DE69021438D1 - Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung. - Google Patents

Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung.

Info

Publication number
DE69021438D1
DE69021438D1 DE69021438T DE69021438T DE69021438D1 DE 69021438 D1 DE69021438 D1 DE 69021438D1 DE 69021438 T DE69021438 T DE 69021438T DE 69021438 T DE69021438 T DE 69021438T DE 69021438 D1 DE69021438 D1 DE 69021438D1
Authority
DE
Germany
Prior art keywords
flip
arrangements
producing
solder structure
chip solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69021438T
Other languages
English (en)
Other versions
DE69021438T2 (de
Inventor
David John Pedder
David John Warner
Kim Louise Pickering
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
GEC Marconi Ltd
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB8911147A external-priority patent/GB2228825B/en
Application filed by GEC Marconi Ltd, Marconi Co Ltd filed Critical GEC Marconi Ltd
Application granted granted Critical
Publication of DE69021438D1 publication Critical patent/DE69021438D1/de
Publication of DE69021438T2 publication Critical patent/DE69021438T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
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DE69021438T 1989-05-16 1990-04-04 Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung. Expired - Fee Related DE69021438T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8911147A GB2228825B (en) 1989-02-03 1989-05-16 A method of making a flip chip solder bonding device

Publications (2)

Publication Number Publication Date
DE69021438D1 true DE69021438D1 (de) 1995-09-14
DE69021438T2 DE69021438T2 (de) 1996-01-25

Family

ID=10656767

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69021438T Expired - Fee Related DE69021438T2 (de) 1989-05-16 1990-04-04 Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung.

Country Status (4)

Country Link
US (1) US5108027A (de)
EP (1) EP0398485B1 (de)
JP (1) JPH03101242A (de)
DE (1) DE69021438T2 (de)

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JPH0734997B2 (ja) * 1991-04-04 1995-04-19 インターナショナル・ビジネス・マシーンズ・コーポレイション 金属化構造体
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
US5470787A (en) * 1994-05-02 1995-11-28 Motorola, Inc. Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
GB2290913B (en) * 1994-06-30 1998-03-11 Plessey Semiconductors Ltd Multi-chip module inductor structure
GB2292015B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Trimmable inductor structure
GB2292016B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Inductor device
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
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EP0398485A1 (de) 1990-11-22
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US5108027A (en) 1992-04-28
EP0398485B1 (de) 1995-08-09

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