DE69111696D1 - Polyimid-Kompositmaterial und Verfahren zu dessen Herstellung. - Google Patents

Polyimid-Kompositmaterial und Verfahren zu dessen Herstellung.

Info

Publication number
DE69111696D1
DE69111696D1 DE69111696T DE69111696T DE69111696D1 DE 69111696 D1 DE69111696 D1 DE 69111696D1 DE 69111696 T DE69111696 T DE 69111696T DE 69111696 T DE69111696 T DE 69111696T DE 69111696 D1 DE69111696 D1 DE 69111696D1
Authority
DE
Germany
Prior art keywords
production
composite material
polyimide composite
polyimide
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69111696T
Other languages
English (en)
Other versions
DE69111696T2 (de
Inventor
Kazuhisa Yano
Arimitsu Usuki
Akane Okada
Toshio Kurauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Central R&D Labs Inc
Original Assignee
Toyota Central R&D Labs Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Central R&D Labs Inc filed Critical Toyota Central R&D Labs Inc
Application granted granted Critical
Publication of DE69111696D1 publication Critical patent/DE69111696D1/de
Publication of DE69111696T2 publication Critical patent/DE69111696T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
DE69111696T 1990-05-30 1991-05-29 Polyimid-Kompositmaterial und Verfahren zu dessen Herstellung. Expired - Lifetime DE69111696T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2140372A JP2872756B2 (ja) 1990-05-30 1990-05-30 ポリイミド複合材料およびその製造方法

Publications (2)

Publication Number Publication Date
DE69111696D1 true DE69111696D1 (de) 1995-09-07
DE69111696T2 DE69111696T2 (de) 1996-01-25

Family

ID=15267296

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69111696T Expired - Lifetime DE69111696T2 (de) 1990-05-30 1991-05-29 Polyimid-Kompositmaterial und Verfahren zu dessen Herstellung.

Country Status (4)

Country Link
US (1) US5164460A (de)
EP (1) EP0459472B1 (de)
JP (1) JP2872756B2 (de)
DE (1) DE69111696T2 (de)

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CN115044203A (zh) * 2022-05-23 2022-09-13 中电科芜湖钻石飞机制造有限公司 低介电耐高温树脂基复合材料及其制备方法

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Also Published As

Publication number Publication date
JP2872756B2 (ja) 1999-03-24
JPH0433955A (ja) 1992-02-05
EP0459472B1 (de) 1995-08-02
DE69111696T2 (de) 1996-01-25
US5164460A (en) 1992-11-17
EP0459472A1 (de) 1991-12-04

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