DE69130035T2 - Mehrkanalvorrichtung und Verfahren zur Wahrnehmung des Prozessendpunktes in einer Plasmaentladung - Google Patents
Mehrkanalvorrichtung und Verfahren zur Wahrnehmung des Prozessendpunktes in einer PlasmaentladungInfo
- Publication number
- DE69130035T2 DE69130035T2 DE69130035T DE69130035T DE69130035T2 DE 69130035 T2 DE69130035 T2 DE 69130035T2 DE 69130035 T DE69130035 T DE 69130035T DE 69130035 T DE69130035 T DE 69130035T DE 69130035 T2 DE69130035 T2 DE 69130035T2
- Authority
- DE
- Germany
- Prior art keywords
- perceiving
- end point
- plasma discharge
- channel device
- process end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/528,297 US5160402A (en) | 1990-05-24 | 1990-05-24 | Multi-channel plasma discharge endpoint detection method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69130035D1 DE69130035D1 (de) | 1998-10-01 |
DE69130035T2 true DE69130035T2 (de) | 1999-05-12 |
Family
ID=24105079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69130035T Expired - Fee Related DE69130035T2 (de) | 1990-05-24 | 1991-05-23 | Mehrkanalvorrichtung und Verfahren zur Wahrnehmung des Prozessendpunktes in einer Plasmaentladung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5160402A (de) |
EP (1) | EP0458324B1 (de) |
JP (1) | JP2501674B2 (de) |
KR (1) | KR100228823B1 (de) |
DE (1) | DE69130035T2 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5208644A (en) * | 1990-05-18 | 1993-05-04 | Xinix, Inc. | Interference removal |
US5841651A (en) * | 1992-11-09 | 1998-11-24 | The United States Of America As Represented By The United States Department Of Energy | Closed loop adaptive control of spectrum-producing step using neural networks |
US5308414A (en) * | 1992-12-23 | 1994-05-03 | International Business Machines Corporation | Method and apparatus for optical emission end point detection in plasma etching processes |
US5288367A (en) * | 1993-02-01 | 1994-02-22 | International Business Machines Corporation | End-point detection |
US5565114A (en) * | 1993-03-04 | 1996-10-15 | Tokyo Electron Limited | Method and device for detecting the end point of plasma process |
EP0662241A1 (de) * | 1993-04-28 | 1995-07-12 | Applied Materials, Inc. | Verfahren und vorrichtung zur endpunktdetektion beim rueckaetzen |
US5405488A (en) * | 1993-09-13 | 1995-04-11 | Vlsi Technology, Inc. | System and method for plasma etching endpoint detection |
JP3577163B2 (ja) * | 1995-05-19 | 2004-10-13 | エイ・ティ・アンド・ティ・コーポレーション | アクティブ・ニューラル・ネットワークによるプラズマ・エッチング・プロセスの終点の決定 |
US5738756A (en) * | 1995-06-30 | 1998-04-14 | Lam Research Corporation | Method and apparatus for detecting optimal endpoints in plasma etch processes |
US6649075B1 (en) * | 1996-07-23 | 2003-11-18 | Applied Materials, Inc. | Method and apparatus for measuring etch uniformity of a semiconductor wafer |
US6406641B1 (en) | 1997-06-17 | 2002-06-18 | Luxtron Corporation | Liquid etch endpoint detection and process metrology |
US6534007B1 (en) * | 1997-08-01 | 2003-03-18 | Applied Komatsu Technology, Inc. | Method and apparatus for detecting the endpoint of a chamber cleaning |
EP1018088A4 (de) | 1997-09-17 | 2006-08-16 | Tokyo Electron Ltd | Vorrichtung und verfahren zur überwachung und regelung von gas plasma prozessen |
US6021215A (en) * | 1997-10-10 | 2000-02-01 | Lucent Technologies, Inc. | Dynamic data visualization |
US6153115A (en) * | 1997-10-23 | 2000-11-28 | Massachusetts Institute Of Technology | Monitor of plasma processes with multivariate statistical analysis of plasma emission spectra |
US6535779B1 (en) | 1998-03-06 | 2003-03-18 | Applied Materials, Inc. | Apparatus and method for endpoint control and plasma monitoring |
US6090302A (en) * | 1998-04-23 | 2000-07-18 | Sandia | Method and apparatus for monitoring plasma processing operations |
US6223755B1 (en) * | 1998-04-23 | 2001-05-01 | Sandia Corporation | Method and apparatus for monitoring plasma processing operations |
US6419801B1 (en) * | 1998-04-23 | 2002-07-16 | Sandia Corporation | Method and apparatus for monitoring plasma processing operations |
US6165312A (en) * | 1998-04-23 | 2000-12-26 | Sandia Corporation | Method and apparatus for monitoring plasma processing operations |
US5964980A (en) * | 1998-06-23 | 1999-10-12 | Vlsi Technology, Inc. | Fitted endpoint system |
WO2000003421A2 (en) * | 1998-07-10 | 2000-01-20 | Applied Materials, Inc. | Improved endpoint detection for substrate fabrication processes |
JP4051470B2 (ja) * | 1999-05-18 | 2008-02-27 | 東京エレクトロン株式会社 | 終点検出方法 |
US6420194B1 (en) | 1999-10-12 | 2002-07-16 | Lucent Technologies Inc. | Method for extracting process determinant conditions from a plurality of process signals |
KR20020001351A (ko) * | 2000-06-28 | 2002-01-09 | 황인길 | 플라스마 모니터 장치 |
JP2004505273A (ja) | 2000-08-01 | 2004-02-19 | ボード・オブ・リージエンツ,ザ・ユニバーシテイ・オブ・テキサス・システム | 転写リソグラフィのための透明テンプレートと基板の間のギャップおよび配向を高精度でセンシングするための方法 |
US6831742B1 (en) | 2000-10-23 | 2004-12-14 | Applied Materials, Inc | Monitoring substrate processing using reflected radiation |
US6633391B1 (en) | 2000-11-07 | 2003-10-14 | Applied Materials, Inc | Monitoring of film characteristics during plasma-based semi-conductor processing using optical emission spectroscopy |
US6603538B1 (en) | 2000-11-21 | 2003-08-05 | Applied Materials, Inc. | Method and apparatus employing optical emission spectroscopy to detect a fault in process conditions of a semiconductor processing system |
US6538734B2 (en) * | 2000-11-29 | 2003-03-25 | Lightwind Corporation | Method and device utilizing real-time gas sampling |
US6588007B1 (en) * | 2001-01-03 | 2003-07-01 | Advanced Micro Devices, Inc. | Use of endpoint system to match individual processing stations within a tool |
US6618130B2 (en) | 2001-08-28 | 2003-09-09 | Speedfam-Ipec Corporation | Method and apparatus for optical endpoint detection during chemical mechanical polishing |
JP4574422B2 (ja) * | 2001-11-29 | 2010-11-04 | 株式会社日立ハイテクノロジーズ | 発光分光処理装置 |
US6830939B2 (en) * | 2002-08-28 | 2004-12-14 | Verity Instruments, Inc. | System and method for determining endpoint in etch processes using partial least squares discriminant analysis in the time domain of optical emission spectra |
DE10241590A1 (de) | 2002-09-05 | 2004-03-18 | Infineon Technologies Ag | Verfahren zur Bestimmung des Endpunktes beim Reinigungsätzen |
US8349241B2 (en) | 2002-10-04 | 2013-01-08 | Molecular Imprints, Inc. | Method to arrange features on a substrate to replicate features having minimal dimensional variability |
US6969619B1 (en) | 2003-02-18 | 2005-11-29 | Novellus Systems, Inc. | Full spectrum endpoint detection |
DE10310524A1 (de) * | 2003-03-11 | 2004-09-23 | Micronas Gmbh | Verfahren zum Ätzen einer Probe sowie Ätzanlage |
US7101805B2 (en) * | 2003-05-09 | 2006-09-05 | Unaxis Usa Inc. | Envelope follower end point detection in time division multiplexed processes |
US20060006139A1 (en) * | 2003-05-09 | 2006-01-12 | David Johnson | Selection of wavelengths for end point in a time division multiplexed process |
US7314537B2 (en) * | 2003-09-30 | 2008-01-01 | Tokyo Electron Limited | Method and apparatus for detecting a plasma |
US7785526B2 (en) | 2004-07-20 | 2010-08-31 | Molecular Imprints, Inc. | Imprint alignment method, system, and template |
US20070231421A1 (en) | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Enhanced Multi Channel Alignment |
US7630067B2 (en) | 2004-11-30 | 2009-12-08 | Molecular Imprints, Inc. | Interferometric analysis method for the manufacture of nano-scale devices |
US7534469B2 (en) * | 2005-03-31 | 2009-05-19 | Asm Japan K.K. | Semiconductor-processing apparatus provided with self-cleaning device |
US7479191B1 (en) | 2005-04-22 | 2009-01-20 | Novellus Systems, Inc. | Method for endpointing CVD chamber cleans following ultra low-k film treatments |
US8262800B1 (en) | 2008-02-12 | 2012-09-11 | Novellus Systems, Inc. | Methods and apparatus for cleaning deposition reactors |
US9997325B2 (en) | 2008-07-17 | 2018-06-12 | Verity Instruments, Inc. | Electron beam exciter for use in chemical analysis in processing systems |
US8591659B1 (en) | 2009-01-16 | 2013-11-26 | Novellus Systems, Inc. | Plasma clean method for deposition chamber |
KR20150031782A (ko) * | 2013-09-16 | 2015-03-25 | 삼성전자주식회사 | 플라즈마 특성을 모니터링하는 웨이퍼 형태의 진단 기구 및 이를 이용하는 진단 시스템 |
CN116157901A (zh) * | 2021-07-14 | 2023-05-23 | 株式会社日立高新技术 | 等离子处理装置、数据解析装置以及半导体装置制造系统 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4312732A (en) * | 1976-08-31 | 1982-01-26 | Bell Telephone Laboratories, Incorporated | Method for the optical monitoring of plasma discharge processing operations |
US4207137A (en) * | 1979-04-13 | 1980-06-10 | Bell Telephone Laboratories, Incorporated | Method of controlling a plasma etching process by monitoring the impedance changes of the RF power |
JPS5879722A (ja) * | 1981-11-06 | 1983-05-13 | Fujitsu Ltd | プラズマエツチングの制御方法 |
JPS5941475A (ja) * | 1982-09-02 | 1984-03-07 | Ulvac Corp | 放電処理装置における放電状態監視装置 |
JPH0722151B2 (ja) * | 1984-05-23 | 1995-03-08 | 株式会社日立製作所 | エツチングモニタ−方法 |
JPS60253228A (ja) * | 1984-05-30 | 1985-12-13 | Hitachi Ltd | エツチングモニタ−方法 |
US4695700A (en) * | 1984-10-22 | 1987-09-22 | Texas Instruments Incorporated | Dual detector system for determining endpoint of plasma etch process |
US4615761A (en) * | 1985-03-15 | 1986-10-07 | Hitachi, Ltd. | Method of and apparatus for detecting an end point of plasma treatment |
JPH0774466B2 (ja) * | 1986-04-16 | 1995-08-09 | 日新電機株式会社 | エツチング装置 |
JPS635529A (ja) * | 1986-06-25 | 1988-01-11 | Sharp Corp | エツチング終点検出装置 |
US4720628A (en) * | 1986-10-27 | 1988-01-19 | Tegal Corporation | Optical process for determining the endpoint of a process via analog multiplication of photocell signals |
JPS63128718A (ja) * | 1986-11-19 | 1988-06-01 | Seiko Epson Corp | 半導体製造装置 |
JPS63244847A (ja) * | 1987-03-31 | 1988-10-12 | Anelva Corp | ドライエッチング終点検出方法 |
US4846920A (en) * | 1987-12-09 | 1989-07-11 | International Business Machine Corporation | Plasma amplified photoelectron process endpoint detection apparatus |
US5045149A (en) * | 1988-10-24 | 1991-09-03 | Vlsi Technology, Inc. | Method and apparatus for end point detection |
JPH0263535U (de) * | 1988-11-01 | 1990-05-11 | ||
JPH03181129A (ja) * | 1989-12-11 | 1991-08-07 | Sumitomo Metal Ind Ltd | エッチングの終点検知方法 |
JP3288764B2 (ja) * | 1992-09-25 | 2002-06-04 | キヤノン株式会社 | 画像処理装置およびその方法 |
JPH06118133A (ja) * | 1992-10-05 | 1994-04-28 | Matsushita Electric Ind Co Ltd | Lsiのテスト方法 |
JPH06324487A (ja) * | 1993-05-11 | 1994-11-25 | Nippon Kayaku Co Ltd | 感光性樹脂組成物及びその硬化物 |
-
1990
- 1990-05-24 US US07/528,297 patent/US5160402A/en not_active Expired - Lifetime
-
1991
- 1991-05-20 JP JP3113631A patent/JP2501674B2/ja not_active Expired - Fee Related
- 1991-05-23 DE DE69130035T patent/DE69130035T2/de not_active Expired - Fee Related
- 1991-05-23 EP EP91108332A patent/EP0458324B1/de not_active Revoked
- 1991-05-24 KR KR1019910008411A patent/KR100228823B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2501674B2 (ja) | 1996-05-29 |
EP0458324A2 (de) | 1991-11-27 |
JPH04229620A (ja) | 1992-08-19 |
KR100228823B1 (ko) | 1999-12-01 |
KR910020202A (ko) | 1991-12-19 |
US5160402A (en) | 1992-11-03 |
EP0458324A3 (en) | 1992-01-02 |
EP0458324B1 (de) | 1998-08-26 |
DE69130035D1 (de) | 1998-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8339 | Ceased/non-payment of the annual fee |