DE69031748T2 - Plasmabehandlung mit Metallmasken-Integration - Google Patents
Plasmabehandlung mit Metallmasken-IntegrationInfo
- Publication number
- DE69031748T2 DE69031748T2 DE69031748T DE69031748T DE69031748T2 DE 69031748 T2 DE69031748 T2 DE 69031748T2 DE 69031748 T DE69031748 T DE 69031748T DE 69031748 T DE69031748 T DE 69031748T DE 69031748 T2 DE69031748 T2 DE 69031748T2
- Authority
- DE
- Germany
- Prior art keywords
- plasma treatment
- metal mask
- mask integration
- integration
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/353,770 US5053318A (en) | 1989-05-18 | 1989-05-18 | Plasma processing with metal mask integration |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69031748D1 DE69031748D1 (de) | 1998-01-08 |
DE69031748T2 true DE69031748T2 (de) | 1998-06-25 |
Family
ID=23390501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69031748T Expired - Fee Related DE69031748T2 (de) | 1989-05-18 | 1990-03-20 | Plasmabehandlung mit Metallmasken-Integration |
Country Status (4)
Country | Link |
---|---|
US (1) | US5053318A (de) |
EP (1) | EP0397988B1 (de) |
JP (1) | JP3010678B2 (de) |
DE (1) | DE69031748T2 (de) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2839376B2 (ja) * | 1991-02-05 | 1998-12-16 | 三菱電機株式会社 | 半導体装置の製造方法 |
US5538832A (en) * | 1993-12-16 | 1996-07-23 | Mitsubishi Gas Chemical Company, Inc. | Developing solution for producing printed circuit boards and a process for producing printed circuit boards wherein the developing solution comprises a quaternary ammonium hydroxide and a quaternary ammonium carbonate |
KR0148610B1 (ko) * | 1994-07-28 | 1998-12-01 | 김주용 | 반도체 소자의 패턴 형성방법 |
KR0159388B1 (ko) * | 1995-09-30 | 1999-02-01 | 배순훈 | 평탄화 방법 |
JP3224731B2 (ja) * | 1996-02-05 | 2001-11-05 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 高密度パターンを有する層を形成する方法 |
US5725788A (en) * | 1996-03-04 | 1998-03-10 | Motorola | Apparatus and method for patterning a surface |
US6232042B1 (en) * | 1998-07-07 | 2001-05-15 | Motorola, Inc. | Method for manufacturing an integral thin-film metal resistor |
DE69905985T2 (de) * | 1998-07-08 | 2003-09-11 | Nitto Denko Corp | Verfahren zum Entschichten eines Resistmaterials |
US6873087B1 (en) | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
JP2001234356A (ja) * | 2000-02-24 | 2001-08-31 | Seiko Epson Corp | 膜の製造方法及びこれにより得られる膜 |
EP1303792B1 (de) * | 2000-07-16 | 2012-10-03 | Board Of Regents, The University Of Texas System | Hoch auflösende ausrichtungsverfahren und entsprechende systeme für die präge-lithographie |
EP2270592B1 (de) | 2000-07-17 | 2015-09-02 | Board of Regents, The University of Texas System | Verfahren zur Bildung einer Struktur auf einem Substrat |
AU2001280980A1 (en) | 2000-08-01 | 2002-02-13 | Board Of Regents, The University Of Texas System | Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography |
US8016277B2 (en) | 2000-08-21 | 2011-09-13 | Board Of Regents, The University Of Texas System | Flexure based macro motion translation stage |
JP2004523906A (ja) * | 2000-10-12 | 2004-08-05 | ボード・オブ・リージエンツ,ザ・ユニバーシテイ・オブ・テキサス・システム | 室温かつ低圧マイクロおよびナノ転写リソグラフィのためのテンプレート |
US6964793B2 (en) | 2002-05-16 | 2005-11-15 | Board Of Regents, The University Of Texas System | Method for fabricating nanoscale patterns in light curable compositions using an electric field |
US7037639B2 (en) | 2002-05-01 | 2006-05-02 | Molecular Imprints, Inc. | Methods of manufacturing a lithography template |
US6926929B2 (en) | 2002-07-09 | 2005-08-09 | Molecular Imprints, Inc. | System and method for dispensing liquids |
US7019819B2 (en) | 2002-11-13 | 2006-03-28 | Molecular Imprints, Inc. | Chucking system for modulating shapes of substrates |
US6900881B2 (en) | 2002-07-11 | 2005-05-31 | Molecular Imprints, Inc. | Step and repeat imprint lithography systems |
US6908861B2 (en) * | 2002-07-11 | 2005-06-21 | Molecular Imprints, Inc. | Method for imprint lithography using an electric field |
US6932934B2 (en) | 2002-07-11 | 2005-08-23 | Molecular Imprints, Inc. | Formation of discontinuous films during an imprint lithography process |
US7077992B2 (en) | 2002-07-11 | 2006-07-18 | Molecular Imprints, Inc. | Step and repeat imprint lithography processes |
US6916584B2 (en) | 2002-08-01 | 2005-07-12 | Molecular Imprints, Inc. | Alignment methods for imprint lithography |
US7027156B2 (en) | 2002-08-01 | 2006-04-11 | Molecular Imprints, Inc. | Scatterometry alignment for imprint lithography |
US7070405B2 (en) | 2002-08-01 | 2006-07-04 | Molecular Imprints, Inc. | Alignment systems for imprint lithography |
US7071088B2 (en) | 2002-08-23 | 2006-07-04 | Molecular Imprints, Inc. | Method for fabricating bulbous-shaped vias |
US8349241B2 (en) | 2002-10-04 | 2013-01-08 | Molecular Imprints, Inc. | Method to arrange features on a substrate to replicate features having minimal dimensional variability |
US6929762B2 (en) | 2002-11-13 | 2005-08-16 | Molecular Imprints, Inc. | Method of reducing pattern distortions during imprint lithography processes |
US6980282B2 (en) | 2002-12-11 | 2005-12-27 | Molecular Imprints, Inc. | Method for modulating shapes of substrates |
US6871558B2 (en) * | 2002-12-12 | 2005-03-29 | Molecular Imprints, Inc. | Method for determining characteristics of substrate employing fluid geometries |
US7452574B2 (en) | 2003-02-27 | 2008-11-18 | Molecular Imprints, Inc. | Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer |
US7122079B2 (en) | 2004-02-27 | 2006-10-17 | Molecular Imprints, Inc. | Composition for an etching mask comprising a silicon-containing material |
US7179396B2 (en) | 2003-03-25 | 2007-02-20 | Molecular Imprints, Inc. | Positive tone bi-layer imprint lithography method |
US7396475B2 (en) | 2003-04-25 | 2008-07-08 | Molecular Imprints, Inc. | Method of forming stepped structures employing imprint lithography |
US8519503B2 (en) | 2006-06-05 | 2013-08-27 | Osi Optoelectronics, Inc. | High speed backside illuminated, front side contact photodiode array |
US7880258B2 (en) * | 2003-05-05 | 2011-02-01 | Udt Sensors, Inc. | Thin wafer detectors with improved radiation damage and crosstalk characteristics |
US7656001B2 (en) * | 2006-11-01 | 2010-02-02 | Udt Sensors, Inc. | Front-side illuminated, back-side contact double-sided PN-junction photodiode arrays |
US7709921B2 (en) | 2008-08-27 | 2010-05-04 | Udt Sensors, Inc. | Photodiode and photodiode array with improved performance characteristics |
US8035183B2 (en) * | 2003-05-05 | 2011-10-11 | Udt Sensors, Inc. | Photodiodes with PN junction on both front and back sides |
US7576369B2 (en) | 2005-10-25 | 2009-08-18 | Udt Sensors, Inc. | Deep diffused thin photodiodes |
US8686529B2 (en) * | 2010-01-19 | 2014-04-01 | Osi Optoelectronics, Inc. | Wavelength sensitive sensor photodiodes |
US7256470B2 (en) * | 2005-03-16 | 2007-08-14 | Udt Sensors, Inc. | Photodiode with controlled current leakage |
US7057254B2 (en) * | 2003-05-05 | 2006-06-06 | Udt Sensors, Inc. | Front illuminated back side contact thin wafer detectors |
US7655999B2 (en) * | 2006-09-15 | 2010-02-02 | Udt Sensors, Inc. | High density photodiodes |
US8120023B2 (en) | 2006-06-05 | 2012-02-21 | Udt Sensors, Inc. | Low crosstalk, front-side illuminated, back-side contact photodiode array |
US7279731B1 (en) * | 2006-05-15 | 2007-10-09 | Udt Sensors, Inc. | Edge illuminated photodiodes |
US7157036B2 (en) | 2003-06-17 | 2007-01-02 | Molecular Imprints, Inc | Method to reduce adhesion between a conformable region and a pattern of a mold |
US7136150B2 (en) | 2003-09-25 | 2006-11-14 | Molecular Imprints, Inc. | Imprint lithography template having opaque alignment marks |
US7090716B2 (en) | 2003-10-02 | 2006-08-15 | Molecular Imprints, Inc. | Single phase fluid imprint lithography method |
US8211214B2 (en) | 2003-10-02 | 2012-07-03 | Molecular Imprints, Inc. | Single phase fluid imprint lithography method |
US8076386B2 (en) | 2004-02-23 | 2011-12-13 | Molecular Imprints, Inc. | Materials for imprint lithography |
US7906180B2 (en) | 2004-02-27 | 2011-03-15 | Molecular Imprints, Inc. | Composition for an etching mask comprising a silicon-containing material |
US20060030149A1 (en) * | 2004-08-06 | 2006-02-09 | Steven Leith | Depositing material on photosensitive material |
US7803308B2 (en) | 2005-12-01 | 2010-09-28 | Molecular Imprints, Inc. | Technique for separating a mold from solidified imprinting material |
US7906058B2 (en) | 2005-12-01 | 2011-03-15 | Molecular Imprints, Inc. | Bifurcated contact printing technique |
US7670530B2 (en) | 2006-01-20 | 2010-03-02 | Molecular Imprints, Inc. | Patterning substrates employing multiple chucks |
MY144847A (en) | 2005-12-08 | 2011-11-30 | Molecular Imprints Inc | Method and system for double-sided patterning of substrates |
JP4675227B2 (ja) * | 2005-12-21 | 2011-04-20 | トヨタ自動車株式会社 | 凸部の頂面に被覆膜を形成する方法 |
JP5306989B2 (ja) | 2006-04-03 | 2013-10-02 | モレキュラー・インプリンツ・インコーポレーテッド | 複数のフィールド及びアライメント・マークを有する基板を同時にパターニングする方法 |
US7802978B2 (en) | 2006-04-03 | 2010-09-28 | Molecular Imprints, Inc. | Imprinting of partial fields at the edge of the wafer |
US8142850B2 (en) | 2006-04-03 | 2012-03-27 | Molecular Imprints, Inc. | Patterning a plurality of fields on a substrate to compensate for differing evaporation times |
US8850980B2 (en) | 2006-04-03 | 2014-10-07 | Canon Nanotechnologies, Inc. | Tessellated patterns in imprint lithography |
US7547398B2 (en) | 2006-04-18 | 2009-06-16 | Molecular Imprints, Inc. | Self-aligned process for fabricating imprint templates containing variously etched features |
US8012395B2 (en) | 2006-04-18 | 2011-09-06 | Molecular Imprints, Inc. | Template having alignment marks formed of contrast material |
US9178092B2 (en) | 2006-11-01 | 2015-11-03 | Osi Optoelectronics, Inc. | Front-side illuminated, back-side contact double-sided PN-junction photodiode arrays |
US20100053802A1 (en) * | 2008-08-27 | 2010-03-04 | Masaki Yamashita | Low Power Disk-Drive Motor Driver |
MX2011002852A (es) | 2008-09-15 | 2011-08-17 | Udt Sensors Inc | Fotodiodo de espina de capa activa delgada con una capa n+ superficial y metodo para fabricacion del mismo. |
TW201026513A (en) * | 2009-01-08 | 2010-07-16 | Univ Nat Cheng Kung | Imprinting process of polyimide |
US8399909B2 (en) | 2009-05-12 | 2013-03-19 | Osi Optoelectronics, Inc. | Tetra-lateral position sensing detector |
US8912615B2 (en) | 2013-01-24 | 2014-12-16 | Osi Optoelectronics, Inc. | Shallow junction photodiode for detecting short wavelength light |
CN112531173A (zh) * | 2019-09-17 | 2021-03-19 | 宁德新能源科技有限公司 | 金属箔处理工艺、电极极片及电化学装置 |
CN113485581A (zh) * | 2021-07-02 | 2021-10-08 | 浙江鑫柔科技有限公司 | 一种用于在基板上形成金属网格的方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3993802A (en) * | 1971-07-29 | 1976-11-23 | Photocircuits Division Of Kollmorgen Corporation | Processes and products for making articles for electroless plating |
US3772078A (en) * | 1971-07-29 | 1973-11-13 | Kollmorgen Photocircuits | Process for the formation of real images and products produced thereby |
US3772056A (en) * | 1971-07-29 | 1973-11-13 | Kollmorgen Photocircuits | Sensitized substrates for chemical metallization |
US3930963A (en) * | 1971-07-29 | 1976-01-06 | Photocircuits Division Of Kollmorgen Corporation | Method for the production of radiant energy imaged printed circuit boards |
NL7316102A (nl) * | 1973-11-26 | 1975-05-28 | Philips Nv | Werkwijze voor de vervaardiging van een uit- wendig elektrische geleidend metaalpatroon. |
JPS51121181A (en) * | 1975-04-16 | 1976-10-22 | Nippon Telegraph & Telephone | Method of forming printed circuit |
US4388351A (en) * | 1979-08-20 | 1983-06-14 | Western Electric Company, Inc. | Methods of forming a patterned metal film on a support |
US4396704A (en) * | 1981-04-22 | 1983-08-02 | Bell Telephone Laboratories, Incorporated | Solid state devices produced by organometallic plasma developed resists |
US4357369A (en) * | 1981-11-10 | 1982-11-02 | Rca Corporation | Method of plasma etching a substrate |
DE3377597D1 (en) * | 1982-04-12 | 1988-09-08 | Nippon Telegraph & Telephone | Method for forming micropattern |
US4526810A (en) * | 1982-06-17 | 1985-07-02 | At&T Technologies, Inc. | Process for improved wall definition of an additive printed circuit |
US4433044A (en) * | 1982-11-15 | 1984-02-21 | Rca Corporation | Dry developable positive photoresists |
US4666735A (en) * | 1983-04-15 | 1987-05-19 | Polyonics Corporation | Process for producing product having patterned metal layer |
US4430153A (en) * | 1983-06-30 | 1984-02-07 | International Business Machines Corporation | Method of forming an RIE etch barrier by in situ conversion of a silicon containing alkyl polyamide/polyimide |
US4741988A (en) * | 1985-05-08 | 1988-05-03 | U.S. Philips Corp. | Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell |
US4613398A (en) * | 1985-06-06 | 1986-09-23 | International Business Machines Corporation | Formation of etch-resistant resists through preferential permeation |
US4748104A (en) * | 1986-11-10 | 1988-05-31 | Macdermid, Incorporated | Selective metallization process and additive method for manufactured printed circuit boards |
US4827326A (en) * | 1987-11-02 | 1989-05-02 | Motorola, Inc. | Integrated circuit having polyimide/metal passivation layer and method of manufacture using metal lift-off |
US4906552A (en) * | 1988-02-22 | 1990-03-06 | Hughes Aircraft Company | Two layer dye photoresist process for sub-half micrometer resolution photolithography |
-
1989
- 1989-05-18 US US07/353,770 patent/US5053318A/en not_active Expired - Fee Related
-
1990
- 1990-03-20 EP EP90105228A patent/EP0397988B1/de not_active Expired - Lifetime
- 1990-03-20 DE DE69031748T patent/DE69031748T2/de not_active Expired - Fee Related
- 1990-04-23 JP JP10729690A patent/JP3010678B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69031748D1 (de) | 1998-01-08 |
EP0397988A2 (de) | 1990-11-22 |
JPH0394418A (ja) | 1991-04-19 |
EP0397988A3 (de) | 1991-10-09 |
JP3010678B2 (ja) | 2000-02-21 |
US5053318A (en) | 1991-10-01 |
EP0397988B1 (de) | 1997-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: SHIPLEY CO. INC., MARLBOROUGH, MASS., US |
|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |