DE69118602T2 - Halbleitervorrichtung bestehend aus mehreren LED-Chips - Google Patents

Halbleitervorrichtung bestehend aus mehreren LED-Chips

Info

Publication number
DE69118602T2
DE69118602T2 DE69118602T DE69118602T DE69118602T2 DE 69118602 T2 DE69118602 T2 DE 69118602T2 DE 69118602 T DE69118602 T DE 69118602T DE 69118602 T DE69118602 T DE 69118602T DE 69118602 T2 DE69118602 T2 DE 69118602T2
Authority
DE
Germany
Prior art keywords
semiconductor device
led chips
device consisting
several led
several
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69118602T
Other languages
English (en)
Other versions
DE69118602D1 (de
Inventor
Nozomu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69118602D1 publication Critical patent/DE69118602D1/de
Application granted granted Critical
Publication of DE69118602T2 publication Critical patent/DE69118602T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
DE69118602T 1990-07-24 1991-07-16 Halbleitervorrichtung bestehend aus mehreren LED-Chips Expired - Fee Related DE69118602T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2195917A JP2535651B2 (ja) 1990-07-24 1990-07-24 半導体装置

Publications (2)

Publication Number Publication Date
DE69118602D1 DE69118602D1 (de) 1996-05-15
DE69118602T2 true DE69118602T2 (de) 1996-09-26

Family

ID=16349134

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69118602T Expired - Fee Related DE69118602T2 (de) 1990-07-24 1991-07-16 Halbleitervorrichtung bestehend aus mehreren LED-Chips

Country Status (5)

Country Link
US (1) US5218233A (de)
EP (1) EP0468341B1 (de)
JP (1) JP2535651B2 (de)
KR (1) KR940003744B1 (de)
DE (1) DE69118602T2 (de)

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JPH0492659U (de) * 1990-12-27 1992-08-12
JP3096824B2 (ja) * 1992-04-17 2000-10-10 ローム株式会社 Ｌｅｄ製造用フレームおよびこれを用いたｌｅｄの製造方法
WO1998042032A1 (fr) * 1997-03-18 1998-09-24 Vladimir Semenovich Abramov Dispositif a diodes electroluminescentes
DE29825022U1 (de) * 1997-07-29 2004-04-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
EP1160881A1 (de) * 2000-05-27 2001-12-05 Mu-Chin Yu Gekapselte, lichtemittierende Diode und Kapselungsverfahren
US7320632B2 (en) * 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
AUPQ818100A0 (en) * 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
US6634779B2 (en) 2001-01-09 2003-10-21 Rpm Optoelectronics, Inc. Method and apparatus for linear led lighting
TW523942B (en) * 2002-03-05 2003-03-11 Hsiu-Hen Chang package socket and package legs structure for LED and manufacturing of the same
KR20080064904A (ko) * 2002-06-14 2008-07-09 레드니엄 테크놀로지 피티와이 리미티드 Ｌｅｄ 패키징 방법 및 패키징된 ｌｅｄ
DE10261365B4 (de) * 2002-12-30 2006-09-28 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer Mehrzahl von strahlungsemittierenden Halbleiterchips
TW200507226A (en) * 2003-03-12 2005-02-16 Lednium Pty Ltd A lamp and a process for producing a lamp
US7053414B2 (en) * 2004-04-12 2006-05-30 Lite-On Technology Corporation Optical semiconductor component to prevent electric leakage and provide different driving voltages
WO2007034537A1 (ja) * 2005-09-20 2007-03-29 Renesas Technology Corp. Ｌｅｄ光源およびその製造方法
JP4983348B2 (ja) * 2007-04-04 2012-07-25 豊田合成株式会社 発光装置
AT506709B1 (de) * 2008-05-30 2009-11-15 Kuster Martin Leuchtmittel
TWI385835B (zh) 2009-10-02 2013-02-11 Everlight Electronics Co Ltd 發光二極體裝置之製造方法
US8853721B2 (en) 2010-03-05 2014-10-07 Willis Electric Co., Ltd. Light-emitting diode with wire-piercing lead frame
US8454186B2 (en) 2010-09-23 2013-06-04 Willis Electric Co., Ltd. Modular lighted tree with trunk electical connectors
US8866708B2 (en) * 2011-01-21 2014-10-21 Peter Sui Lun Fong Light emitting diode switch device and array
US8298633B1 (en) 2011-05-20 2012-10-30 Willis Electric Co., Ltd. Multi-positional, locking artificial tree trunk
US8920002B2 (en) 2011-06-21 2014-12-30 Willis Electric Co., Ltd. Wire-clasping light-emitting diode lights
US8469750B2 (en) 2011-09-22 2013-06-25 Willis Electric Co., Ltd. LED lamp assembly and light strings including a lamp assembly
US9157587B2 (en) 2011-11-14 2015-10-13 Willis Electric Co., Ltd. Conformal power adapter for lighted artificial tree
US8569960B2 (en) 2011-11-14 2013-10-29 Willis Electric Co., Ltd Conformal power adapter for lighted artificial tree
US8876321B2 (en) 2011-12-09 2014-11-04 Willis Electric Co., Ltd. Modular lighted artificial tree
US9044056B2 (en) 2012-05-08 2015-06-02 Willis Electric Co., Ltd. Modular tree with electrical connector
US10206530B2 (en) 2012-05-08 2019-02-19 Willis Electric Co., Ltd. Modular tree with locking trunk
US9572446B2 (en) 2012-05-08 2017-02-21 Willis Electric Co., Ltd. Modular tree with locking trunk and locking electrical connectors
US9179793B2 (en) 2012-05-08 2015-11-10 Willis Electric Co., Ltd. Modular tree with rotation-lock electrical connectors
US9439528B2 (en) 2013-03-13 2016-09-13 Willis Electric Co., Ltd. Modular tree with locking trunk and locking electrical connectors
US9671074B2 (en) 2013-03-13 2017-06-06 Willis Electric Co., Ltd. Modular tree with trunk connectors
US10267464B2 (en) 2015-10-26 2019-04-23 Willis Electric Co., Ltd. Tangle-resistant decorative lighting assembly
US11306881B2 (en) 2013-09-13 2022-04-19 Willis Electric Co., Ltd. Tangle-resistant decorative lighting assembly
US9140438B2 (en) 2013-09-13 2015-09-22 Willis Electric Co., Ltd. Decorative lighting with reinforced wiring
US9157588B2 (en) 2013-09-13 2015-10-13 Willis Electric Co., Ltd Decorative lighting with reinforced wiring
US9894949B1 (en) 2013-11-27 2018-02-20 Willis Electric Co., Ltd. Lighted artificial tree with improved electrical connections
US8870404B1 (en) 2013-12-03 2014-10-28 Willis Electric Co., Ltd. Dual-voltage lighted artificial tree
US9883566B1 (en) 2014-05-01 2018-01-30 Willis Electric Co., Ltd. Control of modular lighted artificial trees
US10683974B1 (en) 2017-12-11 2020-06-16 Willis Electric Co., Ltd. Decorative lighting control

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US3444440A (en) * 1964-11-27 1969-05-13 Motorola Inc Multiple lead semiconductor device with plastic encapsulation supporting such leads and associated elements
US3564352A (en) * 1968-12-30 1971-02-16 Fairchild Camera Instr Co Strip design for a low cost plastic transistor
JPS5263374U (de) * 1975-11-07 1977-05-10
US4375606A (en) * 1978-12-04 1983-03-01 Western Electric Co. Microelectronic device
JPS5866374A (ja) * 1981-10-16 1983-04-20 Toshiba Corp 発光ダイオ−ド
JPS59159577A (ja) * 1983-03-03 1984-09-10 Toshiba Corp 半導体発光表示装置用電極部材およびその製造方法
JPS617673A (ja) * 1984-06-21 1986-01-14 Matsushita Electric Ind Co Ltd リ−ドフレ−ム
JPS61139079A (ja) * 1984-12-11 1986-06-26 Toshiba Corp 半導体発光表示装置
CA1246755A (en) * 1985-03-30 1988-12-13 Akira Miyauchi Semiconductor device
EP0243411B1 (de) * 1985-10-29 1992-06-17 HOPPER, William R. Tastungsempfindliche anzeigeleuchte
JPS6431473A (en) * 1987-07-27 1989-02-01 Sharp Kk 2-color light emitting element

Also Published As

Publication number Publication date
JPH0482279A (ja) 1992-03-16
DE69118602D1 (de) 1996-05-15
JP2535651B2 (ja) 1996-09-18
EP0468341A1 (de) 1992-01-29
EP0468341B1 (de) 1996-04-10
KR940003744B1 (ko) 1994-04-28
KR920003567A (ko) 1992-02-29
US5218233A (en) 1993-06-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee