DE69030647T2 - Vorrichtung und Verfahren zur Untersuchung eines Halbleiters - Google Patents

Vorrichtung und Verfahren zur Untersuchung eines Halbleiters

Info

Publication number
DE69030647T2
DE69030647T2 DE69030647T DE69030647T DE69030647T2 DE 69030647 T2 DE69030647 T2 DE 69030647T2 DE 69030647 T DE69030647 T DE 69030647T DE 69030647 T DE69030647 T DE 69030647T DE 69030647 T2 DE69030647 T2 DE 69030647T2
Authority
DE
Germany
Prior art keywords
examining
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69030647T
Other languages
English (en)
Other versions
DE69030647D1 (de
Inventor
Akihiko Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1339295A external-priority patent/JP2689173B2/ja
Priority claimed from JP1344027A external-priority patent/JPH0750153B2/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69030647D1 publication Critical patent/DE69030647D1/de
Publication of DE69030647T2 publication Critical patent/DE69030647T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69030647T 1989-12-26 1990-12-27 Vorrichtung und Verfahren zur Untersuchung eines Halbleiters Expired - Fee Related DE69030647T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1339295A JP2689173B2 (ja) 1989-12-26 1989-12-26 荷電ビーム加工装置に用いられる加工材料支持具
JP1344027A JPH0750153B2 (ja) 1989-12-29 1989-12-29 半導体検査装置及び半導体検査方法

Publications (2)

Publication Number Publication Date
DE69030647D1 DE69030647D1 (de) 1997-06-12
DE69030647T2 true DE69030647T2 (de) 1997-12-11

Family

ID=26576379

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69030647T Expired - Fee Related DE69030647T2 (de) 1989-12-26 1990-12-27 Vorrichtung und Verfahren zur Untersuchung eines Halbleiters

Country Status (3)

Country Link
US (2) US5089774A (de)
EP (1) EP0435271B1 (de)
DE (1) DE69030647T2 (de)

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US5600734A (en) * 1991-10-04 1997-02-04 Fujitsu Limited Electron beam tester
JP2768069B2 (ja) * 1991-08-20 1998-06-25 日本電気株式会社 集積回路の故障解析方法
US6380751B2 (en) * 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5345170A (en) * 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5528156A (en) * 1993-07-30 1996-06-18 Advantest Corporation IC analysis system and electron beam probe system and fault isolation method therefor
US5528164A (en) * 1994-08-01 1996-06-18 Nec Electronics, Inc. Modification to a Y-scan monitor circuit
JPH08254572A (ja) * 1995-03-16 1996-10-01 Advantest Corp Ｉｃ故障箇所追跡装置及びその追跡方法
US6232789B1 (en) * 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5561377A (en) * 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US5844416A (en) * 1995-11-02 1998-12-01 Sandia Corporation Ion-beam apparatus and method for analyzing and controlling integrated circuits
US5929645A (en) * 1996-04-26 1999-07-27 Texas Instruments Incorporated Integrated circuit tester using ion beam
US5914613A (en) * 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6002263A (en) * 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6897440B1 (en) 1998-11-30 2005-05-24 Fab Solutions, Inc. Contact hole standard test device
US6445202B1 (en) * 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
JP3843671B2 (ja) * 1999-10-29 2006-11-08 株式会社日立製作所 半導体デバイスパターンの検査装置及びその欠陥検査・不良解析方法
JP3749107B2 (ja) * 1999-11-05 2006-02-22 ファブソリューション株式会社 半導体デバイス検査装置
JP3874996B2 (ja) * 2000-05-30 2007-01-31 ファブソリューション株式会社 デバイス検査方法および装置
US6549022B1 (en) * 2000-06-02 2003-04-15 Sandia Corporation Apparatus and method for analyzing functional failures in integrated circuits
US6914423B2 (en) * 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) * 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
EP1209737B2 (de) * 2000-11-06 2014-04-30 Hitachi, Ltd. Verfahren zur Herstellung von Proben
DE20114544U1 (de) * 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
JP3847568B2 (ja) * 2001-03-01 2006-11-22 ファブソリューション株式会社 半導体装置製造方法
JP4738610B2 (ja) * 2001-03-02 2011-08-03 株式会社トプコン 基板表面の汚染評価方法及び汚染評価装置と半導体装置の製造方法
US7079975B1 (en) * 2001-04-30 2006-07-18 Advanced Micro Devices, Inc. Scatterometry and acoustic based active control of thin film deposition process
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US6836135B2 (en) * 2001-08-31 2004-12-28 Cascade Microtech, Inc. Optical testing device
JP3913555B2 (ja) * 2002-01-17 2007-05-09 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置
US6777964B2 (en) * 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
US7352258B2 (en) * 2002-03-28 2008-04-01 Cascade Microtech, Inc. Waveguide adapter for probe assembly having a detachable bias tee
WO2003100445A2 (en) * 2002-05-23 2003-12-04 Cascade Microtech, Inc. Probe for testing a device under test
US6847219B1 (en) * 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6724205B1 (en) * 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) * 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) * 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7221172B2 (en) * 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7492172B2 (en) * 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) * 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
DE202004021093U1 (de) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
US7187188B2 (en) * 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7212017B2 (en) * 2003-12-25 2007-05-01 Ebara Corporation Electron beam apparatus with detailed observation function and sample inspecting and observing method using electron beam apparatus
WO2005121824A2 (en) * 2004-06-07 2005-12-22 Cascade Microtech, Inc. Thermal optical chuck
US7330041B2 (en) * 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
JP4980903B2 (ja) * 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
KR20070058522A (ko) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 양측 프루빙 구조
US20060169897A1 (en) * 2005-01-31 2006-08-03 Cascade Microtech, Inc. Microscope system for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) * 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7449899B2 (en) * 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
JP5080459B2 (ja) * 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド 広帯域能動／受動差動信号プローブ
US7443186B2 (en) * 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7764072B2 (en) * 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) * 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) * 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7453274B1 (en) * 2007-10-09 2008-11-18 Kla-Tencor Technologies Corporation Detection of defects using transient contrast
US7888957B2 (en) * 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) * 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3437929A (en) * 1965-08-05 1969-04-08 Electroglas Inc Automatically indexed probe assembly for testing semiconductor wafers and the like
GB2010577B (en) * 1977-11-07 1982-05-06 Ion Tech Ltd Preparation of materials for examination of transmission electron microscopy techniques
US4154530A (en) * 1977-12-22 1979-05-15 National Semiconductor Corporation Laser beam error correcting process
US4186305A (en) * 1978-03-01 1980-01-29 Union Kogaku Kabushiki Kaisha High-temperature microscope
JPS57170551U (de) * 1981-04-22 1982-10-27
HU190855B (en) * 1983-10-12 1986-11-28 Mta Mueszaki Fizikai Kutato Intezete,Hu Device for working solid samples by ion beam and ion source to the device
SE452526B (sv) * 1984-05-09 1987-11-30 Stiftelsen Inst Mikrovags Forfarande for att inspektera integrerade kretsar eller andra objekt
JPH0616391B2 (ja) * 1984-07-13 1994-03-02 株式会社日立製作所 イオンビーム照射装置
JPS61100942A (ja) * 1984-10-22 1986-05-19 Canon Inc 不良チツプ識別方法
JPH0719557B2 (ja) * 1984-10-26 1995-03-06 株式会社日立製作所 特定微小領域の薄膜化装置を備えた透過電子顕微鏡
JPS6298724A (ja) * 1985-10-25 1987-05-08 Hitachi Ltd 電子線描画装置
US4730158A (en) * 1986-06-06 1988-03-08 Santa Barbara Research Center Electron-beam probing of photodiodes
JPS63308909A (ja) * 1987-06-10 1988-12-16 Mitsubishi Electric Corp 半導体装置の不良観察方法
EP0295065A3 (de) * 1987-06-10 1991-07-03 Hitachi, Ltd. Integrierte Schaltungshalbleiteranordnung, Verfahren zum Herstellen oder Schneiden derselben und Schneidesystem mit Energiebündel dafür
JPH0692927B2 (ja) * 1988-02-26 1994-11-16 シャープ株式会社 微小領域断面観察用試料作成法

Also Published As

Publication number Publication date
US5089774A (en) 1992-02-18
EP0435271A2 (de) 1991-07-03
US5132507A (en) 1992-07-21
DE69030647D1 (de) 1997-06-12
EP0435271B1 (de) 1997-05-07
EP0435271A3 (en) 1992-10-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee