DE69200653D1 - Verfahren zur Herstellung von Matrizen. - Google Patents

Verfahren zur Herstellung von Matrizen.

Info

Publication number
DE69200653D1
DE69200653D1 DE69200653T DE69200653T DE69200653D1 DE 69200653 D1 DE69200653 D1 DE 69200653D1 DE 69200653 T DE69200653 T DE 69200653T DE 69200653 T DE69200653 T DE 69200653T DE 69200653 D1 DE69200653 D1 DE 69200653D1
Authority
DE
Germany
Prior art keywords
matrices
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69200653T
Other languages
English (en)
Other versions
DE69200653T2 (de
Inventor
Yozaburo Hanada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of DE69200653D1 publication Critical patent/DE69200653D1/de
Application granted granted Critical
Publication of DE69200653T2 publication Critical patent/DE69200653T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/28Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
    • B23P15/40Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools
    • B23P15/406Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools rotary or plane die cutters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/24Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • C23F1/04Chemical milling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
DE69200653T 1991-08-09 1992-08-07 Verfahren zur Herstellung von Matrizen. Expired - Lifetime DE69200653T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3200914A JP2677466B2 (ja) 1991-08-09 1991-08-09 抜き型の製造方法および抜き型

Publications (2)

Publication Number Publication Date
DE69200653D1 true DE69200653D1 (de) 1994-12-15
DE69200653T2 DE69200653T2 (de) 1995-05-04

Family

ID=16432377

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69200653T Expired - Lifetime DE69200653T2 (de) 1991-08-09 1992-08-07 Verfahren zur Herstellung von Matrizen.

Country Status (6)

Country Link
US (1) US5248383A (de)
EP (1) EP0527616B1 (de)
JP (1) JP2677466B2 (de)
KR (1) KR950012423B1 (de)
DE (1) DE69200653T2 (de)
DK (1) DK0527616T3 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9303985D0 (en) * 1993-02-26 1993-04-14 Bartholomew Richard S Surgical cutting tool
JP3477254B2 (ja) * 1994-09-19 2003-12-10 株式会社タカノ機械製作所 抜き型の製造方法および抜き型
NL1021274C2 (nl) * 2002-08-14 2004-02-17 Cemtex B V Werkwijze voor het vervaardigen van een roteerbaar gereedschap voor het snijden of bedrukken van papier, karton en dergelijke.
EP1648653A1 (de) * 2003-07-17 2006-04-26 Ellison Educational Equipment, Inc. Verfahren zur herstellung einer in einer presse zu verwendenden dünnen matrize
US20100140212A1 (en) * 2008-12-10 2010-06-10 King-Yeung Li Process for preparing grating tools
CN102517583A (zh) * 2012-01-17 2012-06-27 毕广杰 一种快速切割图案的刀模的制作方法
US9150998B2 (en) * 2013-08-29 2015-10-06 J. Michael Dywan Method and apparatus for producing detailed fabric applique
CN107379116B (zh) * 2017-08-30 2019-04-02 郑州华美彩印纸品有限公司 一种模切刀版的制作工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3045321A (en) * 1955-04-15 1962-07-24 Buckbee Mears Co Abrading devices and method of making them
US3758350A (en) * 1971-05-21 1973-09-11 Jerobee Ind Inc Method of making a die for stamping out circuit boards
US4053348A (en) * 1976-06-16 1977-10-11 Jerobee Industries, Inc. Die and method of making the same
US4264410A (en) * 1978-08-16 1981-04-28 Minnesota Micro Metal, Inc. Method of making an abrading material
JPS5690977A (en) * 1979-12-20 1981-07-23 Fujikura Ltd Manufacture of blanking die for pattern
DE3047886A1 (de) * 1979-12-20 1981-10-29 The Fujikura Cable Works, Ltd., Tokyo Verfahren zur herstellung eines stanzwerkzeugs und nach diesem verfahren hergestelltes stanzwerkzeug
US4437924A (en) * 1982-04-19 1984-03-20 Jerobee Industries, Inc. Method of making fine-line die
DE69111002T2 (de) * 1990-09-20 1995-11-02 Dainippon Screen Mfg Verfahren zur Herstellung von kleinen Durchgangslöchern in dünne Metallplatten.

Also Published As

Publication number Publication date
KR930003988A (ko) 1993-03-22
DE69200653T2 (de) 1995-05-04
JP2677466B2 (ja) 1997-11-17
KR950012423B1 (ko) 1995-10-17
JPH0544061A (ja) 1993-02-23
EP0527616B1 (de) 1994-11-09
DK0527616T3 (da) 1994-12-05
US5248383A (en) 1993-09-28
EP0527616A1 (de) 1993-02-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8330 Complete disclaimer