポリイミドフィルム |
KR20090004894A (ko) * | 2006-03-31 | 2009-01-12 | 구라시키 보세키 가부시키가이샤 | 열가소성 폴리이미드층을 갖는 연성 적층판 및 그의 제조 방법 |
JP5119401B2 (ja) * | 2007-02-01 | 2013-01-16 | 倉敷紡績株式会社 | 熱可塑性ポリイミド層を有するフレキシブル積層板及びその製造方法 |
US8568867B2 (en) * | 2006-06-26 | 2013-10-29 | Sabic Innovative Plastics Ip B.V. | Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof |
US8545975B2 (en) * | 2006-06-26 | 2013-10-01 | Sabic Innovative Plastics Ip B.V. | Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof |
US9161440B2 (en) * | 2006-06-26 | 2015-10-13 | Sabic Global Technologies B.V. | Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof |
US7928154B2 (en) | 2006-06-26 | 2011-04-19 | Sabic Innovative Plastics Ip B.V. | Methods of preparing polymer-organoclay composites and articles derived therefrom |
US8399573B2 (en) | 2006-11-22 | 2013-03-19 | Sabic Innovative Plastics Ip B.V. | Polymer blend compositions |
US20080118730A1 (en) * | 2006-11-22 | 2008-05-22 | Ta-Hua Yu | Biaxially oriented film, laminates made therefrom, and method |
US20080119616A1 (en) * | 2006-11-22 | 2008-05-22 | General Electric Company | Polyimide resin compositions |
KR20140034819A (ko) * | 2011-05-12 | 2014-03-20 | 사빅 이노베이티브 플라스틱스 아이피 비.브이. | 커패시터용 비정질 폴리에테르이미드 필름, 이의 제조 방법 및 이로부터 제조된 물품 |
KR101863351B1 (ko) | 2011-05-12 | 2018-05-31 | 사빅 글로벌 테크놀러지스 비.브이. | 커패시터용 비정질 폴리카보네이트 필름, 이의 제조 방법, 및 이로부터 제조된 물품 |
US10077345B2 (en) | 2013-05-31 | 2018-09-18 | Sabic Global Technologies B.V. | Capacitor films, methods of manufacture, and articles manufactured therefrom |
US9659711B2 (en) | 2013-05-31 | 2017-05-23 | Sabic Global Technologies B.V. | Capacitor films, methods of manufacture, and articles manufactured therefrom |
EP3039061B1 (de) | 2013-08-28 | 2018-07-25 | SABIC Global Technologies B.V. | Amorphe polycarbonatfolien für kondensatoren, verfahren zur herstellung und daraus hergestellte artikel |
US20160221275A1 (en) * | 2015-01-29 | 2016-08-04 | Rohr, Inc. | Method of manufacturing a polyimide film |
KR101898455B1 (ko) * | 2016-03-31 | 2018-09-13 | 가부시키가이샤 아이.에스.티 | 폴리이미드 섬유 및 폴리이미드 섬유의 제조 방법 |
KR102452649B1 (ko) * | 2016-10-21 | 2022-10-07 | 삼성전자주식회사 | 적층 투명 필름, 표시 장치용 윈도우 및 표시 장치 |
EP3722069B1 (de) * | 2017-12-04 | 2024-04-10 | Kolon Industries, Inc. | Verfahren zur herstellung einer auf polyimid basierenden folie |
JP7334446B2 (ja) * | 2019-04-01 | 2023-08-29 | 大日本印刷株式会社 | フィルム、ポリイミドフィルム、積層体、ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置 |
KR20210001810A (ko) * | 2019-06-28 | 2021-01-06 | 에스케이씨 주식회사 | 폴리이미드계 필름 및 이의 제조 방법 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619461A (en) * | 1969-03-25 | 1971-11-09 | Du Pont | Stretching process for polyimide film |
JPS56118421A (en) * | 1980-02-25 | 1981-09-17 | Nitto Electric Ind Co Ltd | Heat-shrinkable polyimide film and production thereof |
US4847349A (en) * | 1985-08-27 | 1989-07-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines |
DE3783477T2 (de) * | 1986-02-25 | 1993-06-17 | Mitsui Toatsu Chemicals | Hochtemperatur-polyimidklebstoff. |
JPS62201524A (ja) * | 1986-02-28 | 1987-09-05 | 井関農機株式会社 | 播種機 |
JPH0655432B2 (ja) * | 1986-03-14 | 1994-07-27 | 宇部興産株式会社 | 高物性ポリイミド延伸成形体およびその製法 |
JPH083041B2 (ja) * | 1986-06-30 | 1996-01-17 | 三井東圧化学株式会社 | ポリイミド樹脂組成物 |
JP2585552B2 (ja) * | 1986-11-19 | 1997-02-26 | 三井東圧化学株式会社 | ポリイミド |
JPS63242625A (ja) * | 1987-03-31 | 1988-10-07 | Hitachi Chem Co Ltd | 高延伸ポリイミドフイルムの製法 |
AU592502B2 (en) * | 1987-06-01 | 1990-01-11 | Mitsui Toatsu Chemicals Inc. | Polyimide resin composition |
AT387783B (de) * | 1987-06-09 | 1989-03-10 | Chemiefaser Lenzing Ag | Verfahren zur herstellung von hochtemperaturbestaendigen folien |
JPH01198638A (ja) * | 1987-08-21 | 1989-08-10 | Ube Ind Ltd | ポリイミドフィルムの製造法 |
US4966680A (en) * | 1988-05-31 | 1990-10-30 | Mobil Oil Corporation | Integrated catalytic cracking process with light olefin upgrading |
-
1990
- 1990-07-09 US US07/550,015 patent/US5260407A/en not_active Expired - Fee Related
- 1990-07-10 EP EP19900307507 patent/EP0409466B1/de not_active Expired - Lifetime
- 1990-07-10 DE DE1990618717 patent/DE69018717T2/de not_active Expired - Fee Related
- 1990-07-12 JP JP18264090A patent/JPH0778136B2/ja not_active Expired - Lifetime
- 1990-07-16 KR KR1019900010766A patent/KR930002990B1/ko not_active IP Right Cessation
- 1990-07-16 CA CA 2021293 patent/CA2021293A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE69018717T2 (de) | 1995-08-17 |
JPH0778136B2 (ja) | 1995-08-23 |
EP0409466A2 (de) | 1991-01-23 |
KR910002968A (ko) | 1991-02-26 |
EP0409466A3 (en) | 1991-10-02 |
KR930002990B1 (ko) | 1993-04-16 |
EP0409466B1 (de) | 1995-04-19 |
JPH03205432A (ja) | 1991-09-06 |
CA2021293A1 (en) | 1991-01-18 |
US5260407A (en) | 1993-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: MITSUI CHEMICALS, INC., TOKIO/TOKYO, JP |
|
8339 | Ceased/non-payment of the annual fee |