DE69020204D1 - Mehrschichtige gedruckte Leiterplatte. - Google Patents

Mehrschichtige gedruckte Leiterplatte.

Info

Publication number: DE69020204D1
Authority: DE; Germany
Prior art keywords: circuit board; printed circuit; layer printed; layer; board
Prior art date: 1989-03-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE69020204T

Other languages

English (en)

Other versions

DE69020204T2 (de

Inventor

Michael Scott Dampier

Ronald Jay Prilik

Norman Richard Rapoport

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee

International Business Machines Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-03-29

Filing date

1990-03-14

Publication date

1995-07-27

1990-03-14 Application filed by International Business Machines Corp filed Critical International Business Machines Corp

1995-07-27 Application granted granted Critical

1995-07-27 Publication of DE69020204D1 publication Critical patent/DE69020204D1/de

1996-02-15 Publication of DE69020204T2 publication Critical patent/DE69020204T2/de

2010-03-15 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

DE69020204T 1989-03-29 1990-03-14 Mehrschichtige gedruckte Leiterplatte. Expired - Fee Related DE69020204T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US07/330,293 US4928061A (en)	1989-03-29	1989-03-29	Multi-layer printed circuit board

Publications (2)

Publication Number	Publication Date
DE69020204D1 true DE69020204D1 (de)	1995-07-27
DE69020204T2 DE69020204T2 (de)	1996-02-15

Family

ID=23289119

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69020204T Expired - Fee Related DE69020204T2 (de)	1989-03-29	1990-03-14	Mehrschichtige gedruckte Leiterplatte.

Country Status (4)

Country	Link
US (1)	US4928061A (de)
EP (1)	EP0389865B1 (de)
JP (1)	JPH0724336B2 (de)
DE (1)	DE69020204T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5101149A (en) *	1989-07-18	1992-03-31	National Semiconductor Corporation	Modifiable IC board
US5148103A (en) *	1990-10-31	1992-09-15	Hughes Aircraft Company	Apparatus for testing integrated circuits
US5144228A (en) *	1991-04-23	1992-09-01	International Business Machines Corporation	Probe interface assembly
US5216361A (en) *	1991-07-10	1993-06-01	Schlumberger Technologies, Inc.	Modular board test system having wireless receiver
US5323105A (en) *	1991-08-08	1994-06-21	International Business Machines Corporation	Test template for monitoring the pins of a multi-pin chip cirucit package
US5307012A (en) *	1991-12-03	1994-04-26	Intel Corporation	Test substation for testing semi-conductor packages
JP3338527B2 (ja) *	1992-10-07	2002-10-28	富士通株式会社	高密度積層形のコネクタ、及び、コネクタの設計方法
US5489852A (en) *	1992-11-06	1996-02-06	Advanced Micro Devices, Inc.	System for interfacing wafer sort prober apparatus and packaged IC handler apparatus to a common test computer
US5381306A (en) *	1993-08-20	1995-01-10	Convex Computer Corporation	Method and apparatus for delivering power using a multiplane power via matrix
US20020053734A1 (en)	1993-11-16	2002-05-09	Formfactor, Inc.	Probe card assembly and kit, and methods of making same
US20030199179A1 (en) *	1993-11-16	2003-10-23	Formfactor, Inc.	Contact tip structure for microelectronic interconnection elements and method of making same
EP0707214A3 (de) *	1994-10-14	1997-04-16	Hughes Aircraft Co	Multiport-Membranfühler zum Testen vollständiger Wafer
US5642054A (en) *	1995-08-08	1997-06-24	Hughes Aircraft Company	Active circuit multi-port membrane probe for full wafer testing
US5945837A (en) *	1995-10-10	1999-08-31	Xilinx, Inc.	Interface structure for an integrated circuit device tester
US6118286A (en)	1995-10-10	2000-09-12	Xilinx, Inc.	Semiconductor device tester-to-handler Interface board with large test area
US5705932A (en) *	1995-10-10	1998-01-06	Xilinx, Inc.	System for expanding space provided by test computer to test multiple integrated circuits simultaneously
US8033838B2 (en)	1996-02-21	2011-10-11	Formfactor, Inc.	Microelectronic contact structure
US6085962A (en) *	1997-09-08	2000-07-11	Micron Technology, Inc.	Wire bond monitoring system for layered packages
US7102367B2 (en) *	2002-07-23	2006-09-05	Fujitsu Limited	Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
DE102018132098A1 (de) *	2018-12-13	2020-06-18	Thyssenkrupp Ag	Elektronische Leiterplatte

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2816273A (en) *	1952-08-01	1957-12-10	Sprague Electric Co	Artificial transmission line
US4183074A (en) *	1977-04-16	1980-01-08	Wallace Clarence L	Manufacture of multi-layered electrical assemblies
DE2830757A1 (de) *	1978-07-13	1980-01-24	Messwandler Bau Gmbh	Als lagenwicklung ausgebildete transformatorwicklung und verfahren zur herstellung einer derartigen lagenwicklung
US4288841A (en) *	1979-09-20	1981-09-08	Bell Telephone Laboratories, Incorporated	Double cavity semiconductor chip carrier
JPS57159051A (en) *	1981-03-27	1982-10-01	Hitachi Ltd	Semiconductor device
JPS5851436U (ja) *	1981-10-01	1983-04-07	日本電気株式会社	可変容量形積層セラミツクコンデンサ
JPS58133952U (ja) *	1982-03-03	1983-09-09	ミツミ電機株式会社	基板構造
US4543715A (en) *	1983-02-28	1985-10-01	Allied Corporation	Method of forming vertical traces on printed circuit board
US4628411A (en) *	1984-03-12	1986-12-09	International Business Machines Corporation	Apparatus for directly powering a multi-chip module from a power distribution bus
JPS6181131U (de) *	1984-11-02	1986-05-29
JPH023631Y2 (de) *	1984-12-28	1990-01-29
US4628406A (en) *	1985-05-20	1986-12-09	Tektronix, Inc.	Method of packaging integrated circuit chips, and integrated circuit package
JPS6331520U (de) *	1986-08-15	1988-03-01
US4734825A (en) *	1986-09-05	1988-03-29	Motorola Inc.	Integrated circuit stackable package
JPH067138B2 (ja) *	1986-10-27	1994-01-26	東京エレクトロン株式会社	プローブ装置
JPS63193877U (de) *	1987-06-02	1988-12-14

1989
- 1989-03-29 US US07/330,293 patent/US4928061A/en not_active Expired - Fee Related
1990
- 1990-03-14 DE DE69020204T patent/DE69020204T2/de not_active Expired - Fee Related
- 1990-03-14 EP EP90104768A patent/EP0389865B1/de not_active Expired - Lifetime
- 1990-03-20 JP JP2068518A patent/JPH0724336B2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JPH0724336B2 (ja)	1995-03-15
DE69020204T2 (de)	1996-02-15
US4928061A (en)	1990-05-22
JPH02281794A (ja)	1990-11-19
EP0389865B1 (de)	1995-06-21
EP0389865A3 (de)	1992-01-22
EP0389865A2 (de)	1990-10-03

Legal Events

Date	Code	Title	Description
1996-07-18	8364	No opposition during term of opposition
1997-03-13	8339	Ceased/non-payment of the annual fee

Publication	Publication Date	Title
DE68908687D1 (de)	1993-09-30	Gedruckte Schaltungsplatte.
DE69015878D1 (de)	1995-02-23	Mehrschichtleiterplattenstruktur.
DE69019030D1 (de)	1995-06-08	Gedruckte Leiterplatte.
DE3880385T2 (de)	1993-10-28	Gedruckte Leiterplatte.
DE69103999D1 (de)	1994-10-20	Mehrlagige Leiterplatte.
DE3484700D1 (de)	1991-07-18	Gedruckte schaltungsplatte.
DE3881973T2 (de)	1993-10-14	Mehrschichtschaltungsplatte.
DE68922118T2 (de)	1995-10-12	Schaltungsplatte.
DE68907089T2 (de)	1993-12-02	Leiterplatten mit niedriger Dielektrizitätskonstante.
DE69020204D1 (de)	1995-07-27	Mehrschichtige gedruckte Leiterplatte.
KR900702760A (ko)	1990-12-08	인쇄회로기판
DE69406581T2 (de)	1998-03-05	Gedruckte Schaltungsplatten
DE69011958T2 (de)	1995-01-05	Verbindungszusammenbau für gedruckte Schaltungskarten.
DE3679627D1 (de)	1991-07-11	Mehrschichtige gedruckte schaltungsplatte.
DE68906160T2 (de)	1993-10-28	Gedruckte Schaltungsplatte.
DE3872865T2 (de)	1993-03-04	Gedruckte leiterkarte.
DE69214581D1 (de)	1996-11-21	Leiterplatte für gedruckte Schaltungen
DE3784634D1 (de)	1993-04-15	Gedruckte schaltungsplatte.
DE69023234T2 (de)	1996-05-02	Gedruckte schaltungsplatten.
DE69008944D1 (de)	1994-06-23	Gedruckte Schaltungsplatte.
DE396954T1 (de)	1991-02-28	Gedruckte schaltungsplatte.
DE3676822D1 (de)	1991-02-14	Mehrschichtige gedruckte verdrahtungsplatte.
KR910021359U (ko)	1991-12-20	다층 프린트 기판
DE9413819U1 (de)	1994-11-03	Durchkontaktierungen aufweisende Leiterplatte
ATE91058T1 (de)	1993-07-15	Mehrschichtschaltungsplatte.