DE69116227D1 - Endpunktdetektor für Polierarbeiten - Google Patents

Endpunktdetektor für Polierarbeiten

Info

Publication number
DE69116227D1
DE69116227D1 DE69116227T DE69116227T DE69116227D1 DE 69116227 D1 DE69116227 D1 DE 69116227D1 DE 69116227 T DE69116227 T DE 69116227T DE 69116227 T DE69116227 T DE 69116227T DE 69116227 D1 DE69116227 D1 DE 69116227D1
Authority
DE
Germany
Prior art keywords
end point
point detector
polishing work
polishing
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69116227T
Other languages
English (en)
Other versions
DE69116227T2 (de
Inventor
Michael Albert Leach
Brian John Machesney
Edward Joseph Nowak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69116227D1 publication Critical patent/DE69116227D1/de
Publication of DE69116227T2 publication Critical patent/DE69116227T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
    • G01B7/105—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance for measuring thickness of coating
DE69116227T 1990-05-16 1991-04-13 Endpunktdetektor für Polierarbeiten Expired - Fee Related DE69116227T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/525,352 US5132617A (en) 1990-05-16 1990-05-16 Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within the air gap of a magnetic core

Publications (2)

Publication Number Publication Date
DE69116227D1 true DE69116227D1 (de) 1996-02-22
DE69116227T2 DE69116227T2 (de) 1996-07-04

Family

ID=24092882

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69116227T Expired - Fee Related DE69116227T2 (de) 1990-05-16 1991-04-13 Endpunktdetektor für Polierarbeiten

Country Status (4)

Country Link
US (1) US5132617A (de)
EP (1) EP0460384B1 (de)
JP (1) JPH07111997B2 (de)
DE (1) DE69116227T2 (de)

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US5308438A (en) * 1992-01-30 1994-05-03 International Business Machines Corporation Endpoint detection apparatus and method for chemical/mechanical polishing
IT1257835B (it) * 1992-06-17 1996-02-13 Gd Spa Dispositivo rilevatore dello spessore di materiale in nastro in particolare in dispositivi per il cambio automatico di bobine di materiale in nastro metallizzato
US5265378A (en) * 1992-07-10 1993-11-30 Lsi Logic Corporation Detecting the endpoint of chem-mech polishing and resulting semiconductor device
US5234868A (en) * 1992-10-29 1993-08-10 International Business Machines Corporation Method for determining planarization endpoint during chemical-mechanical polishing
US7037403B1 (en) 1992-12-28 2006-05-02 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US6614529B1 (en) * 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5386196A (en) * 1993-08-23 1995-01-31 Denmar, Inc. System and method for accurate contactless measurement of the resistivity of a test material
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3313505B2 (ja) * 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US5733175A (en) 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
DE69632490T2 (de) 1995-03-28 2005-05-12 Applied Materials, Inc., Santa Clara Verfahren und Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5559428A (en) * 1995-04-10 1996-09-24 International Business Machines Corporation In-situ monitoring of the change in thickness of films
US5660672A (en) * 1995-04-10 1997-08-26 International Business Machines Corporation In-situ monitoring of conductive films on semiconductor wafers
JPH08304010A (ja) * 1995-04-28 1996-11-22 Sony Corp デプスセンサー
WO1997024711A1 (en) * 1995-12-27 1997-07-10 Philips Electronics N.V. Method of manufacturing a thin-film magnetic head, and magnetic head manufactured by means of the method
US5823854A (en) * 1996-05-28 1998-10-20 Industrial Technology Research Institute Chemical-mechanical polish (CMP) pad conditioner
US5637031A (en) * 1996-06-07 1997-06-10 Industrial Technology Research Institute Electrochemical simulator for chemical-mechanical polishing (CMP)
US6007405A (en) * 1998-07-17 1999-12-28 Promos Technologies, Inc. Method and apparatus for endpoint detection for chemical mechanical polishing using electrical lapping
US7374477B2 (en) 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US6485354B1 (en) * 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor
GB0900493D0 (en) * 2009-01-14 2009-02-11 Rolls Royce Plc Rotary transformer
US8547110B2 (en) * 2009-09-22 2013-10-01 Adem, Llc Impedance sensing systems and methods for use in measuring constituents in solid and fluid objects
US9528814B2 (en) 2011-05-19 2016-12-27 NeoVision, LLC Apparatus and method of using impedance resonance sensor for thickness measurement
US9465089B2 (en) 2011-12-01 2016-10-11 Neovision Llc NMR spectroscopy device based on resonance type impedance (IR) sensor and method of NMR spectra acquisition
US8952708B2 (en) 2011-12-02 2015-02-10 Neovision Llc Impedance resonance sensor for real time monitoring of different processes and methods of using same
US11841465B1 (en) 2019-12-30 2023-12-12 Waymo Llc Wireless power transfer via rotary link

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US2004780A (en) * 1933-05-05 1935-06-11 Gen Electric Electrical measuring system
GB1013928A (en) * 1962-04-27 1965-12-22 Glacier Co Ltd Apparatus for detecting when a cyclically moving part reaches a predetermined temperature
GB1013348A (en) * 1962-05-04 1965-12-15 Ilford Ltd Monitoring apparatus and method
DE2326257A1 (de) * 1973-05-21 1974-12-12 Siemens Ag Induktiver weggeber
US4014141A (en) * 1974-03-11 1977-03-29 International Business Machines Corporation Apparatus and method for controlling magnetic head surface formation
US4017826A (en) * 1975-09-24 1977-04-12 The Goodyear Tire & Rubber Company Method and apparatus for extending the operating range of a condition monitoring system
DK138287B (da) * 1976-05-31 1978-08-07 Brueel & Kjaer As Elektromekanisk målesystem til måling af mekanisk forskydning.
DE2708433A1 (de) * 1977-02-26 1978-08-31 Kirsten Elektrotech Armaturenbrett fuer kraftfahrzeuge, insbesondere fuer militaerkraftfahrzeuge
US4188267A (en) * 1977-05-17 1980-02-12 Aluminum Company Of America Method and apparatus for measuring the integrity of an electrolytic cell lining
US4339714A (en) * 1978-07-07 1982-07-13 Rolls Royce Limited Probe having passive means transmitting an output signal by reactive coupling
US4197676A (en) * 1978-07-17 1980-04-15 Sauerland Franz L Apparatus for automatic lapping control
US4328462A (en) * 1978-11-06 1982-05-04 Carrier Corporation Erosion probe having inductance sensor for monitoring erosion of a turbomachine component
JPS57168109A (en) * 1981-04-10 1982-10-16 Shinetsu Eng Kk Device for measuring thickness of work piece in lapping plate
JPS58116669U (ja) * 1982-02-03 1983-08-09 横河電機株式会社 インピ−ダンス変化検出回路
US4857828A (en) * 1986-05-30 1989-08-15 Control Logic (Proprietary) Limited Method and apparatus for detecting presence of objects
US4804912A (en) * 1987-05-14 1989-02-14 Kamyr Ab Apparatus for electromagnetically measuring the distance between two opposing grinding surfaces
DD270843A3 (de) * 1987-06-15 1989-08-16 Ilmenau Tech Hochschule Schaltungsanordnung zur elektrischen messung der schichtdicke bzw. des flaechenwiderstandes von elektrisch leitenden schichten
US4793895A (en) * 1988-01-25 1988-12-27 Ibm Corporation In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
DE3815009A1 (de) * 1988-04-30 1989-11-09 Leybold Ag Einrichtung und verfahren zum zerstoerungsfreien messen des ohmschen widerstands duenner schichten nach dem wirbelstrom-prinzip

Also Published As

Publication number Publication date
DE69116227T2 (de) 1996-07-04
JPH04305953A (ja) 1992-10-28
JPH07111997B2 (ja) 1995-11-29
EP0460384B1 (de) 1996-01-10
EP0460384A1 (de) 1991-12-11
US5132617A (en) 1992-07-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee