DE69032711T2 - Gegossener gegenstand zum halten von waffeln - Google Patents

Gegossener gegenstand zum halten von waffeln

Info

Publication number
DE69032711T2
DE69032711T2 DE69032711T DE69032711T DE69032711T2 DE 69032711 T2 DE69032711 T2 DE 69032711T2 DE 69032711 T DE69032711 T DE 69032711T DE 69032711 T DE69032711 T DE 69032711T DE 69032711 T2 DE69032711 T2 DE 69032711T2
Authority
DE
Germany
Prior art keywords
waffles
hold
molded object
molded
hold waffles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69032711T
Other languages
English (en)
Other versions
DE69032711D1 (de
Inventor
Akira Otsuka Kagaku Ka Tabuchi
Morihiko Otsuka Kagak Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Otsuka Chemical Co Ltd
Original Assignee
Otsuka Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otsuka Chemical Co Ltd filed Critical Otsuka Chemical Co Ltd
Application granted granted Critical
Publication of DE69032711D1 publication Critical patent/DE69032711D1/de
Publication of DE69032711T2 publication Critical patent/DE69032711T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/902—High modulus filament or fiber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/931—Components of differing electric conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
    • Y10T428/1314—Contains fabric, fiber particle, or filament made of glass, ceramic, or sintered, fused, fired, or calcined metal oxide, or metal carbide or other inorganic compound [e.g., fiber glass, mineral fiber, sand, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/1372—Randomly noninterengaged or randomly contacting fibers, filaments, particles, or flakes
DE69032711T 1989-07-07 1990-07-04 Gegossener gegenstand zum halten von waffeln Expired - Fee Related DE69032711T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1176795A JP2816864B2 (ja) 1989-07-07 1989-07-07 搬送用ウエーハバスケット及び収納ケース
PCT/JP1990/000863 WO1991001044A1 (en) 1989-07-07 1990-07-04 Molded article for holding wafer

Publications (2)

Publication Number Publication Date
DE69032711D1 DE69032711D1 (de) 1998-11-26
DE69032711T2 true DE69032711T2 (de) 1999-03-11

Family

ID=16019978

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69032711T Expired - Fee Related DE69032711T2 (de) 1989-07-07 1990-07-04 Gegossener gegenstand zum halten von waffeln

Country Status (6)

Country Link
US (1) US5240753A (de)
EP (1) EP0436030B1 (de)
JP (1) JP2816864B2 (de)
DE (1) DE69032711T2 (de)
HK (1) HK1007930A1 (de)
WO (1) WO1991001044A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593916A (en) * 1988-08-12 1997-01-14 Mitsui Toatsu Chemicals, Incorporated Processing of glass substrates using holding container and holding container
KR930003300A (ko) * 1991-07-23 1993-02-24 스탠 게이어 다이아몬드가 피복된 캐리어
JPH0758192A (ja) * 1993-08-12 1995-03-03 Nikon Corp 基板収納ケース
WO1996014359A1 (fr) * 1994-11-04 1996-05-17 Daikin Industries, Ltd. Composition de fluororesine fondue
JP3016344B2 (ja) * 1994-12-19 2000-03-06 三菱電機株式会社 開閉器
KR100428827B1 (ko) * 1995-10-13 2005-04-20 엠팍 인코포레이티드 측면에도어를구비한300㎜미세환경포드
EP0957514A4 (de) * 1996-03-29 2006-10-04 Tokyo Electron Ltd Instrument und montage-ausrüstung angewndet im reinraum
US5709065A (en) * 1996-07-31 1998-01-20 Empak, Inc. Desiccant substrate package
TW392200B (en) * 1997-03-25 2000-06-01 Taisei Corp Electronic and electrical components and substrate treatment devices used in a clean room
EP1035574A4 (de) * 1997-11-28 2007-11-28 Ebara Corp Behälter zur übertragung von halbleiterwafern
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
JP3046010B2 (ja) * 1998-11-12 2000-05-29 沖電気工業株式会社 収納容器および収納方法
US6578893B2 (en) 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
EP1429380A4 (de) * 2001-08-28 2009-07-15 Zeon Corp Behälter für ein präzisionssubstrat
AU2002359492A1 (en) * 2001-11-27 2003-06-10 Entegris Inc. Front opening wafer carrier with path to ground effectuated by door
US20070026171A1 (en) * 2002-09-03 2007-02-01 Extrand Charles W High temperature, high strength, colorable materials for use with electronics processing applications
CN1694803A (zh) * 2002-09-03 2005-11-09 诚实公司 用于电子加工应用的高温、高强度、可着色的材料
US6988620B2 (en) * 2002-09-06 2006-01-24 E.Pak International, Inc. Container with an adjustable inside dimension that restricts movement of items within the container
US6926937B2 (en) * 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
KR20050050122A (ko) * 2002-10-09 2005-05-27 엔테그리스, 아이엔씨. 장치 처리 시스템을 위한 고온, 고강도, 착색가능한 물질
CN1319824C (zh) * 2002-11-06 2007-06-06 富士塑料股份有限公司 净室用容器及其制造方法
JP4584023B2 (ja) * 2005-05-17 2010-11-17 信越ポリマー株式会社 基板収納容器及びその製造方法
US8635784B2 (en) * 2005-10-04 2014-01-28 Applied Materials, Inc. Methods and apparatus for drying a substrate
US20090162183A1 (en) * 2007-12-19 2009-06-25 Peter Davison Full-contact ring for a large wafer

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404615A (en) * 1981-12-14 1983-09-13 United Plastics, Corp. Anti-static container for electronic components
JPS58168638A (ja) * 1982-03-31 1983-10-05 Japan Synthetic Rubber Co Ltd 高モジユラスジエン系ゴム組成物
JPS5949256A (ja) * 1982-09-14 1984-03-21 Otsuka Chem Co Ltd メツキ用ポリオキシメチレン樹脂組成物及び該組成物に対するメツキ方法
JPS6033852B2 (ja) * 1983-07-18 1985-08-05 三菱瓦斯化学株式会社 成形用ポリアミド樹脂組成物
JPS5959256A (ja) * 1983-08-29 1984-04-05 第一電子技術開発株式会社 シユレツダ−機構
JPS6096649A (ja) * 1983-10-31 1985-05-30 Otsuka Chem Co Ltd 摺動部材用樹脂組成物
JPS60106807A (ja) * 1983-11-15 1985-06-12 Mitsui Petrochem Ind Ltd 超高分子量エチレン系ポリオレフイン粉末
JPS60124848A (ja) * 1983-12-08 1985-07-03 Hitachi Chem Co Ltd 半導体類のパッケ−ジ構造
JPS6112099A (ja) * 1984-06-26 1986-01-20 倉敷紡績株式会社 半導体製造用治具
JPS61207465A (ja) * 1985-03-11 1986-09-13 Otsuka Chem Co Ltd 導電性熱可塑性樹脂組成物
JPH07118217B2 (ja) * 1986-09-29 1995-12-18 大塚化学株式会社 導電性組成物
JPS6461087A (en) * 1987-09-01 1989-03-08 Sumitomo Chemical Co Resin composition for printed wiring board
US4754880A (en) * 1987-10-01 1988-07-05 Ncr Corporation Surface mount electronic device package
JPH0762101B2 (ja) * 1987-12-22 1995-07-05 トヨタ自動車株式会社 ポリプロピレン樹脂組成物
US4815596A (en) * 1988-02-04 1989-03-28 Minnesota Mining And Manufacturing Company Dip carrier
JPH0216120A (ja) * 1988-07-05 1990-01-19 Polyplastics Co 溶融時に光学的異方性を示すポリエステル樹脂及び樹脂組成物
US4881642A (en) * 1988-12-08 1989-11-21 Adam William D Electrostatic charge dissipator and method of making

Also Published As

Publication number Publication date
EP0436030A1 (de) 1991-07-10
US5240753A (en) 1993-08-31
JPH0341747A (ja) 1991-02-22
EP0436030A4 (en) 1992-08-12
JP2816864B2 (ja) 1998-10-27
WO1991001044A1 (en) 1991-01-24
DE69032711D1 (de) 1998-11-26
EP0436030B1 (de) 1998-10-21
HK1007930A1 (en) 1999-04-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee