DE69129185D1 - Verfahren zum anbringen metallisierter kontakte an solarzellen - Google Patents

Verfahren zum anbringen metallisierter kontakte an solarzellen

Info

Publication number
DE69129185D1
DE69129185D1 DE69129185T DE69129185T DE69129185D1 DE 69129185 D1 DE69129185 D1 DE 69129185D1 DE 69129185 T DE69129185 T DE 69129185T DE 69129185 T DE69129185 T DE 69129185T DE 69129185 D1 DE69129185 D1 DE 69129185D1
Authority
DE
Germany
Prior art keywords
attaching
solar cells
metalized contacts
metalized
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69129185T
Other languages
English (en)
Other versions
DE69129185T2 (de
Inventor
Frank Bottari
Jack Hanoka
Frank Sylva
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott Solar CSP Inc
Original Assignee
ASE Americas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASE Americas Inc filed Critical ASE Americas Inc
Application granted granted Critical
Publication of DE69129185D1 publication Critical patent/DE69129185D1/de
Publication of DE69129185T2 publication Critical patent/DE69129185T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/00013—Fully indexed content
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01014—Silicon [Si]
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    • H01L2924/01067—Holmium [Ho]
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    • H01L2924/01073—Tantalum [Ta]
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    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/01079—Gold [Au]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
DE69129185T 1990-08-01 1991-07-01 Verfahren zum anbringen metallisierter kontakte an solarzellen Expired - Lifetime DE69129185T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/561,101 US5151386A (en) 1990-08-01 1990-08-01 Method of applying metallized contacts to a solar cell
PCT/US1991/004670 WO1992002952A1 (en) 1990-08-01 1991-07-01 Method of applying metallized contacts to a solar cell

Publications (2)

Publication Number Publication Date
DE69129185D1 true DE69129185D1 (de) 1998-05-07
DE69129185T2 DE69129185T2 (de) 1998-10-22

Family

ID=24240640

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69129185T Expired - Lifetime DE69129185T2 (de) 1990-08-01 1991-07-01 Verfahren zum anbringen metallisierter kontakte an solarzellen

Country Status (7)

Country Link
US (1) US5151386A (de)
EP (1) EP0495035B1 (de)
JP (1) JP2831130B2 (de)
AU (2) AU643550B2 (de)
CA (1) CA2065871A1 (de)
DE (1) DE69129185T2 (de)
WO (1) WO1992002952A1 (de)

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US5411897A (en) * 1994-02-04 1995-05-02 Mobil Solar Energy Corporation Machine and method for applying solder paste to electronic devices such as solar cells
US5478402A (en) * 1994-02-17 1995-12-26 Ase Americas, Inc. Solar cell modules and method of making same
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US5904504A (en) * 1998-02-19 1999-05-18 Fairchild Semiconductor Corp. Die attach method and integrated circuit device
US6024099A (en) * 1998-05-13 2000-02-15 Fashion Nails, Inc. Apparatus for creating art on an object such as the nail of a person's digit or a golf ball and method for making same
US5988179A (en) 1998-04-08 1999-11-23 Fashion Nails, Inc. Method and machine for creating nail art on person's digit
US6029673A (en) * 1998-02-26 2000-02-29 Fashion Nails, Inc. Method and apparatus for creating art on a person's fingernail or toenail
US5960798A (en) * 1998-02-26 1999-10-05 Fashion Nails, Inc. Method and apparatus for creating art on an object such as a person's fingernail or toenail
DE19851703A1 (de) * 1998-10-30 2000-05-04 Inst Halbleiterphysik Gmbh Verfahren zur Herstellung von elektronischen Strukturen
US6129012A (en) * 1999-02-03 2000-10-10 Illinois Tool Works Inc. Ink cups for pad printing machines
US6641860B1 (en) 2000-01-03 2003-11-04 T-Ink, L.L.C. Method of manufacturing printed circuit boards
EP1321446A1 (de) 2001-12-20 2003-06-25 RWE Solar GmbH Verfahren zum Ausbilden einer Schichtstruktur auf einem Substrat
NO20026107L (no) * 2001-12-20 2003-06-23 Rwe Schott Solar Gmbh Fremgangsmåte for dannelse av en sjiktstruktur på et substrat
JP2004358931A (ja) * 2003-06-09 2004-12-24 Kanji Maruyama パッドによるｕｖ印刷システム
US6983688B1 (en) * 2003-08-26 2006-01-10 The Gem Group, Inc. Decoration for bags and cases and method for applying the same
JP3926822B2 (ja) * 2005-02-03 2007-06-06 三菱電機株式会社 半導体装置及び半導体装置の製造方法
US7686563B2 (en) * 2007-08-23 2010-03-30 1708828 Ontario Ltd. O/A Horst Welding Coupling apparatus for releasably coupling hydraulically powered work implements to a work vehicle
US7927976B2 (en) * 2008-07-23 2011-04-19 Semprius, Inc. Reinforced composite stamp for dry transfer printing of semiconductor elements
US8506867B2 (en) * 2008-11-19 2013-08-13 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
US8222514B2 (en) 2009-04-28 2012-07-17 7Ac Technologies, Inc. Backskin material for solar energy modules
US7910393B2 (en) * 2009-06-17 2011-03-22 Innovalight, Inc. Methods for forming a dual-doped emitter on a silicon substrate with a sub-critical shear thinning nanoparticle fluid
DE102009026027B4 (de) * 2009-06-24 2013-05-29 Hanwha Q.CELLS GmbH Wafersolarzelle
US8261660B2 (en) * 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
DE102010006329A1 (de) * 2010-01-29 2011-08-04 RENA GmbH, 78148 Verwendung einer Auftragswalze zum strukturierten Auftragen eines Ätz- oder Dotiermediums sowie Auftragswalze
CN101880914B (zh) * 2010-05-25 2012-09-12 中国科学院微电子研究所 利用等离子体浸没离子注入制备黑硅的方法
WO2012083082A1 (en) * 2010-12-15 2012-06-21 Sun Chemical Corporation Printable etchant compositions for etching silver nanoware-based transparent, conductive film
KR20120073615A (ko) * 2010-12-27 2012-07-05 삼성전자주식회사 국소 영역 인쇄장치 및 방법
ITUD20110171A1 (it) * 2011-10-24 2013-04-25 Applied Materials Italia Srl Metodo ed impianto di controllo in retroazione ad anello chiuso per la stampa di uno schema multistrato
JP2014095937A (ja) * 2012-11-07 2014-05-22 Toyoda Gosei Co Ltd タッチパネル装置の製造方法
JP6050661B2 (ja) * 2012-11-21 2016-12-21 長州産業株式会社 光発電装置の製造方法
US10132453B2 (en) 2016-08-23 2018-11-20 Orsam Sylvania Inc. Flexible light engine with bus bars and interconnectors
FR3084663B1 (fr) * 2018-07-31 2020-07-17 Saint-Gobain Glass France Procede et installation de primage de vitrage par tampographie mettant en oeuvre un solvant a base d'eau.

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LU83831A1 (fr) * 1981-12-10 1983-09-01 Belge Etat Procede de fabrication de dispositifs semi-conducteurs et dispositifs semi-conducteurs ainsi obtenus
DE3328869A1 (de) * 1983-08-10 1985-02-28 Nukem Gmbh, 6450 Hanau Photovoltaische zelle und verfahren zum herstellen dieser
JPS6249676A (ja) * 1985-08-29 1987-03-04 Sharp Corp 太陽電池
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Also Published As

Publication number Publication date
DE69129185T2 (de) 1998-10-22
JP2831130B2 (ja) 1998-12-02
EP0495035B1 (de) 1998-04-01
AU8228691A (en) 1992-03-02
EP0495035A4 (en) 1993-10-20
WO1992002952A1 (en) 1992-02-20
EP0495035A1 (de) 1992-07-22
AU5050193A (en) 1994-01-13
CA2065871A1 (en) 1992-02-02
AU643550B2 (en) 1993-11-18
US5151386A (en) 1992-09-29
JPH05502759A (ja) 1993-05-13

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