DE69018717T2 - Verfahren zur Herstellung eines Polyimidfilms. - Google Patents

Verfahren zur Herstellung eines Polyimidfilms.

Info

Publication number
DE69018717T2
DE69018717T2 DE1990618717 DE69018717T DE69018717T2 DE 69018717 T2 DE69018717 T2 DE 69018717T2 DE 1990618717 DE1990618717 DE 1990618717 DE 69018717 T DE69018717 T DE 69018717T DE 69018717 T2 DE69018717 T2 DE 69018717T2
Authority
DE
Germany
Prior art keywords
producing
polyimide film
polyimide
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1990618717
Other languages
English (en)
Other versions
DE69018717D1 (de
Inventor
Masumi Mitsui Apart Saruwatari
Yasuhiro Mitsui Toatsu T Fujii
Yasuhiko Mitsui Toatsu Ta Ohta
Yasuko Honji
Shoichi Tsuji
Shinobu Moriya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Application granted granted Critical
Publication of DE69018717D1 publication Critical patent/DE69018717D1/de
Publication of DE69018717T2 publication Critical patent/DE69018717T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/005—Shaping by stretching, e.g. drawing through a die; Apparatus therefor characterised by the choice of materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B29K2079/085—Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
DE1990618717 1989-07-17 1990-07-10 Verfahren zur Herstellung eines Polyimidfilms. Expired - Fee Related DE69018717T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP18246489 1989-07-17
JP18246289 1989-07-17
JP18246389 1989-07-17
JP25076689 1989-09-28
JP27150389 1989-10-20

Publications (2)

Publication Number Publication Date
DE69018717D1 DE69018717D1 (de) 1995-05-24
DE69018717T2 true DE69018717T2 (de) 1995-08-17

Family

ID=27528829

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1990618717 Expired - Fee Related DE69018717T2 (de) 1989-07-17 1990-07-10 Verfahren zur Herstellung eines Polyimidfilms.

Country Status (6)

Country Link
US (1) US5260407A (de)
EP (1) EP0409466B1 (de)
JP (1) JPH0778136B2 (de)
KR (1) KR930002990B1 (de)
CA (1) CA2021293A1 (de)
DE (1) DE69018717T2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288843A (en) * 1987-05-20 1994-02-22 Mitsui Toatsu Chemicals, Inc. Polyimides, process for the preparation thereof and polyimide resin compositions
JPH0794555B2 (ja) * 1988-10-20 1995-10-11 三井東圧化学株式会社 ポリイミドシートの製造方法
JPH03103444A (ja) * 1989-09-16 1991-04-30 Mitsui Toatsu Chem Inc ポリイミド成形体の製造方法
JP4264214B2 (ja) * 2000-04-20 2009-05-13 帝人株式会社 ポリイミドフィルム
KR20090004894A (ko) * 2006-03-31 2009-01-12 구라시키 보세키 가부시키가이샤 열가소성 폴리이미드층을 갖는 연성 적층판 및 그의 제조 방법
JP5119401B2 (ja) * 2007-02-01 2013-01-16 倉敷紡績株式会社 熱可塑性ポリイミド層を有するフレキシブル積層板及びその製造方法
US8568867B2 (en) * 2006-06-26 2013-10-29 Sabic Innovative Plastics Ip B.V. Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US8545975B2 (en) * 2006-06-26 2013-10-01 Sabic Innovative Plastics Ip B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US9161440B2 (en) * 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US7928154B2 (en) 2006-06-26 2011-04-19 Sabic Innovative Plastics Ip B.V. Methods of preparing polymer-organoclay composites and articles derived therefrom
US8399573B2 (en) 2006-11-22 2013-03-19 Sabic Innovative Plastics Ip B.V. Polymer blend compositions
US20080118730A1 (en) * 2006-11-22 2008-05-22 Ta-Hua Yu Biaxially oriented film, laminates made therefrom, and method
US20080119616A1 (en) * 2006-11-22 2008-05-22 General Electric Company Polyimide resin compositions
KR20140034819A (ko) * 2011-05-12 2014-03-20 사빅 이노베이티브 플라스틱스 아이피 비.브이. 커패시터용 비정질 폴리에테르이미드 필름, 이의 제조 방법 및 이로부터 제조된 물품
KR101863351B1 (ko) 2011-05-12 2018-05-31 사빅 글로벌 테크놀러지스 비.브이. 커패시터용 비정질 폴리카보네이트 필름, 이의 제조 방법, 및 이로부터 제조된 물품
US10077345B2 (en) 2013-05-31 2018-09-18 Sabic Global Technologies B.V. Capacitor films, methods of manufacture, and articles manufactured therefrom
US9659711B2 (en) 2013-05-31 2017-05-23 Sabic Global Technologies B.V. Capacitor films, methods of manufacture, and articles manufactured therefrom
EP3039061B1 (de) 2013-08-28 2018-07-25 SABIC Global Technologies B.V. Amorphe polycarbonatfolien für kondensatoren, verfahren zur herstellung und daraus hergestellte artikel
US20160221275A1 (en) * 2015-01-29 2016-08-04 Rohr, Inc. Method of manufacturing a polyimide film
KR101898455B1 (ko) * 2016-03-31 2018-09-13 가부시키가이샤 아이.에스.티 폴리이미드 섬유 및 폴리이미드 섬유의 제조 방법
KR102452649B1 (ko) * 2016-10-21 2022-10-07 삼성전자주식회사 적층 투명 필름, 표시 장치용 윈도우 및 표시 장치
EP3722069B1 (de) * 2017-12-04 2024-04-10 Kolon Industries, Inc. Verfahren zur herstellung einer auf polyimid basierenden folie
JP7334446B2 (ja) * 2019-04-01 2023-08-29 大日本印刷株式会社 フィルム、ポリイミドフィルム、積層体、ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
KR20210001810A (ko) * 2019-06-28 2021-01-06 에스케이씨 주식회사 폴리이미드계 필름 및 이의 제조 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619461A (en) * 1969-03-25 1971-11-09 Du Pont Stretching process for polyimide film
JPS56118421A (en) * 1980-02-25 1981-09-17 Nitto Electric Ind Co Ltd Heat-shrinkable polyimide film and production thereof
US4847349A (en) * 1985-08-27 1989-07-11 Mitsui Toatsu Chemicals, Inc. Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines
DE3783477T2 (de) * 1986-02-25 1993-06-17 Mitsui Toatsu Chemicals Hochtemperatur-polyimidklebstoff.
JPS62201524A (ja) * 1986-02-28 1987-09-05 井関農機株式会社 播種機
JPH0655432B2 (ja) * 1986-03-14 1994-07-27 宇部興産株式会社 高物性ポリイミド延伸成形体およびその製法
JPH083041B2 (ja) * 1986-06-30 1996-01-17 三井東圧化学株式会社 ポリイミド樹脂組成物
JP2585552B2 (ja) * 1986-11-19 1997-02-26 三井東圧化学株式会社 ポリイミド
JPS63242625A (ja) * 1987-03-31 1988-10-07 Hitachi Chem Co Ltd 高延伸ポリイミドフイルムの製法
AU592502B2 (en) * 1987-06-01 1990-01-11 Mitsui Toatsu Chemicals Inc. Polyimide resin composition
AT387783B (de) * 1987-06-09 1989-03-10 Chemiefaser Lenzing Ag Verfahren zur herstellung von hochtemperaturbestaendigen folien
JPH01198638A (ja) * 1987-08-21 1989-08-10 Ube Ind Ltd ポリイミドフィルムの製造法
US4966680A (en) * 1988-05-31 1990-10-30 Mobil Oil Corporation Integrated catalytic cracking process with light olefin upgrading

Also Published As

Publication number Publication date
JPH0778136B2 (ja) 1995-08-23
EP0409466A2 (de) 1991-01-23
KR910002968A (ko) 1991-02-26
EP0409466A3 (en) 1991-10-02
KR930002990B1 (ko) 1993-04-16
EP0409466B1 (de) 1995-04-19
DE69018717D1 (de) 1995-05-24
JPH03205432A (ja) 1991-09-06
CA2021293A1 (en) 1991-01-18
US5260407A (en) 1993-11-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MITSUI CHEMICALS, INC., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee