DE69026193D1 - Lötverbindungen zur selektiven Kopplung von Leiterbahnen - Google Patents

Lötverbindungen zur selektiven Kopplung von Leiterbahnen

Info

Publication number
DE69026193D1
DE69026193D1 DE69026193T DE69026193T DE69026193D1 DE 69026193 D1 DE69026193 D1 DE 69026193D1 DE 69026193 T DE69026193 T DE 69026193T DE 69026193 T DE69026193 T DE 69026193T DE 69026193 D1 DE69026193 D1 DE 69026193D1
Authority
DE
Germany
Prior art keywords
conductor tracks
selective coupling
solder connections
solder
selective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69026193T
Other languages
English (en)
Inventor
Anthony Joseph Parla
Howard Franklin Tepper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69026193D1 publication Critical patent/DE69026193D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/06—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for positioning the molten material, e.g. confining it to a desired area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
DE69026193T 1989-11-09 1990-06-16 Lötverbindungen zur selektiven Kopplung von Leiterbahnen Expired - Lifetime DE69026193D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/437,156 US4982892A (en) 1989-11-09 1989-11-09 Solder interconnects for selective line coupling

Publications (1)

Publication Number Publication Date
DE69026193D1 true DE69026193D1 (de) 1996-05-02

Family

ID=23735312

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69026193T Expired - Lifetime DE69026193D1 (de) 1989-11-09 1990-06-16 Lötverbindungen zur selektiven Kopplung von Leiterbahnen

Country Status (4)

Country Link
US (2) US4982892A (de)
EP (1) EP0426946B1 (de)
JP (1) JPH03159294A (de)
DE (1) DE69026193D1 (de)

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US5531020A (en) * 1989-11-14 1996-07-02 Poly Flex Circuits, Inc. Method of making subsurface electronic circuits
US5619066A (en) * 1990-05-15 1997-04-08 Dallas Semiconductor Corporation Memory for an electronic token
US5088189A (en) * 1990-08-31 1992-02-18 Federated Fry Metals Electronic manufacturing process
US5994770A (en) * 1991-07-09 1999-11-30 Dallas Semiconductor Corporation Portable electronic data carrier
US5297099A (en) * 1991-07-10 1994-03-22 Dallas Semiconductor Corp. Integrated circuit with both battery-powered and signal-line-powered areas
US5389735A (en) * 1993-08-31 1995-02-14 Motorola, Inc. Vertically twisted-pair planar conductor line structure
US5848541A (en) 1994-03-30 1998-12-15 Dallas Semiconductor Corporation Electrical/mechanical access control systems
US5831827A (en) 1994-04-28 1998-11-03 Dallas Semiconductor Corporation Token shaped module for housing an electronic circuit
US5604343A (en) * 1994-05-24 1997-02-18 Dallas Semiconductor Corporation Secure storage of monetary equivalent data systems and processes
US5679944A (en) * 1994-06-15 1997-10-21 Dallas Semiconductor Corporation Portable electronic module having EPROM memory, systems and processes
US5598967A (en) * 1995-04-04 1997-02-04 Motorola, Inc. Method and structure for attaching a circuit module to a circuit board
WO1996037336A1 (en) * 1995-05-24 1996-11-28 Fry's Metals Inc. Epoxy-based, voc-free soldering flux
US5637835A (en) * 1995-05-26 1997-06-10 The Foxboro Company Automatic test detection of unsoldered thru-hole connector leads
US6369334B1 (en) * 1996-08-19 2002-04-09 International Business Machines Corporation Printed circuit board with wire adds and component adds having 7-shaped and semicircular terminations
US5877033A (en) * 1997-03-10 1999-03-02 The Foxboro Company System for detection of unsoldered components
US6012231A (en) * 1997-12-08 2000-01-11 Micron Technology, Inc. Soldered integrated circuit connections
DE19919395A1 (de) * 1998-04-29 1999-11-04 Capax B V Schalter für elektrische Werkzeuge mit integrierten Schaltkontakten
US6320139B1 (en) * 1998-11-12 2001-11-20 Rockwell Automation Technologies, Inc. Reflow selective shorting
FR2806248B1 (fr) * 2000-03-07 2004-09-10 Sagem Carte imprimee munie de court-circuits gratuits et son utilisation
DE10108780A1 (de) * 2001-02-23 2002-09-05 Kopp Heinrich Ag Anschlusseinrichtung für eine Leiterplatte und Verfahren zum Bestücken derselben
US7199304B2 (en) * 2002-09-04 2007-04-03 Intel Corporation Configurable microelectronic package using electrically conductive material
US7084353B1 (en) * 2002-12-11 2006-08-01 Emc Corporation Techniques for mounting a circuit board component to a circuit board
FR2853777B1 (fr) * 2003-04-08 2005-07-01 Valeo Climatisation Protection contre les court-circuits sur une plaque de circuit imprime
US20040238205A1 (en) * 2003-05-30 2004-12-02 Dell Products L.P. Printed circuit board with controlled solder shunts
US7159203B2 (en) * 2004-07-22 2007-01-02 Hewlett-Packard Development Company, L.P. Differential delay-line
JP2007067019A (ja) * 2005-08-29 2007-03-15 Kyocera Corp 回路基板、電子機器、及び回路基板の製造方法
US7835158B2 (en) 2005-12-30 2010-11-16 Micron Technology, Inc. Connection verification technique
JP2008227183A (ja) * 2007-03-13 2008-09-25 Fujitsu Ltd プリント基板ユニットおよびプリント配線板
KR101458854B1 (ko) * 2008-06-12 2014-11-07 삼성디스플레이 주식회사 연성 인쇄 회로 기판, 그의 제조 방법 및 그를 포함하는표시 장치
US7888259B2 (en) * 2008-08-19 2011-02-15 Ati Technologies Ulc Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same
CN102958274A (zh) * 2011-08-24 2013-03-06 鸿富锦精密工业（深圳）有限公司 电路板
US9247649B2 (en) 2013-05-06 2016-01-26 Globalfoundries Inc. Printed circuit boards fabricated using congruent molds
JP6320231B2 (ja) 2014-08-04 2018-05-09 株式会社ワコム 位置指示器及びその製造方法
US10368435B2 (en) * 2015-06-05 2019-07-30 Samuel P. Kho Systems and methods for breadboard style printed circuit board
CN106658996A (zh) * 2016-12-19 2017-05-10 奇酷互联网络科技（深圳）有限公司 实现电路通断切换的方法和印刷电路板
US10249587B1 (en) * 2017-12-15 2019-04-02 Western Digital Technologies, Inc. Semiconductor device including optional pad interconnect
US10991648B1 (en) * 2019-11-07 2021-04-27 Nanya Technology Corporation Redistribution layer structure and semiconductor package

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US3528048A (en) * 1967-07-06 1970-09-08 Ibm Method of constructing printed circuits for subsequent completion or deletion
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DE2837318C2 (de) * 1978-08-26 1986-01-09 Hartmann & Braun Ag, 6000 Frankfurt Anordnung zur Herstellung einer elektrischen Verbindung
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US4980240A (en) * 1989-04-20 1990-12-25 Honeywell Inc. Surface etched shadow mask
US5130779A (en) * 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement

Also Published As

Publication number Publication date
EP0426946A2 (de) 1991-05-15
EP0426946B1 (de) 1996-03-27
EP0426946A3 (en) 1992-07-01
JPH03159294A (ja) 1991-07-09
US4982892A (en) 1991-01-08
US5308928A (en) 1994-05-03

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Legal Events

Date Code Title Description
8332 No legal effect for de