DE69116532T2 - Mikrominiatur-Differenzdruckwandler und Herstellungsverfahren dazu - Google Patents
Mikrominiatur-Differenzdruckwandler und Herstellungsverfahren dazuInfo
- Publication number
- DE69116532T2 DE69116532T2 DE69116532T DE69116532T DE69116532T2 DE 69116532 T2 DE69116532 T2 DE 69116532T2 DE 69116532 T DE69116532 T DE 69116532T DE 69116532 T DE69116532 T DE 69116532T DE 69116532 T2 DE69116532 T2 DE 69116532T2
- Authority
- DE
- Germany
- Prior art keywords
- membrane
- substrate
- bridge
- overpressure
- microminiature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0618—Overload protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/167—X-ray
- Y10S430/168—X-ray exposure process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49103—Strain gauge making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
- Y10T29/49812—Temporary protective coating, impregnation, or cast layer
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/626,581 US5189777A (en) | 1990-12-07 | 1990-12-07 | Method of producing micromachined differential pressure transducers |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69116532D1 DE69116532D1 (de) | 1996-02-29 |
DE69116532T2 true DE69116532T2 (de) | 1996-10-02 |
Family
ID=24510999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69116532T Expired - Lifetime DE69116532T2 (de) | 1990-12-07 | 1991-11-11 | Mikrominiatur-Differenzdruckwandler und Herstellungsverfahren dazu |
Country Status (9)
Country | Link |
---|---|
US (2) | US5189777A (de) |
EP (1) | EP0490486B1 (de) |
JP (1) | JP2702025B2 (de) |
KR (1) | KR960011932B1 (de) |
AT (1) | ATE133256T1 (de) |
CA (1) | CA2054668C (de) |
DE (1) | DE69116532T2 (de) |
IL (1) | IL100192A (de) |
MX (1) | MX9102259A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10316777A1 (de) * | 2003-04-11 | 2004-11-04 | Infineon Technologies Ag | Verfahren zum Erzeugen einer Schutzabdeckung für ein Bauelement |
Families Citing this family (122)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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US5589810A (en) * | 1991-03-28 | 1996-12-31 | The Foxboro Company | Semiconductor pressure sensor and related methodology with polysilicon diaphragm and single-crystal gage elements |
US5206983A (en) * | 1991-06-24 | 1993-05-04 | Wisconsin Alumni Research Foundation | Method of manufacturing micromechanical devices |
US5323656A (en) * | 1992-05-12 | 1994-06-28 | The Foxboro Company | Overpressure-protected, polysilicon, capacitive differential pressure sensor and method of making the same |
US5378583A (en) * | 1992-12-22 | 1995-01-03 | Wisconsin Alumni Research Foundation | Formation of microstructures using a preformed photoresist sheet |
US5381386A (en) * | 1993-05-19 | 1995-01-10 | Hewlett-Packard Company | Membrane hydrophone |
US5668579A (en) * | 1993-06-16 | 1997-09-16 | Seiko Epson Corporation | Apparatus for and a method of driving an ink jet head having an electrostatic actuator |
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US5818473A (en) * | 1993-07-14 | 1998-10-06 | Seiko Epson Corporation | Drive method for an electrostatic ink jet head for eliminating residual charge in the diaphragm |
TW293226B (de) * | 1993-07-14 | 1996-12-11 | Seiko Epson Corp | |
US5644341A (en) * | 1993-07-14 | 1997-07-01 | Seiko Epson Corporation | Ink jet head drive apparatus and drive method, and a printer using these |
AU658524B1 (en) * | 1993-08-17 | 1995-04-13 | Yokogawa Electric Corporation | Semiconductor type differential pressure measurement apparatus and method for manufacturing the same |
US20030199179A1 (en) * | 1993-11-16 | 2003-10-23 | Formfactor, Inc. | Contact tip structure for microelectronic interconnection elements and method of making same |
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DE4418163B4 (de) * | 1994-05-25 | 2007-04-05 | Robert Bosch Gmbh | Verfahren zur Herstellung von mikromechanischen Strukturen |
US5705318A (en) * | 1994-06-06 | 1998-01-06 | Case Western Reserve University | Micromotors and methods of fabrication |
US6360424B1 (en) | 1994-06-06 | 2002-03-26 | Case Western Reserve University | Method of making micromotors with utilitarian features |
US6029337A (en) * | 1994-06-06 | 2000-02-29 | Case Western Reserve University | Methods of fabricating micromotors with utilitarian features |
US5788468A (en) * | 1994-11-03 | 1998-08-04 | Memstek Products, Llc | Microfabricated fluidic devices |
US5559280A (en) * | 1994-11-14 | 1996-09-24 | Eaton Corporation | Combustion chamber pressure transducer and method of making same |
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US5644177A (en) * | 1995-02-23 | 1997-07-01 | Wisconsin Alumni Research Foundation | Micromechanical magnetically actuated devices |
US5679502A (en) * | 1995-03-15 | 1997-10-21 | Wisconsin Alumni Research Foundation | Method and apparatus for micromachining using hard X-rays |
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US5866281A (en) * | 1996-11-27 | 1999-02-02 | Wisconsin Alumni Research Foundation | Alignment method for multi-level deep x-ray lithography utilizing alignment holes and posts |
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US5808384A (en) * | 1997-06-05 | 1998-09-15 | Wisconsin Alumni Research Foundation | Single coil bistable, bidirectional micromechanical actuator |
US6203523B1 (en) | 1998-02-02 | 2001-03-20 | Medtronic Inc | Implantable drug infusion device having a flow regulator |
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JP2000022172A (ja) * | 1998-06-30 | 2000-01-21 | Matsushita Electric Ind Co Ltd | 変換装置及びその製造方法 |
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EP1153194B1 (de) | 1999-01-13 | 2003-11-19 | Vermeer Manufacturing Company | Automatisiertes bohrplanungsverfahren und vorrichtung zum horizontalen richtungsbohren |
US6245849B1 (en) | 1999-06-02 | 2001-06-12 | Sandia Corporation | Fabrication of ceramic microstructures from polymer compositions containing ceramic nanoparticles |
US6522762B1 (en) | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
US6315062B1 (en) | 1999-09-24 | 2001-11-13 | Vermeer Manufacturing Company | Horizontal directional drilling machine employing inertial navigation control system and method |
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- 1991-10-31 CA CA002054668A patent/CA2054668C/en not_active Expired - Lifetime
- 1991-11-11 DE DE69116532T patent/DE69116532T2/de not_active Expired - Lifetime
- 1991-11-11 EP EP91310404A patent/EP0490486B1/de not_active Expired - Lifetime
- 1991-11-11 AT AT91310404T patent/ATE133256T1/de not_active IP Right Cessation
- 1991-11-28 MX MX9102259A patent/MX9102259A/es not_active IP Right Cessation
- 1991-11-28 IL IL10019291A patent/IL100192A/en not_active IP Right Cessation
- 1991-12-06 JP JP3322724A patent/JP2702025B2/ja not_active Expired - Lifetime
- 1991-12-06 KR KR1019910022334A patent/KR960011932B1/ko not_active IP Right Cessation
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1992
- 1992-10-05 US US07/957,505 patent/US5357807A/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE10316777A1 (de) * | 2003-04-11 | 2004-11-04 | Infineon Technologies Ag | Verfahren zum Erzeugen einer Schutzabdeckung für ein Bauelement |
DE10316777B4 (de) * | 2003-04-11 | 2005-11-24 | Infineon Technologies Ag | Verfahren zum Erzeugen einer Schutzabdeckung für ein Bauelement |
US7234237B2 (en) | 2003-04-11 | 2007-06-26 | Infineon Technologies Ag | Method for producing a protective cover for a device |
Also Published As
Publication number | Publication date |
---|---|
MX9102259A (es) | 1992-06-01 |
EP0490486A3 (en) | 1993-02-24 |
JPH04294234A (ja) | 1992-10-19 |
US5189777A (en) | 1993-03-02 |
ATE133256T1 (de) | 1996-02-15 |
DE69116532D1 (de) | 1996-02-29 |
KR960011932B1 (ko) | 1996-09-04 |
JP2702025B2 (ja) | 1998-01-21 |
KR920013639A (ko) | 1992-07-29 |
US5357807A (en) | 1994-10-25 |
EP0490486B1 (de) | 1996-01-17 |
CA2054668A1 (en) | 1992-06-08 |
EP0490486A2 (de) | 1992-06-17 |
CA2054668C (en) | 1996-07-02 |
IL100192A (en) | 1994-05-30 |
IL100192A0 (en) | 1992-08-18 |
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